SG11201902595UA - A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method - Google Patents
A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said methodInfo
- Publication number
- SG11201902595UA SG11201902595UA SG11201902595UA SG11201902595UA SG11201902595UA SG 11201902595U A SG11201902595U A SG 11201902595UA SG 11201902595U A SG11201902595U A SG 11201902595UA SG 11201902595U A SG11201902595U A SG 11201902595UA SG 11201902595U A SG11201902595U A SG 11201902595UA
- Authority
- SG
- Singapore
- Prior art keywords
- erasmusstrabe
- berlin
- tin layer
- atotech
- depositing
- Prior art date
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title abstract 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title abstract 7
- 238000000034 method Methods 0.000 title abstract 7
- 238000000151 deposition Methods 0.000 title abstract 6
- 239000000758 substrate Substances 0.000 title abstract 5
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 title abstract 4
- 239000002184 metal Substances 0.000 title abstract 4
- 229910052751 metal Inorganic materials 0.000 title abstract 4
- 229910052759 nickel Inorganic materials 0.000 title abstract 4
- 229910045601 alloy Inorganic materials 0.000 title abstract 3
- 239000000956 alloy Substances 0.000 title abstract 3
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 229910002091 carbon monoxide Inorganic materials 0.000 abstract 1
- 239000010520 ghee Substances 0.000 abstract 1
- 229910001092 metal group alloy Inorganic materials 0.000 abstract 1
- 230000008520 organization Effects 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electroplating Methods And Accessories (AREA)
- Rolls And Other Rotary Bodies (AREA)
Abstract
INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property MD 1101111 0 DOI HIM 0111 110 1 0 0111111111H111111111111111111111111111111111 Organization International Bureau (10) International Publication Number (43) International Publication Date .....0\"\"\") WO 2018/077874 Al 03 May 2018 (03.05.2018) WI P0 I P C T — (51) (21) (22) (25) Filing Language: (26) (30) (71) (72) International Patent Classification: Berlin (DE). RUTHER, Robert; c/o Atotech Deutsch- C25D 5/18 (2006.01) H01R 13/03 (2006.01) land GmbH, Patent Management, ErasmusstraBe 20, C25D 5/14 (2006.01) C25D 5/12 (2006.01) 10553 Berlin (DE). BARTHELMES, Jurgen; c/o Atotech C23C 18/16 (2006.01) Deutschland GmbH, Patent Management, ErasmusstraBe International Application Number: 20, 10553 Berlin (DE). KURTZ, Olaf; c/o Atotech PCT/EP2017/077156 Deutschland GmbH, Patent Management, ErasmusstraBe 20, 10553 Berlin (DE). International Filing Date: (74) Agent: SCHULZ, Hendrik; c/o Atotech Deutschland 24 October 2017 (24.10.2017) GmbH, Patent Management, ErasmusstraBe 20, 10553 English Berlin (DE). Publication Language: English (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, Priority Data: AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, 16195351.8 24 October 2016 (24.10.2016) EP CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, Applicant: ATOTECH DEUTSCHLAND GMBH DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, [DE/DE]; ErasmusstraBe 20, 10553 Berlin (DE). HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, Inventors: NEOH, Din-Ghee; c/o Atotech Deutschland MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, GmbH, Patent Management, ErasmusstraBe 20, 10553 OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, Berlin (DE). TAN, Chee-Chow; c/o Atotech Deutsch-SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, land GmbH, Patent Management, ErasmusstraBe 20, 10553 TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. Berlin (DE). LIM, Jen Joo; c/o Atotech Deutschland GmbH, Patent Management, ErasmusstraBe 20, 10553 —TR, = = Title: A METHOD : To achieve is devised, on at least depositing said tin layer comprising using a pulse plating method. PRISING A NICKEL/PHOSPHOROUS ALLOY UNDERLAYER AND SAID TIN LAYER WITH SAID METHOD ce) _ = ---.. substrate GC underlayer OF DEPOSITING A TIN LAYER ON A METAL SUBSTRATE AND A USE OF A Figure 4 STRUCTURE COM- a tin layer on a metal alloy alloy underlayer = (54) = = — 3 E ...c 46 25 C lu 20 tIO E- 15 ,.. n -1. i .....0 J c c co -' a) 30 . Example _ = = — 5 8 = = = _ 9 = - = 1-1 ii- IN cc IN IN (57) 0 1-1 © by N 6 7A 7B tin deposits being largely free of pressure induced whiskers, a method of depositing wherein said method comprises: (a) providing said metal substrate; (b) depositing a nickel/phosphorous one surface of said metal substrate; and (c) depositing said tin layer on said nickel/phosphorous C [Continued on next page] WO 2018/077874 Al MIDEDIMOMOIDEIREIDIONOMMOHOHNEVOIS (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP16195351 | 2016-10-24 | ||
| PCT/EP2017/077156 WO2018077874A1 (en) | 2016-10-24 | 2017-10-24 | A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201902595UA true SG11201902595UA (en) | 2019-05-30 |
Family
ID=57211308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201902595UA SG11201902595UA (en) | 2016-10-24 | 2017-10-24 | A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20190271093A1 (en) |
| EP (1) | EP3529398B1 (en) |
| JP (1) | JP6990240B2 (en) |
| KR (1) | KR102404045B1 (en) |
| CN (1) | CN109844182A (en) |
| MY (1) | MY192687A (en) |
| SG (1) | SG11201902595UA (en) |
| WO (1) | WO2018077874A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7121881B2 (en) * | 2017-08-08 | 2022-08-19 | 三菱マテリアル株式会社 | Terminal material with silver film and terminal with silver film |
| EP3931373A1 (en) * | 2019-02-25 | 2022-01-05 | Tata Steel IJmuiden B.V. | Method for electrolytically depositing a chromium oxide layer |
| US11306409B2 (en) | 2019-05-23 | 2022-04-19 | Ag-Nano System Llc | Method to enable electroplating of golden silver nanoparticles |
| JP2023075905A (en) * | 2021-11-19 | 2023-05-31 | 千住金属工業株式会社 | Metallic body, formation method of metallic body, and mating type connection terminal comprising metallic body |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58221291A (en) * | 1982-06-16 | 1983-12-22 | Furukawa Electric Co Ltd:The | Silver coated copper material for electrical connection |
| JPH0790675A (en) * | 1993-09-21 | 1995-04-04 | Murata Mfg Co Ltd | Production of electronic parts |
| US5750017A (en) * | 1996-08-21 | 1998-05-12 | Lucent Technologies Inc. | Tin electroplating process |
| US6361823B1 (en) | 1999-12-03 | 2002-03-26 | Atotech Deutschland Gmbh | Process for whisker-free aqueous electroless tin plating |
| CN1407141A (en) * | 2001-03-16 | 2003-04-02 | 希普雷公司 | Tinplating |
| US20020185716A1 (en) | 2001-05-11 | 2002-12-12 | Abys Joseph Anthony | Metal article coated with multilayer finish inhibiting whisker growth |
| DE10132478C1 (en) * | 2001-07-03 | 2003-04-30 | Atotech Deutschland Gmbh | Process for depositing a metal layer and process for regenerating a solution containing metal ions in a high oxidation state |
| JP2005109373A (en) * | 2003-10-02 | 2005-04-21 | Fuji Electric Device Technology Co Ltd | Semiconductor device |
| JP4894304B2 (en) | 2005-03-28 | 2012-03-14 | ソニー株式会社 | Lead-free Sn base plating film and contact structure of connecting parts |
| WO2007002424A1 (en) | 2005-06-24 | 2007-01-04 | Technic, Inc. | Silver barrier layer to minimize whisker growth in tin electrodeposits |
| JP2007284762A (en) | 2006-04-18 | 2007-11-01 | Sumitomo Metal Mining Co Ltd | Method for forming tin-plated film, and semiconductor device |
| JP4847898B2 (en) * | 2007-03-07 | 2011-12-28 | 日立電線株式会社 | Wiring conductor and method for manufacturing the same |
| ES2574561T3 (en) | 2007-07-10 | 2016-06-20 | Atotech Deutschland Gmbh | Solution and process to increase the weldability and corrosion resistance of the surface of a metal or metal alloy |
| JP5086485B1 (en) | 2011-09-20 | 2012-11-28 | Ｊｘ日鉱日石金属株式会社 | Metal material for electronic parts and method for producing the same |
-
2017
- 2017-10-24 CN CN201780065970.1A patent/CN109844182A/en active Pending
- 2017-10-24 KR KR1020197014365A patent/KR102404045B1/en active IP Right Grant
- 2017-10-24 EP EP17787197.7A patent/EP3529398B1/en active Active
- 2017-10-24 US US16/344,031 patent/US20190271093A1/en not_active Abandoned
- 2017-10-24 SG SG11201902595UA patent/SG11201902595UA/en unknown
- 2017-10-24 JP JP2019521768A patent/JP6990240B2/en active Active
- 2017-10-24 MY MYPI2019001970A patent/MY192687A/en unknown
- 2017-10-24 WO PCT/EP2017/077156 patent/WO2018077874A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190070958A (en) | 2019-06-21 |
| US20190271093A1 (en) | 2019-09-05 |
| EP3529398A1 (en) | 2019-08-28 |
| KR102404045B1 (en) | 2022-05-30 |
| CN109844182A (en) | 2019-06-04 |
| JP2019533088A (en) | 2019-11-14 |
| MY192687A (en) | 2022-09-01 |
| WO2018077874A1 (en) | 2018-05-03 |
| JP6990240B2 (en) | 2022-01-12 |
| EP3529398B1 (en) | 2022-10-19 |
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