SG11201901931UA - A method of forming nano-patterns on a substrate - Google Patents
A method of forming nano-patterns on a substrateInfo
- Publication number
- SG11201901931UA SG11201901931UA SG11201901931UA SG11201901931UA SG11201901931UA SG 11201901931U A SG11201901931U A SG 11201901931UA SG 11201901931U A SG11201901931U A SG 11201901931UA SG 11201901931U A SG11201901931U A SG 11201901931UA SG 11201901931U A SG11201901931U A SG 11201901931UA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- forming
- nanostructures
- international
- innovis
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 15
- 238000000034 method Methods 0.000 title abstract 5
- 239000002086 nanomaterial Substances 0.000 abstract 6
- 238000013500 data storage Methods 0.000 abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 239000003989 dielectric material Substances 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 230000008520 organization Effects 0.000 abstract 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/118—Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00031—Regular or irregular arrays of nanoscale structures, e.g. etch mask layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00388—Etch mask forming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/113—Anti-reflection coatings using inorganic layer materials only
- G02B1/115—Multilayers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31144—Etching the insulating layers by chemical or physical means using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0147—Film patterning
- B81C2201/0149—Forming nanoscale microstructures using auto-arranging or self-assembling material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Nanotechnology (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Inorganic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Analytical Chemistry (AREA)
- Laminated Bodies (AREA)
- Insulating Bodies (AREA)
Abstract
INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property :::` , 1#1110111101110101011111 01101001111111111111111111111111111111111111110111111 Organization International Bureau (10) International Publication Number 03 (43) International Publication Date .......\"' WO 2018/044240 Al 08 March 2018 (08.03.2018) WI P0 I P C T (51) International Patent Classification: 2 Fusionopolis Way, #08-03, Innovis, Singapore 138634 B82Y 40/00 (2011.01) GO2B 1/118 (2015.01) (SG). PANIAGUA-DOMINGUEZ, Ramon; c/o Data Storage Institute, 2 Fusionopolis Way, #08-01, Innovis, Sin- (21) International Application Number: PCT/SG2017/050440 gapore 138634 (SG). KUZNETSOV, Arseniy; c/o Data Storage Institute, 2 Fusionopolis Way, #08-01, Innovis, Sin- (22) International Filing Date: gapore 138634 (SG). YU, Yefeng; c/o Data Storage In- 05 September 2017 (05.09.2017) stitute, 2 Fusionopolis Way, #08-01, Innovis, Singapore 138634 (SG). (25) Filing Language: English (26) Publication Language: English (74) Agent: SPRUSON & FERGUSON (ASIA) PTE LTD; P.O. Box 1531, Robinson Road Post Office, Singapore (30) Priority Data: 903031 (SG). 10201607372X 05 September 2016 (05.09.2016) SG (81) Designated States (unless otherwise indicated, for every (71) Applicant: AGENCY FOR SCIENCE, TECHNOLO- kind of national protection available): AE, AG, AL, AM, GY AND RESEARCH [SG/SG]; 1 Fusionopolis Way, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, #20-10 Connexis North Tower, Singapore 138632 (SG). CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FL GB, GD, GE, GH, GM, GT, HN, (72) Inventors: YANG, Kwang Wei Joel; c/o Institute of Ma-HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, terials Research and Engineering, 2 Fusionopolis Way, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, #08-03, Innovis, Singapore 138634 (SG). DONG, Zhao- MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, gang; c/o Institute of Materials Research and Engineering, Title: A METHOD OF FORMING NANO-PATTERNS ON A SUBSTRATE (54) = [Fig. 1] _ = = 0) 1b) = .f 1. 101 = Step .0 = 1 3 .,„ is i = Step 12 (d) (c) = 1 145 107 107 \ \ = N 107 = St Ria 14 N.1 , - \ = 103 = = : This application relates to a method of forming nano-patterns on a substrate comprising the step of forming a plurality of 1— H ..0 (57) 'IlL ' nanostructures on a dielectric substrate, wherein the nanostructures are dimensioned or spaced apart from each other by a scaling factor 0 of the dielectric substrate with reference to a silicon substrate. There is also provided a method of forming a nano-patterned substrate 71' comprising the step of forming a plurality of nanostructures on a dielectric substrate, wherein said dielectric substrate comprises an ei ii- anti-reflectance layer disposed on a base substrate. There is also provided a method of forming a nano-patterned substrate comprising the 1 steps of forming a plurality of nanostructures on a dielectric substrate, wherein the dielectric substrate comprises an anti-reflectance layer 0 --.... disposed on a base substrate, wherein the nanostructures comprise a dielectric material, and wherein the nanostructures are dimensioned Ot or 1-1 spaced apart from each other by a scaling factor of the dielectric material with reference to a silicon substrate. 0 ei O [Continued on next page] WO 2018/044240 Al MIDIOMMMOIREEMOMMOHEEHOEMEMNIE OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: — of inventorship (Rule 4.17(iv)) Published: — with international search report (Art. 21(3))
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG10201607372X | 2016-09-05 | ||
PCT/SG2017/050440 WO2018044240A1 (en) | 2016-09-05 | 2017-09-05 | A method of forming nano-patterns on a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201901931UA true SG11201901931UA (en) | 2019-04-29 |
Family
ID=61301253
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201901931UA SG11201901931UA (en) | 2016-09-05 | 2017-09-05 | A method of forming nano-patterns on a substrate |
SG10202101832YA SG10202101832YA (en) | 2016-09-05 | 2017-09-05 | A method of forming nano-patterns on a substrate |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202101832YA SG10202101832YA (en) | 2016-09-05 | 2017-09-05 | A method of forming nano-patterns on a substrate |
Country Status (3)
Country | Link |
---|---|
US (1) | US11287551B2 (en) |
SG (2) | SG11201901931UA (en) |
WO (1) | WO2018044240A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG10201805438TA (en) * | 2018-06-25 | 2020-01-30 | Iia Tech Pte Ltd | A diamond having nanostructures on one of its surface to generate structural colours and a method of producing thereof |
CN109160483B (en) * | 2018-08-01 | 2021-04-27 | 中国科学院微电子研究所 | Nano-pillar sensor, refractive index detection device and method |
CN110632063A (en) * | 2019-08-15 | 2019-12-31 | 中国科学院微电子研究所 | Colorimetric sensor and manufacturing method and test system thereof |
CN111399087A (en) * | 2020-03-25 | 2020-07-10 | 武汉大学 | Super surface based on medium nano brick array and method for realizing information multiplexing |
GB202009640D0 (en) * | 2020-06-24 | 2020-08-05 | Ams Sensors Singapore Pte Ltd | Optical detection system calibration |
CN115498420B (en) * | 2022-08-15 | 2024-06-25 | 电子科技大学 | Terahertz wave absorber based on strontium titanate composite material and preparation method thereof |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7170666B2 (en) * | 2004-07-27 | 2007-01-30 | Hewlett-Packard Development Company, L.P. | Nanostructure antireflection surfaces |
CN101093867B (en) * | 2006-06-19 | 2010-12-08 | 财团法人工业技术研究院 | Substrate of vertical column array of nitride in second group |
US8514398B2 (en) * | 2009-11-10 | 2013-08-20 | The Regents Of The University Of California | Sensing devices and techniques using 3-D arrays based on surface plasmon excitations |
EP2375452A1 (en) * | 2010-04-06 | 2011-10-12 | FOM Institute for Atomic and Moleculair Physics | Nanoparticle antireflection layer |
KR20130034778A (en) | 2011-09-29 | 2013-04-08 | 주식회사 동진쎄미켐 | Method of forming fine pattern of semiconductor device using directed self assembly process |
US20150377815A1 (en) * | 2013-02-20 | 2015-12-31 | Empire Technology Development Llc | Nanotube sensors for conducting solutions |
JP5802233B2 (en) * | 2013-03-27 | 2015-10-28 | 株式会社東芝 | Pattern formation method |
US10290507B2 (en) * | 2013-06-15 | 2019-05-14 | Brookhaven Science Associates, Llc | Formation of antireflective surfaces |
WO2014205238A1 (en) * | 2013-06-19 | 2014-12-24 | The Board Of Trustees Of The Leland Stanford Junior University | Novel dielectric nano-structure for light trapping in solar cells |
JP6365817B2 (en) * | 2014-02-17 | 2018-08-01 | セイコーエプソン株式会社 | Analytical device and electronic device |
DE102014105939B4 (en) * | 2014-04-28 | 2019-08-29 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Process for producing an anti-reflection coating on a silicone surface and optical element |
US9537024B2 (en) * | 2015-04-30 | 2017-01-03 | The Board Of Trustees Of The Leland Stanford Junior University | Metal-dielectric hybrid surfaces as integrated optoelectronic interfaces |
-
2017
- 2017-09-05 WO PCT/SG2017/050440 patent/WO2018044240A1/en active Application Filing
- 2017-09-05 SG SG11201901931UA patent/SG11201901931UA/en unknown
- 2017-09-05 US US16/330,764 patent/US11287551B2/en active Active
- 2017-09-05 SG SG10202101832YA patent/SG10202101832YA/en unknown
Also Published As
Publication number | Publication date |
---|---|
SG10202101832YA (en) | 2021-04-29 |
US20190187337A1 (en) | 2019-06-20 |
WO2018044240A1 (en) | 2018-03-08 |
US11287551B2 (en) | 2022-03-29 |
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