SG11201901770RA - Mask-integrated surface protective tape - Google Patents
Mask-integrated surface protective tapeInfo
- Publication number
- SG11201901770RA SG11201901770RA SG11201901770RA SG11201901770RA SG11201901770RA SG 11201901770R A SG11201901770R A SG 11201901770RA SG 11201901770R A SG11201901770R A SG 11201901770RA SG 11201901770R A SG11201901770R A SG 11201901770RA SG 11201901770R A SG11201901770R A SG 11201901770RA
- Authority
- SG
- Singapore
- Prior art keywords
- mask
- semiconductor wafer
- protective tape
- material layer
- base film
- Prior art date
Links
- 230000001681 protective effect Effects 0.000 title abstract 8
- 239000004065 semiconductor Substances 0.000 abstract 10
- 239000000463 material Substances 0.000 abstract 7
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000004380 ashing Methods 0.000 abstract 1
- 230000002950 deficient Effects 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000000206 photolithography Methods 0.000 abstract 1
- 230000003746 surface roughness Effects 0.000 abstract 1
- 238000009736 wetting Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
- H01L21/3081—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their composition, e.g. multilayer masks, materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2431/00—Presence of polyvinyl acetate
- C09J2431/006—Presence of polyvinyl acetate in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C09J2433/006—Presence of (meth)acrylic polymer in the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Laser Beam Processing (AREA)
Abstract
MASK-INTEGRATED SURFACE PROTECTIVE TAPE {} {Technical problem} To provide a mask-integrated surface protective tape for a plasma dicing method, which has a good protection property of the patterned 5 surface of the semiconductor wafer in the backgrinding step which is performed in a large thinning degree and a good peeling property of the mask material layer from a base film of the surface protective tape, and which is low in adhesive deposits and occurrence of defective chips. Further, to provide a photolithography process-unnecessary mask-integrated surface protective tape. 10 {Solution to problem} A mask-integrated surface protective tape that can be used for production of semiconductor chips, with the production containing the following steps (a) to (d), which tape comprises a base film and a mask material layer provided on the base film, wherein a wetting tension of the base film on the side from which the mask material layer has been peeled is 20.0 mN/m or more 15 and 48.0 mN/m or less, and wherein a surface roughness Ra of the base film on the side from which the mask material layer has been peeled is within a range of 0 . 0 5 μ m o r m o r e a n d 2 . 0 μ m o r l e s s w h e n m e a s u r e d i n c o n f o r m i t y t o J I S B 0 6 0 1 , [Steps (a) to (d)] (a) a step of, in the state of having laminated the mask-integrated surface 20 protective tape on the side of a patterned surface of a semiconductor wafer, grinding the backing-face side of the semiconductor wafer; laminating a wafer fixing tape on the backing-face side of the ground semiconductor wafer; and supporting and fixing the wafer to a ring flame; (b) a step of, after peeling the base film of the mask-integrated surface 25 protective tape, thereby to expose the mask material layer on top, forming an opening of a street of the semiconductor wafer by cutting a portion of the mask material layer corresponding to the street of the semiconductor wafer by laser; 63 (c) a plasma-dicing step of segmentalizing the semiconductor wafer on the street by a SF6 plasma, thereby singulating the semiconductor wafer into semiconductor chips; and (d) an ashing step of removing the mask material layer by an O2 plasma. [Fig. 1] 5
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016167148 | 2016-08-29 | ||
PCT/JP2017/030714 WO2018043391A1 (en) | 2016-08-29 | 2017-08-28 | Mask-integrated surface protection tape |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201901770RA true SG11201901770RA (en) | 2019-04-29 |
Family
ID=61309071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201901770RA SG11201901770RA (en) | 2016-08-29 | 2017-08-28 | Mask-integrated surface protective tape |
Country Status (9)
Country | Link |
---|---|
US (1) | US10971387B2 (en) |
EP (1) | EP3506334A4 (en) |
JP (1) | JP6928850B2 (en) |
KR (1) | KR102188284B1 (en) |
CN (1) | CN109716502B (en) |
MY (1) | MY192116A (en) |
SG (1) | SG11201901770RA (en) |
TW (1) | TWI686852B (en) |
WO (1) | WO2018043391A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7042667B2 (en) * | 2018-03-28 | 2022-03-28 | 古河電気工業株式会社 | Manufacturing method of semiconductor chip |
CN110867501B (en) * | 2018-08-28 | 2020-11-27 | 山东浪潮华光光电子股份有限公司 | Cutting method of GaAs-based light emitting diode chip |
US11587834B1 (en) * | 2020-06-29 | 2023-02-21 | Plasma-Therm Llc | Protective coating for plasma dicing |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11288907A (en) * | 1997-12-10 | 1999-10-19 | Nitto Denko Corp | Manufacture of semiconductor device and adhesive sheet or the like for surface protection |
JP3410371B2 (en) * | 1998-08-18 | 2003-05-26 | リンテック株式会社 | Surface protection sheet for wafer back grinding and method of using the same |
TWI281890B (en) * | 2002-11-20 | 2007-06-01 | Kimoto Kk | Fingerprint-erasable film |
JP4333649B2 (en) | 2005-07-11 | 2009-09-16 | パナソニック株式会社 | Manufacturing method of semiconductor chip |
TW200800584A (en) * | 2006-04-03 | 2008-01-01 | Gunze Kk | Surface protective tape used for back grinding of semiconductor wafer and base film for the surface protective tape |
JP5064985B2 (en) | 2006-12-05 | 2012-10-31 | 古河電気工業株式会社 | Semiconductor wafer processing method |
JP4851613B2 (en) * | 2009-12-22 | 2012-01-11 | 古河電気工業株式会社 | Adhesive tape for semiconductor wafer surface protection |
JP2011151251A (en) | 2010-01-22 | 2011-08-04 | Sumitomo Bakelite Co Ltd | Conductive connection material with back grind tape, inter-terminal connection method, and electric/electronic component |
JP2012079936A (en) * | 2010-10-01 | 2012-04-19 | Nitto Denko Corp | Dicing, die-bonding film and method for manufacturing semiconductor device |
JP5363662B2 (en) | 2011-09-30 | 2013-12-11 | リンテック株式会社 | Dicing sheet with protective film forming layer and chip manufacturing method |
JP5318251B2 (en) * | 2012-05-28 | 2013-10-16 | リンテック株式会社 | Die sort sheet |
JPWO2014080918A1 (en) * | 2012-11-20 | 2017-01-05 | 古河電気工業株式会社 | Semiconductor chip manufacturing method and thin film grinding surface protective tape used therefor |
CN104837942B (en) * | 2012-12-14 | 2017-04-26 | 琳得科株式会社 | Holding membrane forming film |
JP2015030797A (en) * | 2013-08-02 | 2015-02-16 | 日東電工株式会社 | Adhesive tape and sheet |
SG11201706310UA (en) * | 2015-02-06 | 2017-09-28 | Asahi Glass Co Ltd | Film, method for its production, and method for producing semiconductor element using the film |
-
2017
- 2017-08-28 WO PCT/JP2017/030714 patent/WO2018043391A1/en active Application Filing
- 2017-08-28 KR KR1020197006604A patent/KR102188284B1/en active IP Right Grant
- 2017-08-28 JP JP2018537252A patent/JP6928850B2/en active Active
- 2017-08-28 SG SG11201901770RA patent/SG11201901770RA/en unknown
- 2017-08-28 EP EP17846396.4A patent/EP3506334A4/en not_active Withdrawn
- 2017-08-28 MY MYPI2019001081A patent/MY192116A/en unknown
- 2017-08-28 CN CN201780050928.2A patent/CN109716502B/en active Active
- 2017-08-29 TW TW106129341A patent/TWI686852B/en active
-
2019
- 2019-02-26 US US16/286,322 patent/US10971387B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TWI686852B (en) | 2020-03-01 |
US10971387B2 (en) | 2021-04-06 |
JP6928850B2 (en) | 2021-09-01 |
CN109716502B (en) | 2022-12-30 |
JPWO2018043391A1 (en) | 2019-06-24 |
TW201812883A (en) | 2018-04-01 |
MY192116A (en) | 2022-07-28 |
CN109716502A (en) | 2019-05-03 |
KR20190034653A (en) | 2019-04-02 |
WO2018043391A1 (en) | 2018-03-08 |
EP3506334A1 (en) | 2019-07-03 |
KR102188284B1 (en) | 2020-12-08 |
US20190198378A1 (en) | 2019-06-27 |
EP3506334A4 (en) | 2020-08-19 |
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