SG11201901331YA - Method for defocus detection - Google Patents

Method for defocus detection

Info

Publication number
SG11201901331YA
SG11201901331YA SG11201901331YA SG11201901331YA SG11201901331YA SG 11201901331Y A SG11201901331Y A SG 11201901331YA SG 11201901331Y A SG11201901331Y A SG 11201901331YA SG 11201901331Y A SG11201901331Y A SG 11201901331YA SG 11201901331Y A SG11201901331Y A SG 11201901331YA
Authority
SG
Singapore
Prior art keywords
international
defocus
detection
california
threshold
Prior art date
Application number
SG11201901331YA
Inventor
Xuguang Jiang
Shifang Li
Yong Zhang
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11201901331YA publication Critical patent/SG11201901331YA/en

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/11—Region-based segmentation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/174—Segmentation; Edge detection involving the use of two or more images
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45027—Masking, project image on wafer semiconductor, photo tracer
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10024—Color image
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10148—Varying focus
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10152—Varying illumination
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30168—Image quality inspection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Quality & Reliability (AREA)
  • General Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Peptides Or Proteins (AREA)
  • Automatic Focus Adjustment (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property 11111111111 0111010101111101111101 0 011111001H01111101H 011111E111111111111 Organization International Bureau (10) International Publication Number (43) International Publication Date .....0\"\" WO 2018/057433 Al 29 March 2018 (29.03.2018) WI P0 I P C T (51) International Patent Classification: Yong; 20781 Cheryl Drive, Cupertino, California 95014 HO1L 21/66 (2006.01) (US). (21) International Application Number: (74) Agent: MCANDREWS, Kevin et al.; KLA-Tencor Corp., (22) PCT/US2017/051901 Legal Department, One Technology Drive, Milpitas, Cali- fornia 95035 (US). International Filing Date: 15 September 2017 (15.09.2017) (81) Designated States (unless otherwise indicated, for every (25) Filing Language: English kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, (26) Publication Language: English CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, (30) Priority Data: DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, 62/399,251 23 September 2016 (23.09.2016) US HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, 15/669,030 04 August 2017 (04.08.2017) US KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, (71) Applicant: KLA-TENCOR CORPORATION [US/US]; OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, Legal Department, One Technology Drive, Milpitas, Cali- SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, fornia 95035 (US). TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (72) Inventors: JIANG, Xuguang; 750 Brahms Way, Apt. 16, (84) Designated States (unless otherwise indicated, for every Sunnyvale, California 94087 (US). LI, Shifang; 3357 Sage- kind of regional protection available): ARIPO (BW, GH, wood Court, Pleasanton, California 94588 (US). ZHANG, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, = Title: METHOD FOR DEFOCUS DETECTION = (54) 300 = \, = 301 = = Z = = 302 — (..-----/ Y X = 303 304 307 \ I L P = 305 = = = = 306 FIG. 5 ,-, M en si. (57) : Two or more color data can be combined to form a new data source to enhance sensitivity to defocus signal. Defocus IN detection can be performed on the newly formed data source. In a setup step, a training wafer can be used to select the best color 11 in © combination, and obtain defocus detection threshold. This can include applying a segment mask, calculating mean intensities of the ---- segment, determining a color combination that optimizes defocus sensitivity, and generating a second segment mask based on pixels GC , 1 that are above a threshold to sensitivity. In a detection step, the selected color combination is calculated, and the threshold is applied 0 to ei obtain defocus detection result. C [Continued on next page] WO 2018/057433 Al IMEDIMOM0101011MERI00 IIMINEHNOMOVOIMIE UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))
SG11201901331YA 2016-09-23 2017-09-15 Method for defocus detection SG11201901331YA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662399251P 2016-09-23 2016-09-23
US15/669,030 US10372113B2 (en) 2016-09-23 2017-08-04 Method for defocus detection
PCT/US2017/051901 WO2018057433A1 (en) 2016-09-23 2017-09-15 Method for defocus detection

Publications (1)

Publication Number Publication Date
SG11201901331YA true SG11201901331YA (en) 2019-04-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201901331YA SG11201901331YA (en) 2016-09-23 2017-09-15 Method for defocus detection

Country Status (7)

Country Link
US (1) US10372113B2 (en)
EP (1) EP3516683B1 (en)
JP (1) JP6864738B2 (en)
KR (1) KR102287796B1 (en)
CN (1) CN109690750B (en)
SG (1) SG11201901331YA (en)
WO (1) WO2018057433A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220077080A (en) 2020-12-01 2022-06-08 주식회사 익센트릭게임그루 Immersive content provision and defocus control method in curved projection

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101830565B1 (en) * 2003-06-19 2018-02-20 가부시키가이샤 니콘 Exposure device and device producing method
US6985220B1 (en) 2003-08-20 2006-01-10 Kla-Tencor Technologies Corporation Interactive threshold tuning
AU2003300005A1 (en) * 2003-12-19 2005-08-03 International Business Machines Corporation Differential critical dimension and overlay metrology apparatus and measurement method
CN101286010B (en) * 2008-04-25 2010-10-20 上海微电子装备有限公司 Aligning system for photolithography equipment and its alignment method and photolithography equipment
JP2009277903A (en) * 2008-05-15 2009-11-26 Panasonic Corp Electronic component forming apparatus, and electronic component
JPWO2011016420A1 (en) 2009-08-03 2013-01-10 株式会社エヌ・ピー・シー Solar cell defect inspection apparatus, defect inspection method, and program
US8432553B2 (en) * 2009-10-08 2013-04-30 Massachusetts Institute Of Technology Phase from defocused color images
JP5526014B2 (en) 2010-12-21 2014-06-18 株式会社日立製作所 Imaging device
US20130016895A1 (en) 2011-07-15 2013-01-17 International Business Machines Corporation Method and system for defect-bitmap-fail patterns matching analysis including peripheral defects
US9311700B2 (en) * 2012-09-24 2016-04-12 Kla-Tencor Corporation Model-based registration and critical dimension metrology
US9546862B2 (en) 2012-10-19 2017-01-17 Kla-Tencor Corporation Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry tool
US10192303B2 (en) * 2012-11-12 2019-01-29 Kla Tencor Corporation Method and system for mixed mode wafer inspection
CN103488060B (en) * 2013-09-30 2015-09-09 上海华力微电子有限公司 Determine the method for photolithographic exposure defocusing amount
US9710728B2 (en) * 2014-10-28 2017-07-18 Kla-Tencor Corporation Image based signal response metrology
US9569834B2 (en) * 2015-06-22 2017-02-14 Kla-Tencor Corporation Automated image-based process monitoring and control
JP6600162B2 (en) * 2015-05-19 2019-10-30 キヤノン株式会社 Imaging apparatus and control method thereof

Also Published As

Publication number Publication date
WO2018057433A1 (en) 2018-03-29
US10372113B2 (en) 2019-08-06
JP6864738B2 (en) 2021-04-28
US20180088560A1 (en) 2018-03-29
JP2019532339A (en) 2019-11-07
CN109690750A (en) 2019-04-26
EP3516683B1 (en) 2022-06-22
EP3516683A1 (en) 2019-07-31
KR20190045942A (en) 2019-05-03
KR102287796B1 (en) 2021-08-06
CN109690750B (en) 2020-12-01
EP3516683A4 (en) 2020-03-18

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