SG11201810215RA - Mold release sheet for semiconductor compression molding and semiconductor package which is molded using same - Google Patents

Mold release sheet for semiconductor compression molding and semiconductor package which is molded using same

Info

Publication number
SG11201810215RA
SG11201810215RA SG11201810215RA SG11201810215RA SG11201810215RA SG 11201810215R A SG11201810215R A SG 11201810215RA SG 11201810215R A SG11201810215R A SG 11201810215RA SG 11201810215R A SG11201810215R A SG 11201810215RA SG 11201810215R A SG11201810215R A SG 11201810215RA
Authority
SG
Singapore
Prior art keywords
semiconductor
compression molding
molded
release sheet
same
Prior art date
Application number
SG11201810215RA
Inventor
Masahiko Suzuki
Ryo Tamura
Takuji Ikeya
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of SG11201810215RA publication Critical patent/SG11201810215RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/14—Layered products comprising a layer of synthetic resin next to a particulate layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/02—Synthetic macromolecular particles
    • B32B2264/0214—Particles made of materials belonging to B32B27/00
    • B32B2264/0228—Vinyl resin particles, e.g. polyvinyl acetate, polyvinyl alcohol polymers or ethylene-vinyl acetate copolymers
    • B32B2264/0235—Aromatic vinyl resin, e.g. styrenic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/02—Synthetic macromolecular particles
    • B32B2264/0214—Particles made of materials belonging to B32B27/00
    • B32B2264/025—Acrylic resin particles, e.g. polymethyl methacrylate or ethylene-acrylate copolymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/02—Synthetic macromolecular particles
    • B32B2264/0214—Particles made of materials belonging to B32B27/00
    • B32B2264/0257—Polyolefin particles, e.g. polyethylene or polypropylene homopolymers or ethylene-propylene copolymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

MOLD RELEASE SHEET FOR SEMICONDUCTOR COMPRESSION MOLDING AND SEMICONDUCTOR PACKAGE WHICH IS MOLDED USING SAME A release sheet for semiconductor compression molding includes a release layer that includes particles, and a base layer. The content ratio of the particles in the release layer is from 5% by volume to 65% by volume.
SG11201810215RA 2016-05-20 2016-05-20 Mold release sheet for semiconductor compression molding and semiconductor package which is molded using same SG11201810215RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/065070 WO2017199440A1 (en) 2016-05-20 2016-05-20 Mold release sheet for semiconductor compression molding and semiconductor package which is molded using same

Publications (1)

Publication Number Publication Date
SG11201810215RA true SG11201810215RA (en) 2018-12-28

Family

ID=60326435

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201810215RA SG11201810215RA (en) 2016-05-20 2016-05-20 Mold release sheet for semiconductor compression molding and semiconductor package which is molded using same

Country Status (7)

Country Link
US (1) US20190275763A1 (en)
JP (1) JPWO2017199440A1 (en)
KR (1) KR20190008882A (en)
CN (1) CN109155257B (en)
MY (1) MY198300A (en)
SG (1) SG11201810215RA (en)
WO (1) WO2017199440A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7347803B2 (en) * 2019-03-20 2023-09-20 株式会社コバヤシ Combination of mold and release film, method for manufacturing release film, mold, and molded object
JP6751974B1 (en) * 2019-10-16 2020-09-09 株式会社コバヤシ Release film and method for manufacturing release film
JP2022101288A (en) * 2020-12-24 2022-07-06 昭和電工マテリアルズ株式会社 Release film and method for manufacturing electronic component device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002158242A (en) 1999-11-30 2002-05-31 Hitachi Chem Co Ltd Mold release sheet for semiconductor mold and method for manufacturing resin-sealed semiconductor device
JP2004200467A (en) * 2002-12-19 2004-07-15 Hitachi Chem Co Ltd Release sheet for semiconductor mould
US20140079913A1 (en) * 2011-03-28 2014-03-20 Tomoo Nishiyama Multilayer resin sheet, resin sheet laminate, cured multilayer resin sheet and method for producing same, multilayer resin sheet with metal foil, and semiconductor device
KR102157058B1 (en) * 2012-10-19 2020-09-17 도레이 카부시키가이샤 Biaxially oriented polyester film for mold release
JP2014151448A (en) * 2013-02-05 2014-08-25 Daicel Corp Method for producing release film and fiber-reinforced plastic
JP6204051B2 (en) * 2013-04-19 2017-09-27 株式会社巴川製紙所 Mold release sheet
CN105340069B (en) * 2013-06-18 2018-06-08 积水化学工业株式会社 Mold release film
US20160200072A1 (en) * 2013-08-30 2016-07-14 Yupo Corporation Easily peelable laminate film, easily peelable laminate label, high-concealment easily peelable laminate film, and high-concealment easily peelable laminate label
MY192516A (en) * 2014-03-07 2022-08-25 Asahi Glass Co Ltd Mold release film, process for its production and process for producing semiconductor package
SG11201607469SA (en) * 2014-03-07 2016-10-28 Asahi Glass Co Ltd Mold release film and process for producing sealed body
JP6520055B2 (en) * 2014-11-06 2019-05-29 日立化成株式会社 Semiconductor compression molding release sheet and semiconductor package molded using the same

Also Published As

Publication number Publication date
KR20190008882A (en) 2019-01-25
WO2017199440A1 (en) 2017-11-23
CN109155257B (en) 2023-09-15
US20190275763A1 (en) 2019-09-12
JPWO2017199440A1 (en) 2019-04-04
MY198300A (en) 2023-08-22
CN109155257A (en) 2019-01-04

Similar Documents

Publication Publication Date Title
SG11201607466TA (en) Mold release film, process for its production and process for producing semiconductor package
TWD175430S (en) Packing box
SG11201700230YA (en) Ethylene-vinyl alcohol copolymer and resin composition, and molded product obtained using the same
MX2017015265A (en) Press molded product, press molding method, and press molding device.
MY176228A (en) Epoxy resin composition, semiconductor sealing agent, and semiconductor device
MX2016011417A (en) Vinyl chloride resin composition for powder molding, vinyl chloride resin molded article, and laminate.
MY185884A (en) Epoxy resin composition, semiconductor sealing agent, and semiconductor device
IE20190084A3 (en) Novel methods for manufacturing an adjuvant
SG11201702684XA (en) Mold release film, process for its production, and process for producing semiconductor package
MY198300A (en) Mold release sheet for semiconductor compression molding and semiconductor package which is molded using same
PT3702390T (en) Composition for cured resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device
EP3470216A4 (en) Compression molding device for molded article
MX2017007084A (en) Moulding device for the manufacture of composite components from liquid polymer resin by high-pressure injection.
GB2550298A (en) Mems transducer package
MX2017005033A (en) Powder moldable vinyl chloride resin composition for real-stitched surface cover and manufacturing method therefor, vinyl chloride resin molding for real-stitched surface cover and manufacturing method therefor, and laminate.
MX2017015892A (en) Container manufacturing apparatus.
EP3257896A4 (en) Block copolymer composition, molding material, resin composition, and molded article
MY179653A (en) Resin composition and sheet-shaped molded body thereof
MX2015015377A (en) Film preparation containing donepezil-free base and method for producing same.
SA519401335B1 (en) Method for Producing Pellets, Method for Producing Resin Molded Article, and Pellets
MX2020000003A (en) Method for producing silicone elastomer moulds.
EP3564315A4 (en) Resin composition and molded article produced therefrom
MY176251A (en) Mold-release-improving agent for use in molding polybutylene terephthalate resin composition, and method for improving mold releasability
MX2017007111A (en) Moulding device for the manufacture of composite components using liquid polymer resin.
EP3553100A4 (en) RESIN COMPOSITION FOR VaRTM MOLDING, MOLDING MATERIAL, MOLDED ARTICLE AND METHOD FOR PRODUCING MOLDED ARTICLE