SG11201803320YA - Separator - Google Patents
SeparatorInfo
- Publication number
- SG11201803320YA SG11201803320YA SG11201803320YA SG11201803320YA SG11201803320YA SG 11201803320Y A SG11201803320Y A SG 11201803320YA SG 11201803320Y A SG11201803320Y A SG 11201803320YA SG 11201803320Y A SG11201803320Y A SG 11201803320YA SG 11201803320Y A SG11201803320Y A SG 11201803320YA
- Authority
- SG
- Singapore
- Prior art keywords
- separator
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015208900A JP6545601B2 (ja) | 2015-10-23 | 2015-10-23 | セパレータ |
| PCT/JP2016/081121 WO2017069205A1 (ja) | 2015-10-23 | 2016-10-20 | セパレータ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201803320YA true SG11201803320YA (en) | 2018-05-30 |
Family
ID=58557357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201803320YA SG11201803320YA (en) | 2015-10-23 | 2016-10-20 | Separator |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US11049748B2 (ko) |
| EP (1) | EP3367427B1 (ko) |
| JP (1) | JP6545601B2 (ko) |
| KR (1) | KR102111868B1 (ko) |
| CN (1) | CN108475652B (ko) |
| HK (1) | HK1257000A1 (ko) |
| SG (1) | SG11201803320YA (ko) |
| TW (1) | TWI641541B (ko) |
| WO (1) | WO2017069205A1 (ko) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6545601B2 (ja) | 2015-10-23 | 2019-07-17 | アキレス株式会社 | セパレータ |
| WO2019046477A1 (en) * | 2017-08-29 | 2019-03-07 | Daewon Semiconductor Packaging Industrial Company | SEPARATORS FOR HANDLING, TRANSPORTING OR STORING SEMICONDUCTOR WAFERS |
| US10811292B2 (en) * | 2018-09-12 | 2020-10-20 | Texas Instruments Incorporated | Transport packaging and method for expanded wafers |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3552548A (en) * | 1968-08-05 | 1971-01-05 | Fluroware Inc | Wafer storage and shipping container |
| US5366079A (en) * | 1993-08-19 | 1994-11-22 | Taiwan Semiconductor Manufacturing Company | Integrated circuit wafer and retainer element combination |
| JPH09129719A (ja) * | 1995-08-30 | 1997-05-16 | Achilles Corp | 半導体ウエハの収納構造および半導体ウエハの収納・取出し方法 |
| US5611448A (en) * | 1995-09-25 | 1997-03-18 | United Microelectronics Corporation | Wafer container |
| JP3122364B2 (ja) * | 1996-02-06 | 2001-01-09 | 東京エレクトロン株式会社 | ウエハボート |
| JP2858567B2 (ja) | 1996-09-27 | 1999-02-17 | 日本電気株式会社 | 半導体ウエハ用保護シート及び半導体ウエハの保管輸送方法 |
| US6491732B1 (en) * | 1996-11-15 | 2002-12-10 | Agere Systems Inc. | Wafer handling apparatus and method |
| US6568526B1 (en) * | 1999-07-27 | 2003-05-27 | Tdk Electronics Corporation | Stackable compact disk case |
| US6848579B2 (en) * | 1999-10-25 | 2005-02-01 | Brian Cleaver | Shock absorbing apparatus and method |
| JP3440243B2 (ja) * | 2000-09-26 | 2003-08-25 | 株式会社アドバンストシステムズジャパン | スパイラルコンタクタ |
| US6886696B2 (en) * | 2003-01-15 | 2005-05-03 | Taiwan Semiconductor Manufacturing Co., Ltd | Wafer container with removable sidewalls |
| US7578392B2 (en) * | 2003-06-06 | 2009-08-25 | Convey Incorporated | Integrated circuit wafer packaging system and method |
| KR101229132B1 (ko) * | 2003-07-11 | 2013-02-01 | 테크-셈 아크티엔게젤샤프트 | 전자부품들을 제조하는 동안 판형상의 기질들을 저장하고 전달하기 위한 장치 |
| TW200711030A (en) * | 2005-02-23 | 2007-03-16 | Kyocera Corp | Joined article and member for holding wafer and structure for mounting the same, and method for treating wafer |
| TWM278030U (en) * | 2005-05-27 | 2005-10-11 | De-Shuen Ye | Anti-theft CD case structure |
| JP4716928B2 (ja) * | 2006-06-07 | 2011-07-06 | 信越ポリマー株式会社 | ウェーハ収納容器 |
| KR101395467B1 (ko) * | 2006-06-13 | 2014-05-14 | 엔테그리스, 아이엔씨. | 재사용이 가능한 웨이퍼 용기용 탄성 쿠션 |
| CN201023813Y (zh) | 2007-04-05 | 2008-02-20 | 义柏科技（深圳）有限公司 | 晶圆隔离环 |
| US8393471B2 (en) * | 2008-04-18 | 2013-03-12 | Texas Instruments Incorporated | Packing insert for disc-shaped objects |
| JP2010023813A (ja) | 2008-07-24 | 2010-02-04 | Honda Motor Co Ltd | 操舵装置 |
| US20100224517A1 (en) * | 2009-03-03 | 2010-09-09 | Haggard Clifton C | Disk separator device |
| JP5595716B2 (ja) * | 2009-11-18 | 2014-09-24 | 株式会社ディスコ | 光デバイスウエーハの加工方法 |
| US9653331B2 (en) * | 2011-02-16 | 2017-05-16 | Texchem Advanced Products Incorporated Sdn. Bhd. | Single and dual stage wafer cushion |
| US9224627B2 (en) * | 2011-02-16 | 2015-12-29 | Texchem Advanced Products Incorporated Sdn Bhd | Single and dual stage wafer cushion and wafer separator |
| DE102011007682A1 (de) * | 2011-04-19 | 2012-10-25 | Siltronic Ag | Suszeptor zum Abstützen einer Halbleiterscheibe und Verfahren zum Abscheiden einer Schicht auf einer Vorderseite einer Halbleiterscheibe |
| WO2012165551A1 (ja) * | 2011-06-02 | 2012-12-06 | 電気化学工業株式会社 | 粘着テープおよび半導体ウエハ加工方法 |
| WO2014160774A1 (en) | 2013-03-26 | 2014-10-02 | E.Pak International, Inc. | Packaging insert |
| JP6545601B2 (ja) | 2015-10-23 | 2019-07-17 | アキレス株式会社 | セパレータ |
-
2015
- 2015-10-23 JP JP2015208900A patent/JP6545601B2/ja active Active
-
2016
- 2016-10-20 KR KR1020187013708A patent/KR102111868B1/ko active IP Right Grant
- 2016-10-20 EP EP16857518.1A patent/EP3367427B1/en active Active
- 2016-10-20 WO PCT/JP2016/081121 patent/WO2017069205A1/ja active Application Filing
- 2016-10-20 CN CN201680075698.0A patent/CN108475652B/zh active Active
- 2016-10-20 TW TW105133919A patent/TWI641541B/zh active
- 2016-10-20 US US15/769,318 patent/US11049748B2/en active Active
- 2016-10-20 SG SG11201803320YA patent/SG11201803320YA/en unknown
-
2018
- 2018-12-14 HK HK18116113.8A patent/HK1257000A1/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| HK1257000A1 (zh) | 2019-10-11 |
| TW201722800A (zh) | 2017-07-01 |
| KR102111868B1 (ko) | 2020-06-26 |
| CN108475652B (zh) | 2022-11-01 |
| WO2017069205A1 (ja) | 2017-04-27 |
| KR20180070636A (ko) | 2018-06-26 |
| US20190013226A1 (en) | 2019-01-10 |
| EP3367427A4 (en) | 2019-06-12 |
| EP3367427A1 (en) | 2018-08-29 |
| JP2017084869A (ja) | 2017-05-18 |
| EP3367427B1 (en) | 2021-12-01 |
| CN108475652A (zh) | 2018-08-31 |
| TWI641541B (zh) | 2018-11-21 |
| US11049748B2 (en) | 2021-06-29 |
| JP6545601B2 (ja) | 2019-07-17 |
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