SG11201707415TA - Photosensitive resin composition, photosensitive resin composition film, cured product, insulating film and multilayer wiring board - Google Patents
Photosensitive resin composition, photosensitive resin composition film, cured product, insulating film and multilayer wiring boardInfo
- Publication number
- SG11201707415TA SG11201707415TA SG11201707415TA SG11201707415TA SG11201707415TA SG 11201707415T A SG11201707415T A SG 11201707415TA SG 11201707415T A SG11201707415T A SG 11201707415TA SG 11201707415T A SG11201707415T A SG 11201707415TA SG 11201707415T A SG11201707415T A SG 11201707415TA
- Authority
- SG
- Singapore
- Prior art keywords
- resin composition
- photosensitive resin
- film
- wiring board
- cured product
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Materials For Photolithography (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015066006 | 2015-03-27 | ||
PCT/JP2016/058167 WO2016158389A1 (en) | 2015-03-27 | 2016-03-15 | Photosensitive resin composition, photosensitive resin composition film, cured product, insulating film and multilayer wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201707415TA true SG11201707415TA (en) | 2017-10-30 |
Family
ID=57006028
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201707415TA SG11201707415TA (en) | 2015-03-27 | 2016-03-15 | Photosensitive resin composition, photosensitive resin composition film, cured product, insulating film and multilayer wiring board |
Country Status (8)
Country | Link |
---|---|
US (1) | US10474031B2 (en) |
EP (1) | EP3276414A1 (en) |
JP (1) | JP6740899B2 (en) |
KR (1) | KR102613669B1 (en) |
CN (1) | CN107407871B (en) |
SG (1) | SG11201707415TA (en) |
TW (1) | TWI684830B (en) |
WO (1) | WO2016158389A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018173840A1 (en) * | 2017-03-21 | 2018-09-27 | 東レ株式会社 | Photosensitive resin composition, photosensitive resin composition film, insulating film and electronic component |
JP2022029427A (en) | 2020-08-04 | 2022-02-17 | 信越化学工業株式会社 | Negative type photosensitive resin composition, pattern formation method, cured film formation method, interlayer insulating film, surface protective film, and electronic component |
WO2022190208A1 (en) * | 2021-03-09 | 2022-09-15 | 昭和電工マテリアルズ株式会社 | Photosensitive film, photosensitive element and method for producing multilayer body |
CN115826360B (en) * | 2022-12-23 | 2023-09-12 | 江苏艾森半导体材料股份有限公司 | Photosensitive polyimide composition, method for producing pattern, cured product, and electronic component |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04195043A (en) | 1990-11-28 | 1992-07-15 | Hitachi Chem Co Ltd | Photosensitive composition and production of printed circuit board with solder resist using the same |
WO2004008252A1 (en) * | 2002-07-11 | 2004-01-22 | Asahi Kasei Emd Corporation | Highly heat-resistant, negative-type photosensitive resin composition |
CN100555078C (en) * | 2003-06-02 | 2009-10-28 | 东丽株式会社 | Photosensitive resin composition and with the electronic component and the display device of its preparation |
CN1980984B (en) * | 2004-07-16 | 2010-06-09 | 旭化成电子材料株式会社 | Polyamide |
JP2006251562A (en) | 2005-03-11 | 2006-09-21 | Fuji Photo Film Co Ltd | Pattern forming material, pattern forming apparatus and pattern forming method |
JP5092399B2 (en) * | 2005-03-15 | 2012-12-05 | 東レ株式会社 | Photosensitive resin composition |
AU2006201172B2 (en) * | 2005-04-04 | 2010-11-25 | Rohm And Haas Company | Aqueous polymer dispersions |
WO2007026520A1 (en) * | 2005-08-30 | 2007-03-08 | Jsr Corporation | Radiation-sensitive resin composition and process for producing plating shaped item |
JP5013934B2 (en) * | 2007-04-12 | 2012-08-29 | 旭化成イーマテリアルズ株式会社 | Polyamideimide and negative photosensitive resin composition |
US8624064B2 (en) * | 2007-12-19 | 2014-01-07 | Dow Corning Toray Company, Ltd. | 4-hydroxyphenylalkylamine derivative |
JP5402332B2 (en) | 2009-07-09 | 2014-01-29 | 東レ株式会社 | Photosensitive resin composition, photosensitive resin composition film and multilayer wiring board using the same |
JP5854600B2 (en) | 2010-12-28 | 2016-02-09 | 太陽インキ製造株式会社 | Photocurable resin composition |
JP5990965B2 (en) * | 2012-03-23 | 2016-09-14 | 東レ株式会社 | Photosensitive resin composition and film laminate comprising the same |
JP5681243B2 (en) * | 2012-03-30 | 2015-03-04 | 太陽インキ製造株式会社 | Photocurable resin composition, dry film, cured product and printed wiring board |
JP5315441B1 (en) * | 2012-03-30 | 2013-10-16 | 太陽インキ製造株式会社 | Photocurable resin composition, dry film, cured product and printed wiring board |
JP6323007B2 (en) * | 2012-07-09 | 2018-05-16 | 東レ株式会社 | Photosensitive resin composition, conductive wiring protective film, and touch panel member |
JP2014122948A (en) * | 2012-12-20 | 2014-07-03 | Toray Ind Inc | Photosensitive resin composition, photosensitive resin composition film formed of the photosensitive composition, and method for manufacturing substrate with mask resist layer and method for manufacturing substrate with solder bump using the photosensitive resin composition or the photosensitive resin composition film |
US10428253B2 (en) * | 2013-07-16 | 2019-10-01 | Hitachi Chemical Company, Ltd | Photosensitive resin composition, film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device |
-
2016
- 2016-03-15 CN CN201680016844.2A patent/CN107407871B/en active Active
- 2016-03-15 EP EP16772272.7A patent/EP3276414A1/en not_active Withdrawn
- 2016-03-15 US US15/559,714 patent/US10474031B2/en active Active
- 2016-03-15 KR KR1020177017534A patent/KR102613669B1/en active IP Right Grant
- 2016-03-15 JP JP2016522069A patent/JP6740899B2/en active Active
- 2016-03-15 SG SG11201707415TA patent/SG11201707415TA/en unknown
- 2016-03-15 WO PCT/JP2016/058167 patent/WO2016158389A1/en active Application Filing
- 2016-03-25 TW TW105109315A patent/TWI684830B/en active
Also Published As
Publication number | Publication date |
---|---|
JP6740899B2 (en) | 2020-08-19 |
KR20170131834A (en) | 2017-11-30 |
TWI684830B (en) | 2020-02-11 |
TW201642041A (en) | 2016-12-01 |
US10474031B2 (en) | 2019-11-12 |
US20180052391A1 (en) | 2018-02-22 |
JPWO2016158389A1 (en) | 2018-01-18 |
WO2016158389A1 (en) | 2016-10-06 |
KR102613669B1 (en) | 2023-12-14 |
CN107407871B (en) | 2021-09-03 |
EP3276414A1 (en) | 2018-01-31 |
CN107407871A (en) | 2017-11-28 |
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