SG11201705831UA - Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar - Google Patents
Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbarInfo
- Publication number
- SG11201705831UA SG11201705831UA SG11201705831UA SG11201705831UA SG11201705831UA SG 11201705831U A SG11201705831U A SG 11201705831UA SG 11201705831U A SG11201705831U A SG 11201705831UA SG 11201705831U A SG11201705831U A SG 11201705831UA SG 11201705831U A SG11201705831U A SG 11201705831UA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic
- electrical device
- copper alloy
- busbar
- terminal
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G5/00—Installations of bus-bars
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015177743 | 2015-09-09 | ||
JP2015235096A JP5910790B1 (en) | 2015-12-01 | 2015-12-01 | Copper alloy for electronic and electric equipment, copper alloy plastic working material for electronic and electric equipment, parts for electronic and electric equipment, terminals, and bus bars |
PCT/JP2016/076362 WO2017043551A1 (en) | 2015-09-09 | 2016-09-08 | Copper alloy for electronic/electrical device, copper alloy plastically worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201705831UA true SG11201705831UA (en) | 2017-08-30 |
Family
ID=58239765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201705831UA SG11201705831UA (en) | 2015-09-09 | 2016-09-08 | Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar |
Country Status (10)
Country | Link |
---|---|
US (1) | US10453582B2 (en) |
EP (1) | EP3243918B1 (en) |
KR (1) | KR101994015B1 (en) |
CN (1) | CN107208189B (en) |
MX (1) | MX2017009888A (en) |
MY (1) | MY170901A (en) |
PH (1) | PH12017501348B1 (en) |
SG (1) | SG11201705831UA (en) |
TW (1) | TWI665318B (en) |
WO (1) | WO2017043551A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3348659B1 (en) | 2015-09-09 | 2020-12-23 | Mitsubishi Materials Corporation | Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar |
EP3348656B1 (en) * | 2015-09-09 | 2020-12-30 | Mitsubishi Materials Corporation | Copper alloy for electronic/electrical device, copper alloy plastically worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar |
JP6226097B2 (en) * | 2016-03-30 | 2017-11-08 | 三菱マテリアル株式会社 | Copper alloy for electronic and electrical equipment, copper alloy sheet material for electronic and electrical equipment, electronic and electrical equipment parts, terminals, bus bars, and movable pieces for relays |
US11319615B2 (en) | 2016-03-30 | 2022-05-03 | Mitsubishi Materials Corporation | Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay |
US11203806B2 (en) * | 2016-03-30 | 2021-12-21 | Mitsubishi Materials Corporation | Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay |
KR20190103346A (en) * | 2017-01-16 | 2019-09-04 | 가부시키가이샤 도모에가와 세이시쇼 | Copper fiber nonwoven fabric for wiring, unit for wiring, cooling method of copper fiber nonwoven fabric for wiring, and temperature control method for copper fiber nonwoven fabric for wiring |
KR102209773B1 (en) | 2017-05-29 | 2021-01-28 | 주식회사 엘지화학 | Battery Module |
CN111788320B (en) | 2018-03-30 | 2022-01-14 | 三菱综合材料株式会社 | Copper alloy for electronic and electrical equipment, copper alloy strip for electronic and electrical equipment, module for electronic and electrical equipment, terminal, and bus bar |
JP6780187B2 (en) * | 2018-03-30 | 2020-11-04 | 三菱マテリアル株式会社 | Copper alloys for electronic / electrical equipment, copper alloy strips for electronic / electrical equipment, parts for electronic / electrical equipment, terminals, and busbars |
JP7014211B2 (en) | 2019-09-27 | 2022-02-01 | 三菱マテリアル株式会社 | Copper alloys for electronic / electrical equipment, copper alloy strips for electronic / electrical equipment, parts for electronic / electrical equipment, terminals, and bus bars |
JP7443737B2 (en) | 2019-12-10 | 2024-03-06 | 三菱マテリアル株式会社 | Copper alloy plate, copper alloy plate with plating film, and manufacturing method thereof |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
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US3677745A (en) | 1969-02-24 | 1972-07-18 | Cooper Range Co | Copper base composition |
US3778318A (en) * | 1969-02-24 | 1973-12-11 | Cooper Range Co | Copper base composition |
JPS61284946A (en) | 1985-06-11 | 1986-12-15 | Mitsubishi Shindo Kk | Cu alloy lead blank for semiconductor device |
JP2661462B2 (en) | 1992-05-01 | 1997-10-08 | 三菱伸銅株式会社 | Straight line excellent in repeated bending property: Cu alloy ultrafine wire of 0.1 mm or less |
US5486244A (en) | 1992-11-04 | 1996-01-23 | Olin Corporation | Process for improving the bend formability of copper alloys |
JP3796784B2 (en) | 1995-12-01 | 2006-07-12 | 三菱伸銅株式会社 | Copper alloy thin plate for manufacturing connectors and connectors manufactured with the thin plates |
US6632300B2 (en) | 2000-06-26 | 2003-10-14 | Olin Corporation | Copper alloy having improved stress relaxation resistance |
US20040238086A1 (en) | 2003-05-27 | 2004-12-02 | Joseph Saleh | Processing copper-magnesium alloys and improved copper alloy wire |
JP4756197B2 (en) * | 2005-08-23 | 2011-08-24 | Dowaメタルテック株式会社 | Cu-Mg-P-based copper alloy and method for producing the same |
JP4851596B2 (en) | 2007-11-01 | 2012-01-11 | 古河電気工業株式会社 | Method for producing copper alloy material |
JP5260992B2 (en) | 2008-03-19 | 2013-08-14 | Dowaメタルテック株式会社 | Copper alloy sheet and manufacturing method thereof |
US20090239398A1 (en) | 2008-03-20 | 2009-09-24 | Interplex Nas, Inc. | Press fit (compliant) terminal and other connectors with tin-silver compound |
JP5541651B2 (en) | 2008-10-24 | 2014-07-09 | 三菱マテリアル株式会社 | Sputtering target for wiring film formation for thin film transistors |
JP4516154B1 (en) | 2009-12-23 | 2010-08-04 | 三菱伸銅株式会社 | Cu-Mg-P copper alloy strip and method for producing the same |
JP4563508B1 (en) | 2010-02-24 | 2010-10-13 | 三菱伸銅株式会社 | Cu-Mg-P-based copper alloy strip and method for producing the same |
JP5045783B2 (en) | 2010-05-14 | 2012-10-10 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, and rolled copper alloy material for electronic equipment |
JP5054160B2 (en) * | 2010-06-28 | 2012-10-24 | 三菱伸銅株式会社 | Cu-Mg-P-based copper alloy strip and method for producing the same |
KR20140025607A (en) | 2011-08-04 | 2014-03-04 | 가부시키가이샤 고베 세이코쇼 | Copper alloy |
JP5903838B2 (en) | 2011-11-07 | 2016-04-13 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, copper material for electronic equipment, copper alloy manufacturing method for electronic equipment, copper alloy plastic working material for electronic equipment, and electronic equipment parts |
EP2835433B1 (en) | 2012-04-04 | 2018-08-08 | Mitsubishi Shindoh Co., Ltd. | Cu-mg-p-based copper alloy plate having excellent fatigue resistance, and method for manufacturing same |
JP5908796B2 (en) | 2012-06-05 | 2016-04-26 | 三菱伸銅株式会社 | Cu-Mg-P-based copper alloy plate excellent in mechanical formability and method for producing the same |
JP6054085B2 (en) | 2012-07-24 | 2016-12-27 | 三菱伸銅株式会社 | Cu-Mg-P-based copper alloy sheet excellent in spring limit value characteristics and fatigue resistance after bending and method for producing the same |
JP6055242B2 (en) * | 2012-08-30 | 2016-12-27 | 三菱伸銅株式会社 | Cu-Mg-P-based copper alloy Sn plated plate and method for producing the same |
JP6076724B2 (en) | 2012-12-06 | 2017-02-08 | 古河電気工業株式会社 | Copper alloy material and method for producing the same |
JP5962707B2 (en) | 2013-07-31 | 2016-08-03 | 三菱マテリアル株式会社 | Copper alloy for electronic / electric equipment, copper alloy plastic working material for electronic / electric equipment, manufacturing method of copper alloy plastic working material for electronic / electric equipment, electronic / electric equipment parts and terminals |
EP3348659B1 (en) | 2015-09-09 | 2020-12-23 | Mitsubishi Materials Corporation | Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar |
-
2016
- 2016-09-08 WO PCT/JP2016/076362 patent/WO2017043551A1/en active Application Filing
- 2016-09-08 SG SG11201705831UA patent/SG11201705831UA/en unknown
- 2016-09-08 TW TW105129151A patent/TWI665318B/en active
- 2016-09-08 MX MX2017009888A patent/MX2017009888A/en active IP Right Grant
- 2016-09-08 KR KR1020177019315A patent/KR101994015B1/en active IP Right Grant
- 2016-09-08 US US15/543,664 patent/US10453582B2/en active Active
- 2016-09-08 EP EP16844412.3A patent/EP3243918B1/en active Active
- 2016-09-08 MY MYPI2017702648A patent/MY170901A/en unknown
- 2016-09-08 CN CN201680008019.8A patent/CN107208189B/en active Active
-
2017
- 2017-07-28 PH PH12017501348A patent/PH12017501348B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP3243918B1 (en) | 2020-05-20 |
MX2017009888A (en) | 2017-11-15 |
PH12017501348A1 (en) | 2017-12-18 |
PH12017501348B1 (en) | 2017-12-18 |
CN107208189B (en) | 2020-08-04 |
US10453582B2 (en) | 2019-10-22 |
TW201723197A (en) | 2017-07-01 |
CN107208189A (en) | 2017-09-26 |
TWI665318B (en) | 2019-07-11 |
US20180040389A1 (en) | 2018-02-08 |
KR20180043190A (en) | 2018-04-27 |
WO2017043551A1 (en) | 2017-03-16 |
EP3243918A4 (en) | 2018-08-08 |
MY170901A (en) | 2019-09-13 |
KR101994015B1 (en) | 2019-06-27 |
EP3243918A1 (en) | 2017-11-15 |
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