SG11201705744WA - Component handling assembly and method of adjusting a component handling assembly - Google Patents

Component handling assembly and method of adjusting a component handling assembly

Info

Publication number
SG11201705744WA
SG11201705744WA SG11201705744WA SG11201705744WA SG11201705744WA SG 11201705744W A SG11201705744W A SG 11201705744WA SG 11201705744W A SG11201705744W A SG 11201705744WA SG 11201705744W A SG11201705744W A SG 11201705744WA SG 11201705744W A SG11201705744W A SG 11201705744WA
Authority
SG
Singapore
Prior art keywords
handling assembly
component handling
adjusting
component
assembly
Prior art date
Application number
SG11201705744WA
Inventor
Pierrick Abrial
Damien Coste
Marco Oberli
Patrice Schwindenhammer
Original Assignee
Ismeca Semiconductor Holding Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ismeca Semiconductor Holding Sa filed Critical Ismeca Semiconductor Holding Sa
Publication of SG11201705744WA publication Critical patent/SG11201705744WA/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30164—Workpiece; Machine component
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30204—Marker
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2813—Scanning microscopes characterised by the application
    • H01J2237/2817—Pattern inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/282—Determination of microscope properties
    • H01J2237/2826—Calibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/304—Controlling tubes
    • H01J2237/30433—System calibration
    • H01J2237/30438—Registration

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Quality & Reliability (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Automatic Assembly (AREA)
SG11201705744WA 2015-05-19 2016-04-12 Component handling assembly and method of adjusting a component handling assembly SG11201705744WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH6932015 2015-05-19
PCT/IB2016/052059 WO2016185298A1 (en) 2015-05-19 2016-04-12 Component handling assembly and method of adjusting a component handling assembly

Publications (1)

Publication Number Publication Date
SG11201705744WA true SG11201705744WA (en) 2017-08-30

Family

ID=57319533

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201705744WA SG11201705744WA (en) 2015-05-19 2016-04-12 Component handling assembly and method of adjusting a component handling assembly

Country Status (9)

Country Link
US (1) US10157475B2 (en)
EP (1) EP3298580B1 (en)
KR (1) KR20180008383A (en)
CN (1) CN107408309A (en)
MY (1) MY182508A (en)
PH (1) PH12017501468A1 (en)
SG (1) SG11201705744WA (en)
TW (1) TWI680362B (en)
WO (1) WO2016185298A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102228290B1 (en) * 2017-03-09 2021-03-17 이스메카 세미컨덕터 홀딩 에스.아. Test assemblies and methods for testing electrical components
JP7164883B2 (en) * 2017-05-31 2022-11-02 株式会社フジキン Semiconductor manufacturing equipment management system, method, and computer program
CN108897597B (en) * 2018-07-20 2021-07-13 广州方硅信息技术有限公司 Method and device for guiding configuration of live broadcast template
DE102020118407A1 (en) * 2020-07-13 2022-01-13 Soft2Tec Gmbh Device and method for detecting the orientation and position of markings in three-dimensional space

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4721228A (en) * 1985-04-03 1988-01-26 Itt Corporation Apparatus for dispensing elongated small mechanical parts
US5157734A (en) * 1989-12-19 1992-10-20 Industrial Technology Research Institute Method and apparatus for picking and placing a surface mounted device with the aid of machine vision
AU2001232256A1 (en) * 2000-03-02 2001-09-12 Nikon Corporation Position measuring apparatus and aligner
CN100398272C (en) * 2000-09-01 2008-07-02 阿赛斯特技术公司 Edge grip aligner with buffering capabilities
JP2004353549A (en) * 2003-05-29 2004-12-16 Sango Co Ltd Method for producing fluid treatment device having honeycomb structure built therein
US7248353B2 (en) * 2003-05-30 2007-07-24 Ebara Corporation Method and apparatus for inspecting samples, and method for manufacturing devices using method and apparatus for inspecting samples
WO2005029658A1 (en) * 2003-09-22 2005-03-31 Murata Manufacturing Co., Ltd. Method and device for installing light emitting element
JP4656440B2 (en) * 2007-02-13 2011-03-23 東京エレクトロン株式会社 Substrate position detecting device and image pickup means position adjusting method
JP5193294B2 (en) * 2008-05-30 2013-05-08 三星ダイヤモンド工業株式会社 Laser processing apparatus and laser processing method
EP2339611B1 (en) * 2009-12-23 2015-11-11 ISMECA Semiconductor Holding SA Wafer handler comprising a vision system
MY185151A (en) * 2012-11-05 2021-04-30 Ismeca Semiconductor Holding Sa An assembly for testing the performance of a component
CN103231087A (en) * 2013-05-17 2013-08-07 无锡新宏泰电器科技股份有限公司 Self-centering device for thin-walled part
EP3005412B1 (en) 2013-06-07 2019-10-09 Semiconductor Technologies & Instruments Pte Ltd Systems and methods for automatically verifying correct die removal from film frames

Also Published As

Publication number Publication date
TWI680362B (en) 2019-12-21
PH12017501468A1 (en) 2018-01-15
TW201702778A (en) 2017-01-16
KR20180008383A (en) 2018-01-24
EP3298580B1 (en) 2019-04-03
WO2016185298A1 (en) 2016-11-24
US10157475B2 (en) 2018-12-18
US20180253859A1 (en) 2018-09-06
MY182508A (en) 2021-01-25
CN107408309A (en) 2017-11-28
EP3298580A1 (en) 2018-03-28

Similar Documents

Publication Publication Date Title
PL3373755T3 (en) E-vaping section and e-vaping device, and a method of manufacturing thereof
PL3206816T3 (en) Method of manufacturing a component and component
GB201522349D0 (en) An assembly and a method of using the assembly
PL3377146T3 (en) Micropump and method of manufacturing a micropump
GB201900330D0 (en) Assembly and method
AP2016009144A0 (en) A method and compostion for sequestration of arsenic
PT2980420T (en) Panel-insert assembly and method
SG10201607486YA (en) Improved packaging and method of manufacturing same
GB201519620D0 (en) Device and method of fabricating such a device
GB201521822D0 (en) Devices and method of operation thereof
GB201610981D0 (en) A diffrential gear assembly and a method of assembly
SG11201609744WA (en) Pallet and method of making a pallet
GB201503776D0 (en) Compound and method
GB201609584D0 (en) A de-oiler and a method of using the same
GB2540589B (en) An interference system and a method of fabricating an interference system
SG11201705744WA (en) Component handling assembly and method of adjusting a component handling assembly
GB201610309D0 (en) A semi-annular component and method of manufacture
SI3310665T1 (en) Method and manipulator
SG11201707232TA (en) An assembly and method for handling components
GB201617673D0 (en) An assembly and method
PL3256406T3 (en) A palletizing system and a method of operating such a palletizing system
GB2535511B (en) A frame component and method of manufacture thereof
GB2517533B (en) A shaft clamp assembly and a method of using the same
EP3643325C0 (en) A composition comprising furazidin and a method of its manufacturing
EP3304104A4 (en) A device and method of operation