SG11201705744WA - Component handling assembly and method of adjusting a component handling assembly - Google Patents
Component handling assembly and method of adjusting a component handling assemblyInfo
- Publication number
- SG11201705744WA SG11201705744WA SG11201705744WA SG11201705744WA SG11201705744WA SG 11201705744W A SG11201705744W A SG 11201705744WA SG 11201705744W A SG11201705744W A SG 11201705744WA SG 11201705744W A SG11201705744W A SG 11201705744WA SG 11201705744W A SG11201705744W A SG 11201705744WA
- Authority
- SG
- Singapore
- Prior art keywords
- handling assembly
- component handling
- adjusting
- component
- assembly
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30164—Workpiece; Machine component
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30204—Marker
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
- G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2813—Scanning microscopes characterised by the application
- H01J2237/2817—Pattern inspection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/282—Determination of microscope properties
- H01J2237/2826—Calibration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/304—Controlling tubes
- H01J2237/30433—System calibration
- H01J2237/30438—Registration
Landscapes
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Quality & Reliability (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Automatic Assembly (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH6932015 | 2015-05-19 | ||
PCT/IB2016/052059 WO2016185298A1 (en) | 2015-05-19 | 2016-04-12 | Component handling assembly and method of adjusting a component handling assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201705744WA true SG11201705744WA (en) | 2017-08-30 |
Family
ID=57319533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201705744WA SG11201705744WA (en) | 2015-05-19 | 2016-04-12 | Component handling assembly and method of adjusting a component handling assembly |
Country Status (9)
Country | Link |
---|---|
US (1) | US10157475B2 (en) |
EP (1) | EP3298580B1 (en) |
KR (1) | KR20180008383A (en) |
CN (1) | CN107408309A (en) |
MY (1) | MY182508A (en) |
PH (1) | PH12017501468A1 (en) |
SG (1) | SG11201705744WA (en) |
TW (1) | TWI680362B (en) |
WO (1) | WO2016185298A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102228290B1 (en) * | 2017-03-09 | 2021-03-17 | 이스메카 세미컨덕터 홀딩 에스.아. | Test assemblies and methods for testing electrical components |
JP7164883B2 (en) * | 2017-05-31 | 2022-11-02 | 株式会社フジキン | Semiconductor manufacturing equipment management system, method, and computer program |
CN108897597B (en) * | 2018-07-20 | 2021-07-13 | 广州方硅信息技术有限公司 | Method and device for guiding configuration of live broadcast template |
DE102020118407A1 (en) * | 2020-07-13 | 2022-01-13 | Soft2Tec Gmbh | Device and method for detecting the orientation and position of markings in three-dimensional space |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4721228A (en) * | 1985-04-03 | 1988-01-26 | Itt Corporation | Apparatus for dispensing elongated small mechanical parts |
US5157734A (en) * | 1989-12-19 | 1992-10-20 | Industrial Technology Research Institute | Method and apparatus for picking and placing a surface mounted device with the aid of machine vision |
AU2001232256A1 (en) * | 2000-03-02 | 2001-09-12 | Nikon Corporation | Position measuring apparatus and aligner |
CN100398272C (en) * | 2000-09-01 | 2008-07-02 | 阿赛斯特技术公司 | Edge grip aligner with buffering capabilities |
JP2004353549A (en) * | 2003-05-29 | 2004-12-16 | Sango Co Ltd | Method for producing fluid treatment device having honeycomb structure built therein |
US7248353B2 (en) * | 2003-05-30 | 2007-07-24 | Ebara Corporation | Method and apparatus for inspecting samples, and method for manufacturing devices using method and apparatus for inspecting samples |
WO2005029658A1 (en) * | 2003-09-22 | 2005-03-31 | Murata Manufacturing Co., Ltd. | Method and device for installing light emitting element |
JP4656440B2 (en) * | 2007-02-13 | 2011-03-23 | 東京エレクトロン株式会社 | Substrate position detecting device and image pickup means position adjusting method |
JP5193294B2 (en) * | 2008-05-30 | 2013-05-08 | 三星ダイヤモンド工業株式会社 | Laser processing apparatus and laser processing method |
EP2339611B1 (en) * | 2009-12-23 | 2015-11-11 | ISMECA Semiconductor Holding SA | Wafer handler comprising a vision system |
MY185151A (en) * | 2012-11-05 | 2021-04-30 | Ismeca Semiconductor Holding Sa | An assembly for testing the performance of a component |
CN103231087A (en) * | 2013-05-17 | 2013-08-07 | 无锡新宏泰电器科技股份有限公司 | Self-centering device for thin-walled part |
EP3005412B1 (en) | 2013-06-07 | 2019-10-09 | Semiconductor Technologies & Instruments Pte Ltd | Systems and methods for automatically verifying correct die removal from film frames |
-
2016
- 2016-04-12 KR KR1020177023896A patent/KR20180008383A/en unknown
- 2016-04-12 WO PCT/IB2016/052059 patent/WO2016185298A1/en active Application Filing
- 2016-04-12 US US15/545,262 patent/US10157475B2/en not_active Expired - Fee Related
- 2016-04-12 EP EP16720902.2A patent/EP3298580B1/en not_active Not-in-force
- 2016-04-12 SG SG11201705744WA patent/SG11201705744WA/en unknown
- 2016-04-12 CN CN201680012915.1A patent/CN107408309A/en active Pending
- 2016-04-12 MY MYPI2017702620A patent/MY182508A/en unknown
- 2016-04-22 TW TW105112680A patent/TWI680362B/en not_active IP Right Cessation
-
2017
- 2017-08-14 PH PH12017501468A patent/PH12017501468A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
TWI680362B (en) | 2019-12-21 |
PH12017501468A1 (en) | 2018-01-15 |
TW201702778A (en) | 2017-01-16 |
KR20180008383A (en) | 2018-01-24 |
EP3298580B1 (en) | 2019-04-03 |
WO2016185298A1 (en) | 2016-11-24 |
US10157475B2 (en) | 2018-12-18 |
US20180253859A1 (en) | 2018-09-06 |
MY182508A (en) | 2021-01-25 |
CN107408309A (en) | 2017-11-28 |
EP3298580A1 (en) | 2018-03-28 |
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