SG11201701129PA - Electronic-component-mounting device - Google Patents
Electronic-component-mounting deviceInfo
- Publication number
- SG11201701129PA SG11201701129PA SG11201701129PA SG11201701129PA SG11201701129PA SG 11201701129P A SG11201701129P A SG 11201701129PA SG 11201701129P A SG11201701129P A SG 11201701129PA SG 11201701129P A SG11201701129P A SG 11201701129PA SG 11201701129P A SG11201701129P A SG 11201701129PA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic
- component
- mounting device
- mounting
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75754—Guiding structures
- H01L2224/75755—Guiding structures in the lower part of the bonding apparatus, e.g. in the apparatus chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
- H01L2224/7592—Load or pressure adjusting means, e.g. sensors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Operations Research (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014163690 | 2014-08-11 | ||
| JP2014198052A JP5828943B1 (en) | 2014-08-11 | 2014-09-29 | Electronic component mounting equipment |
| PCT/JP2014/077402 WO2016024365A1 (en) | 2014-08-11 | 2014-10-15 | Electronic-component-mounting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201701129PA true SG11201701129PA (en) | 2017-03-30 |
Family
ID=54784328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201701129PA SG11201701129PA (en) | 2014-08-11 | 2014-10-15 | Electronic-component-mounting device |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10181451B2 (en) |
| JP (1) | JP5828943B1 (en) |
| KR (1) | KR101842624B1 (en) |
| CN (1) | CN106797712B (en) |
| SG (1) | SG11201701129PA (en) |
| TW (1) | TWI564984B (en) |
| WO (1) | WO2016024365A1 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6302891B2 (en) * | 2015-12-25 | 2018-03-28 | 白光株式会社 | Holding stand |
| TWI607207B (en) * | 2016-12-22 | 2017-12-01 | 矽品精密工業股份有限公司 | Mold packaging apparatus |
| WO2018154761A1 (en) * | 2017-02-27 | 2018-08-30 | 株式会社Ｆｕｊｉ | Load measurement system |
| TWI684235B (en) * | 2017-07-12 | 2020-02-01 | 日商新川股份有限公司 | Device and method for positioning a first object relative to a second object |
| JP7084738B2 (en) * | 2018-02-14 | 2022-06-15 | 川崎重工業株式会社 | Mounting device and mounting method |
| JP7120140B2 (en) | 2019-04-16 | 2022-08-17 | オムロン株式会社 | Control device and mounting device |
| JP7368962B2 (en) * | 2019-07-09 | 2023-10-25 | 芝浦メカトロニクス株式会社 | mounting equipment |
| JP6817648B1 (en) * | 2019-09-20 | 2021-01-20 | 上野精機株式会社 | Electronic component processing equipment |
| JP6842732B1 (en) * | 2020-09-24 | 2021-03-17 | 上野精機株式会社 | Electronic component processing equipment |
| CN112786523B (en) * | 2021-01-11 | 2022-06-03 | 北京航空航天大学 | Hot-pressing sintering clamp for chip packaging and chip packaging method |
| CN112802793A (en) * | 2021-02-09 | 2021-05-14 | 深圳市卓兴半导体科技有限公司 | Running mechanism and wafer adsorption device |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3035489B2 (en) * | 1995-08-25 | 2000-04-24 | 三菱電機株式会社 | Component mounting mechanism, device mounting mechanism, and component mounting method |
| US5985064A (en) | 1996-11-28 | 1999-11-16 | Matsushita Electric Industrial Co., Ltd. | Chip compression-bonding apparatus and method |
| JP3449139B2 (en) * | 1996-11-28 | 2003-09-22 | 松下電器産業株式会社 | Chip crimping equipment |
| JP3328878B2 (en) * | 1998-10-26 | 2002-09-30 | 澁谷工業株式会社 | Bonding equipment |
| JP4367740B2 (en) | 2000-07-26 | 2009-11-18 | 芝浦メカトロニクス株式会社 | Electronic component crimping equipment |
| JP2002043797A (en) * | 2000-07-28 | 2002-02-08 | Matsushita Electric Ind Co Ltd | Electronic parts mounting device |
| JP3762246B2 (en) * | 2001-04-04 | 2006-04-05 | Ｔｄｋ株式会社 | Processing equipment |
| TW559963B (en) * | 2001-06-08 | 2003-11-01 | Shibaura Mechatronics Corp | Pressuring apparatus of electronic device and its method |
| JP2004158743A (en) * | 2002-11-08 | 2004-06-03 | Juki Corp | Component holding device |
| JP4053898B2 (en) * | 2003-01-29 | 2008-02-27 | 株式会社モリテックス | Surface matching apparatus and surface matching method |
| JP4245138B2 (en) * | 2003-03-11 | 2009-03-25 | 富士通株式会社 | Substrate laminating apparatus and substrate laminating method |
| JP4522826B2 (en) * | 2004-11-17 | 2010-08-11 | Ｊｕｋｉ株式会社 | Electronic component crimping equipment |
| KR101210006B1 (en) * | 2005-06-13 | 2012-12-07 | 파나소닉 주식회사 | Semiconductor device bonding apparatus and method for bonding semiconductor device using the same |
| JP5068571B2 (en) * | 2007-03-29 | 2012-11-07 | 芝浦メカトロニクス株式会社 | Electronic component mounting equipment |
| JP2009027105A (en) | 2007-07-24 | 2009-02-05 | Shibuya Kogyo Co Ltd | Bonding device |
| EP2922378B1 (en) | 2012-11-16 | 2017-08-16 | Fuji Machine Mfg. Co., Ltd. | Work device and component mounting device |
-
2014
- 2014-09-29 JP JP2014198052A patent/JP5828943B1/en active Active
- 2014-10-15 SG SG11201701129PA patent/SG11201701129PA/en unknown
- 2014-10-15 KR KR1020177006626A patent/KR101842624B1/en active IP Right Grant
- 2014-10-15 CN CN201480082383.XA patent/CN106797712B/en active Active
- 2014-10-15 WO PCT/JP2014/077402 patent/WO2016024365A1/en active Application Filing
- 2014-11-06 TW TW103138459A patent/TWI564984B/en active
-
2017
- 2017-02-13 US US15/430,563 patent/US10181451B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016024365A1 (en) | 2016-02-18 |
| JP2016040821A (en) | 2016-03-24 |
| CN106797712A (en) | 2017-05-31 |
| KR20170041859A (en) | 2017-04-17 |
| US20170154865A1 (en) | 2017-06-01 |
| US10181451B2 (en) | 2019-01-15 |
| KR101842624B1 (en) | 2018-05-14 |
| TW201606900A (en) | 2016-02-16 |
| JP5828943B1 (en) | 2015-12-09 |
| CN106797712B (en) | 2019-07-30 |
| TWI564984B (en) | 2017-01-01 |
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