SG11201700887WA - Chemical-mechanical polishing composition comprising organic/inorganic composite particles - Google Patents
Chemical-mechanical polishing composition comprising organic/inorganic composite particlesInfo
- Publication number
- SG11201700887WA SG11201700887WA SG11201700887WA SG11201700887WA SG11201700887WA SG 11201700887W A SG11201700887W A SG 11201700887WA SG 11201700887W A SG11201700887W A SG 11201700887WA SG 11201700887W A SG11201700887W A SG 11201700887WA SG 11201700887W A SG11201700887W A SG 11201700887WA
- Authority
- SG
- Singapore
- Prior art keywords
- organic
- chemical
- mechanical polishing
- composite particles
- polishing composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462035533P | 2014-08-11 | 2014-08-11 | |
| PCT/IB2015/055608 WO2016024177A1 (en) | 2014-08-11 | 2015-07-24 | Chemical-mechanical polishing composition comprising organic/inorganic composite particles |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201700887WA true SG11201700887WA (en) | 2017-03-30 |
Family
ID=55303915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201700887WA SG11201700887WA (en) | 2014-08-11 | 2015-07-24 | Chemical-mechanical polishing composition comprising organic/inorganic composite particles |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10214663B2 (en) |
| EP (1) | EP3180406A4 (en) |
| JP (1) | JP6804435B2 (en) |
| KR (1) | KR102485534B1 (en) |
| CN (1) | CN106795420A (en) |
| SG (1) | SG11201700887WA (en) |
| TW (1) | TWI675098B (en) |
| WO (1) | WO2016024177A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10128146B2 (en) * | 2015-08-20 | 2018-11-13 | Globalwafers Co., Ltd. | Semiconductor substrate polishing methods and slurries and methods for manufacturing silicon on insulator structures |
| JP6280678B1 (en) * | 2016-12-22 | 2018-02-14 | 三井金属鉱業株式会社 | Polishing liquid and polishing method |
| FR3062075B1 (en) * | 2017-01-25 | 2021-09-10 | Commissariat Energie Atomique | INORGANIC PROTON CONDUCTING PARTICLES, PROCESS FOR PREPARING THEIR PREPARATION AND USE OF THEIR TO CONSTITUTE A FUEL CELL MEMBRANE |
| FR3062122B1 (en) * | 2017-01-25 | 2019-04-19 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | INORGANIC CONDUCTIVE PARTICLES OF FLUORINATED PROTONS AND USE OF SUCH PARTICLES IN PROTON-CONDUCTIVE MEMBRANES |
| KR102343435B1 (en) * | 2018-08-08 | 2021-12-24 | 삼성에스디아이 주식회사 | Cmp slurry composition for polishing copper layer and method for polishing copper layer using the same |
| CN110577823B (en) * | 2018-08-20 | 2021-10-12 | 蓝思科技（长沙）有限公司 | Nano abrasive, polishing solution, preparation method and application |
| TWI745704B (en) * | 2019-06-21 | 2021-11-11 | 國立陽明交通大學 | Nio chip and the preparing method and use thereof |
| CN113549424B (en) * | 2021-08-04 | 2022-05-13 | 白鸽磨料磨具有限公司 | Cerium oxide cluster powder for polishing and preparation method thereof |
| CN114456716B (en) * | 2022-01-14 | 2022-10-25 | 华东理工大学 | Aluminum oxide polishing solution for polishing sapphire and preparation method thereof |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4075247B2 (en) | 1999-09-30 | 2008-04-16 | Ｊｓｒ株式会社 | Aqueous dispersion for chemical mechanical polishing |
| DE60131080T2 (en) * | 2000-05-31 | 2008-07-31 | Jsr Corp. | GRINDING MATERIAL |
| EP1211024A3 (en) * | 2000-11-30 | 2004-01-02 | JSR Corporation | Polishing method |
| JP4187497B2 (en) | 2002-01-25 | 2008-11-26 | Ｊｓｒ株式会社 | Chemical mechanical polishing method for semiconductor substrate |
| US20040162011A1 (en) | 2002-08-02 | 2004-08-19 | Jsr Corporation | Aqueous dispersion for chemical mechanical polishing and production process of semiconductor device |
| US20040175942A1 (en) | 2003-01-03 | 2004-09-09 | Chang Song Y. | Composition and method used for chemical mechanical planarization of metals |
| US6939211B2 (en) * | 2003-10-09 | 2005-09-06 | Micron Technology, Inc. | Planarizing solutions including abrasive elements, and methods for manufacturing and using such planarizing solutions |
| US20060205219A1 (en) * | 2005-03-08 | 2006-09-14 | Baker Arthur R Iii | Compositions and methods for chemical mechanical polishing interlevel dielectric layers |
| TW200714697A (en) | 2005-08-24 | 2007-04-16 | Jsr Corp | Aqueous dispersion for chemical mechanical polish, kit for formulating the aqueous dispersion, chemical mechanical polishing method and method for producing semiconductor device |
| TWI387643B (en) * | 2006-12-29 | 2013-03-01 | Lg Chemical Ltd | Cmp slurry composition for forming metal wiring line |
| JP2008288509A (en) * | 2007-05-21 | 2008-11-27 | Fujifilm Corp | Polishing solution for metal |
| JP5327427B2 (en) | 2007-06-19 | 2013-10-30 | Ｊｓｒ株式会社 | Chemical mechanical polishing aqueous dispersion preparation set, chemical mechanical polishing aqueous dispersion preparation method, chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method |
| US9202709B2 (en) * | 2008-03-19 | 2015-12-01 | Fujifilm Corporation | Polishing liquid for metal and polishing method using the same |
| US8900473B2 (en) * | 2008-08-06 | 2014-12-02 | Hitachi Chemical Company, Ltd. | Polishing solution for CMP, and method for polishing substrate using the polishing solution for CMP |
| US8366959B2 (en) | 2008-09-26 | 2013-02-05 | Rhodia Operations | Abrasive compositions for chemical mechanical polishing and methods for using same |
| KR20140014366A (en) * | 2009-04-15 | 2014-02-06 | 바스프 에스이 | Method for producing an aqueous composite particle dispersion |
| EP2427523B1 (en) * | 2009-05-06 | 2015-10-28 | Basf Se | An aqueous metal polishing agent comprising a polymeric abrasive containing pendant functional groups and its use in a cmp process |
| US9309448B2 (en) * | 2010-02-24 | 2016-04-12 | Basf Se | Abrasive articles, method for their preparation and method of their use |
| CN101870851B (en) | 2010-06-02 | 2013-01-30 | 浙江工业大学 | Chemico-mechanical polishing liquid and polishing method |
| JP6096670B2 (en) * | 2010-12-10 | 2017-03-15 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | Aqueous polishing composition and method for chemically and mechanically polishing a substrate containing a silicon oxide dielectric film and a polysilicon film |
| US20130186850A1 (en) * | 2012-01-24 | 2013-07-25 | Applied Materials, Inc. | Slurry for cobalt applications |
| US9982166B2 (en) * | 2013-12-20 | 2018-05-29 | Cabot Corporation | Metal oxide-polymer composite particles for chemical mechanical planarization |
-
2015
- 2015-07-24 SG SG11201700887WA patent/SG11201700887WA/en unknown
- 2015-07-24 US US15/502,932 patent/US10214663B2/en active Active
- 2015-07-24 CN CN201580043020.XA patent/CN106795420A/en active Pending
- 2015-07-24 KR KR1020177006820A patent/KR102485534B1/en active IP Right Grant
- 2015-07-24 EP EP15831838.6A patent/EP3180406A4/en active Pending
- 2015-07-24 WO PCT/IB2015/055608 patent/WO2016024177A1/en active Application Filing
- 2015-07-24 JP JP2017507975A patent/JP6804435B2/en active Active
- 2015-08-06 TW TW104125557A patent/TWI675098B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| US20170226381A1 (en) | 2017-08-10 |
| CN106795420A (en) | 2017-05-31 |
| WO2016024177A1 (en) | 2016-02-18 |
| TWI675098B (en) | 2019-10-21 |
| JP6804435B2 (en) | 2020-12-23 |
| US10214663B2 (en) | 2019-02-26 |
| EP3180406A4 (en) | 2018-04-11 |
| KR102485534B1 (en) | 2023-01-06 |
| JP2017530215A (en) | 2017-10-12 |
| KR20170041888A (en) | 2017-04-17 |
| EP3180406A1 (en) | 2017-06-21 |
| TW201610128A (en) | 2016-03-16 |
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