SG11201700026XA - Cleaning device and roll cleaning member - Google Patents
Cleaning device and roll cleaning memberInfo
- Publication number
- SG11201700026XA SG11201700026XA SG11201700026XA SG11201700026XA SG11201700026XA SG 11201700026X A SG11201700026X A SG 11201700026XA SG 11201700026X A SG11201700026X A SG 11201700026XA SG 11201700026X A SG11201700026X A SG 11201700026XA SG 11201700026X A SG11201700026X A SG 11201700026XA
- Authority
- SG
- Singapore
- Prior art keywords
- cleaning
- roll
- cleaning device
- cleaning member
- roll cleaning
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B13/00—Brushes with driven brush bodies or carriers
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B13/00—Brushes with driven brush bodies or carriers
- A46B13/001—Cylindrical or annular brush bodies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
- B08B11/02—Devices for holding articles during cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02096—Cleaning only mechanical cleaning
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Rolls And Other Rotary Bodies (AREA)
- Photoreceptors In Electrophotography (AREA)
- Cleaning In General (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014138685 | 2014-07-04 | ||
JP2015129639A JP6366544B2 (en) | 2014-07-04 | 2015-06-29 | Cleaning device and roll cleaning member |
PCT/JP2015/003314 WO2016002219A1 (en) | 2014-07-04 | 2015-07-01 | Cleaning device and roll cleaning member |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201700026XA true SG11201700026XA (en) | 2017-02-27 |
Family
ID=55018792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201700026XA SG11201700026XA (en) | 2014-07-04 | 2015-07-01 | Cleaning device and roll cleaning member |
Country Status (8)
Country | Link |
---|---|
US (1) | US10453708B2 (en) |
JP (1) | JP6366544B2 (en) |
KR (1) | KR102282899B1 (en) |
CN (1) | CN106663620B (en) |
MY (1) | MY176791A (en) |
SG (1) | SG11201700026XA (en) |
TW (1) | TWI686868B (en) |
WO (1) | WO2016002219A1 (en) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10269555B2 (en) * | 2015-09-30 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Post-CMP cleaning and apparatus |
WO2019138881A1 (en) * | 2018-01-09 | 2019-07-18 | 東京エレクトロン株式会社 | Cleaning device, cleaning method, and computer memory medium |
USD923890S1 (en) * | 2018-09-07 | 2021-06-29 | Maradyne Corporation | Mattress surface cleaning agitator |
CN109007900B (en) * | 2018-09-20 | 2023-09-12 | 安徽科技学院 | Kelp nondestructive cleaning device and cleaning method thereof |
USD906683S1 (en) * | 2019-03-11 | 2021-01-05 | Ali Ebrahimi Afrouzi | Side brush |
USD906681S1 (en) * | 2019-03-11 | 2021-01-05 | Ali Ebrahimi Afrouzi | Side brush |
USD906680S1 (en) * | 2019-03-11 | 2021-01-05 | Ali Ebrahimi Afrouzi | Side brush |
USD897111S1 (en) * | 2019-03-11 | 2020-09-29 | Ali Ebrahimi Afrouzi | Side brush |
USD906682S1 (en) * | 2019-03-11 | 2021-01-05 | Ali Ebrahimi Afrouzi | Side brush |
USD897112S1 (en) * | 2019-03-25 | 2020-09-29 | Ali Ebrahimi Afrouzi | Side brush |
USD906684S1 (en) * | 2019-03-28 | 2021-01-05 | Ali Ebrahimi Afrouzi | Side brush |
USD906685S1 (en) * | 2019-04-02 | 2021-01-05 | Ali Ebrahimi Afrouzi | Side brush |
USD907370S1 (en) * | 2019-04-05 | 2021-01-12 | Ali Ebrahimi Afrouzi | Side brush |
USD907925S1 (en) * | 2019-04-23 | 2021-01-19 | Ali Ebrahimi Afrouzi | Side brush |
USD897113S1 (en) * | 2019-04-25 | 2020-09-29 | Ali Ebrahimi Afrouzi | Side brush |
USD906686S1 (en) * | 2019-04-30 | 2021-01-05 | Ali Ebrahimi Afrouzi | Side brush |
USD907371S1 (en) * | 2019-05-03 | 2021-01-12 | Ali Ebrahimi Afrouzi | Side brush |
USD907372S1 (en) * | 2019-06-10 | 2021-01-12 | Ali Ebrahimi Afrouzi | Side brush |
USD907926S1 (en) * | 2019-06-10 | 2021-01-19 | Ali Ebrahimi Afrouzi | Side brush |
CN111790682B (en) * | 2020-06-30 | 2022-06-28 | 鹰潭拓新机电股份有限公司 | Mould part belt cleaning device |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3403108B2 (en) * | 1999-02-26 | 2003-05-06 | アイオン株式会社 | Sponge roller for cleaning |
US6502273B1 (en) | 1996-11-08 | 2003-01-07 | Kanebo, Ltd. | Cleaning sponge roller |
US6299698B1 (en) | 1998-07-10 | 2001-10-09 | Applied Materials, Inc. | Wafer edge scrubber and method |
JP2000270929A (en) * | 1999-03-26 | 2000-10-03 | Shibaura Mechatronics Corp | Washing brush |
JP4965253B2 (en) * | 2003-08-08 | 2012-07-04 | インテグリス・インコーポレーテッド | Methods and materials for making monolithic porous pads cast on a rotatable base |
US20050109371A1 (en) * | 2003-10-27 | 2005-05-26 | Applied Materials, Inc. | Post CMP scrubbing of substrates |
JP2006075718A (en) | 2004-09-09 | 2006-03-23 | Aion Kk | Elastic roller |
JP2008311481A (en) * | 2007-06-15 | 2008-12-25 | Sony Corp | Substrate cleaning method, substrate cleaning device, and semiconductor manufacturing method |
JP2009066527A (en) * | 2007-09-13 | 2009-04-02 | Nec Electronics Corp | Washing roller and washing apparatus |
US20100043160A1 (en) * | 2008-08-20 | 2010-02-25 | United Microelectronics Corp. | Wafer cleaning roller |
WO2011103538A2 (en) | 2010-02-22 | 2011-08-25 | Entegris,Inc. | Post-cmp cleaning brush |
JP5535687B2 (en) | 2010-03-01 | 2014-07-02 | 株式会社荏原製作所 | Substrate cleaning method and substrate cleaning apparatus |
JP2011233646A (en) * | 2010-04-26 | 2011-11-17 | Sumitomo Metal Mining Co Ltd | Method of washing semiconductor substrate |
-
2015
- 2015-06-29 JP JP2015129639A patent/JP6366544B2/en active Active
- 2015-07-01 KR KR1020177002741A patent/KR102282899B1/en active IP Right Grant
- 2015-07-01 SG SG11201700026XA patent/SG11201700026XA/en unknown
- 2015-07-01 WO PCT/JP2015/003314 patent/WO2016002219A1/en active Application Filing
- 2015-07-01 MY MYPI2016704827A patent/MY176791A/en unknown
- 2015-07-01 US US15/322,480 patent/US10453708B2/en active Active
- 2015-07-01 CN CN201580036679.2A patent/CN106663620B/en active Active
- 2015-07-03 TW TW104121628A patent/TWI686868B/en active
Also Published As
Publication number | Publication date |
---|---|
JP2016027641A (en) | 2016-02-18 |
MY176791A (en) | 2020-08-21 |
JP6366544B2 (en) | 2018-08-01 |
US10453708B2 (en) | 2019-10-22 |
CN106663620A (en) | 2017-05-10 |
US20170170034A1 (en) | 2017-06-15 |
KR102282899B1 (en) | 2021-07-27 |
TW201604962A (en) | 2016-02-01 |
TWI686868B (en) | 2020-03-01 |
KR20170029536A (en) | 2017-03-15 |
CN106663620B (en) | 2020-03-27 |
WO2016002219A1 (en) | 2016-01-07 |
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