SG11201609401YA - Lift pin assembly - Google Patents
Lift pin assemblyInfo
- Publication number
- SG11201609401YA SG11201609401YA SG11201609401YA SG11201609401YA SG11201609401YA SG 11201609401Y A SG11201609401Y A SG 11201609401YA SG 11201609401Y A SG11201609401Y A SG 11201609401YA SG 11201609401Y A SG11201609401Y A SG 11201609401YA SG 11201609401Y A SG11201609401Y A SG 11201609401YA
- Authority
- SG
- Singapore
- Prior art keywords
- pin assembly
- lift pin
- lift
- assembly
- pin
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/12—Substrate holders or susceptors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Conveying And Assembling Of Building Elements In Situ (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462006846P | 2014-06-02 | 2014-06-02 | |
US14/450,241 US10892180B2 (en) | 2014-06-02 | 2014-08-02 | Lift pin assembly |
PCT/US2015/032905 WO2015187453A1 (en) | 2014-06-02 | 2015-05-28 | Lift pin assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201609401YA true SG11201609401YA (en) | 2016-12-29 |
Family
ID=54702634
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201810737TA SG10201810737TA (en) | 2014-06-02 | 2015-05-28 | Lift pin assembly |
SG11201609401YA SG11201609401YA (en) | 2014-06-02 | 2015-05-28 | Lift pin assembly |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201810737TA SG10201810737TA (en) | 2014-06-02 | 2015-05-28 | Lift pin assembly |
Country Status (7)
Country | Link |
---|---|
US (1) | US10892180B2 (en) |
JP (1) | JP6681345B2 (en) |
KR (1) | KR102423183B1 (en) |
CN (2) | CN106463323B (en) |
SG (2) | SG10201810737TA (en) |
TW (1) | TWI714530B (en) |
WO (1) | WO2015187453A1 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11688589B2 (en) | 2013-06-10 | 2023-06-27 | View, Inc. | Carrier with vertical grid for supporting substrates in coater |
WO2014200927A1 (en) * | 2013-06-10 | 2014-12-18 | View, Inc. | Glass pallet for sputtering systems |
CN105256283B (en) * | 2015-10-30 | 2017-08-11 | 京东方科技集团股份有限公司 | A kind of substrate fixes carrier, the fixedly separated method of substrate and substrate evaporation coating method |
US10068792B2 (en) * | 2016-05-31 | 2018-09-04 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
US10460977B2 (en) * | 2016-09-29 | 2019-10-29 | Lam Research Corporation | Lift pin holder with spring retention for substrate processing systems |
US20180218905A1 (en) * | 2017-02-02 | 2018-08-02 | Applied Materials, Inc. | Applying equalized plasma coupling design for mura free susceptor |
EP3450809A1 (en) * | 2017-08-31 | 2019-03-06 | VAT Holding AG | Adjustment device with tensioning jaw coupling for the vacuum area |
KR20190029365A (en) * | 2017-09-12 | 2019-03-20 | 삼성전자주식회사 | Lift pin assembly, substrate support apparatus and substrate processing apparatus having the same |
US11075105B2 (en) * | 2017-09-21 | 2021-07-27 | Applied Materials, Inc. | In-situ apparatus for semiconductor process module |
US10535549B2 (en) * | 2017-10-27 | 2020-01-14 | Applied Materials, Inc. | Lift pin holder |
JP6770988B2 (en) * | 2018-03-14 | 2020-10-21 | 株式会社Kokusai Electric | Manufacturing method for substrate processing equipment and semiconductor equipment |
CN111986976B (en) | 2019-05-22 | 2022-04-22 | 北京北方华创微电子装备有限公司 | Process chamber and semiconductor processing equipment |
CN110648958B (en) * | 2019-09-26 | 2022-04-08 | 京东方科技集团股份有限公司 | Substrate support table and substrate preparation device |
KR20210076345A (en) | 2019-12-16 | 2021-06-24 | 삼성전자주식회사 | Lift pin module |
US20220336258A1 (en) * | 2021-04-16 | 2022-10-20 | Applied Materials, Inc. | Apparatus for controlling lift pin movement |
CN115497866A (en) * | 2021-06-18 | 2022-12-20 | 中微半导体设备(上海)股份有限公司 | Lifting thimble assembly and plasma reaction device |
Family Cites Families (67)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US725662A (en) * | 1902-08-16 | 1903-04-21 | John Bohlen | Sash-fastener. |
JP3249765B2 (en) * | 1997-05-07 | 2002-01-21 | 東京エレクトロン株式会社 | Substrate processing equipment |
US4592682A (en) * | 1984-09-10 | 1986-06-03 | Davan Industries | Wear pads |
GB2261650A (en) | 1991-11-21 | 1993-05-26 | Lanesfield Engineering Seals L | Lifting pin |
KR100260587B1 (en) * | 1993-06-01 | 2000-08-01 | 히가시 데쓰로 | Electrostatic chuck |
JP3356354B2 (en) * | 1994-05-30 | 2002-12-16 | 東京エレクトロン株式会社 | Processing equipment |
JP2804003B2 (en) * | 1995-04-06 | 1998-09-24 | 日本ピラー工業株式会社 | Semiconductor wafer heat treatment equipment |
JP3028462B2 (en) | 1995-05-12 | 2000-04-04 | 東京エレクトロン株式会社 | Heat treatment equipment |
JPH09205130A (en) * | 1996-01-17 | 1997-08-05 | Applied Materials Inc | Wafer supporting device |
US6120609A (en) * | 1996-10-25 | 2000-09-19 | Applied Materials, Inc. | Self-aligning lift mechanism |
US5848670A (en) * | 1996-12-04 | 1998-12-15 | Applied Materials, Inc. | Lift pin guidance apparatus |
JP3602324B2 (en) * | 1998-02-17 | 2004-12-15 | アルプス電気株式会社 | Plasma processing equipment |
US6146463A (en) * | 1998-06-12 | 2000-11-14 | Applied Materials, Inc. | Apparatus and method for aligning a substrate on a support member |
JP4175697B2 (en) * | 1998-06-18 | 2008-11-05 | オリンパス株式会社 | Glass substrate holder |
US6182955B1 (en) * | 1998-07-03 | 2001-02-06 | Alvin Jay Kimble | Grid-lock vacuum clamping system |
US6305677B1 (en) * | 1999-03-30 | 2001-10-23 | Lam Research Corporation | Perimeter wafer lifting |
JP3398936B2 (en) * | 1999-04-09 | 2003-04-21 | 日本エー・エス・エム株式会社 | Semiconductor processing equipment |
JP4450983B2 (en) * | 1999-12-22 | 2010-04-14 | 東京エレクトロン株式会社 | Plasma processing equipment for liquid crystal display substrate |
US6958098B2 (en) * | 2000-02-28 | 2005-10-25 | Applied Materials, Inc. | Semiconductor wafer support lift-pin assembly |
JP3736264B2 (en) | 2000-02-29 | 2006-01-18 | セイコーエプソン株式会社 | Plasma processing apparatus and plasma processing method |
EP1174910A3 (en) * | 2000-07-20 | 2010-01-06 | Applied Materials, Inc. | Method and apparatus for dechucking a substrate |
JP2002134596A (en) * | 2000-10-25 | 2002-05-10 | Tokyo Electron Ltd | Processor |
US6439559B1 (en) * | 2000-12-05 | 2002-08-27 | Bay View Industries, Inc. | Vacuum control device for holding a workpiece |
JP4860078B2 (en) | 2001-09-27 | 2012-01-25 | 東京エレクトロン株式会社 | Plasma processing apparatus and plasma processing method |
JP4244555B2 (en) * | 2002-02-25 | 2009-03-25 | 東京エレクトロン株式会社 | Support mechanism for workpiece |
JP2004026365A (en) * | 2002-06-24 | 2004-01-29 | Dainippon Printing Co Ltd | Working platform |
US6887317B2 (en) * | 2002-09-10 | 2005-05-03 | Applied Materials, Inc. | Reduced friction lift pin |
US6917755B2 (en) * | 2003-02-27 | 2005-07-12 | Applied Materials, Inc. | Substrate support |
US20050160992A1 (en) * | 2004-01-28 | 2005-07-28 | Applied Materials, Inc. | Substrate gripping apparatus |
US20050241767A1 (en) * | 2004-04-30 | 2005-11-03 | Ferris David S | Multi-piece baffle plate assembly for a plasma processing system |
US20060005770A1 (en) * | 2004-07-09 | 2006-01-12 | Robin Tiner | Independently moving substrate supports |
US20060130767A1 (en) * | 2004-12-22 | 2006-06-22 | Applied Materials, Inc. | Purged vacuum chuck with proximity pins |
US20060156981A1 (en) | 2005-01-18 | 2006-07-20 | Kyle Fondurulia | Wafer support pin assembly |
KR20060108975A (en) * | 2005-04-14 | 2006-10-19 | 삼성전자주식회사 | Wafer loading apparatus for preventing local defocus |
JP2006344705A (en) | 2005-06-08 | 2006-12-21 | Lasertec Corp | Stage device of substrate, inspecting device, and correcting device |
JP2007067101A (en) * | 2005-08-30 | 2007-03-15 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus |
KR100734296B1 (en) * | 2005-12-19 | 2007-07-02 | 삼성전자주식회사 | Socket pin having a self cleaning function and test apparatus including the socket pin |
JP4698407B2 (en) * | 2005-12-20 | 2011-06-08 | 大日本スクリーン製造株式会社 | Substrate processing apparatus and substrate processing method |
US7638003B2 (en) | 2006-01-12 | 2009-12-29 | Asm Japan K.K. | Semiconductor processing apparatus with lift pin structure |
US7665951B2 (en) * | 2006-06-02 | 2010-02-23 | Applied Materials, Inc. | Multiple slot load lock chamber and method of operation |
KR20080015194A (en) * | 2006-08-14 | 2008-02-19 | 동부일렉트로닉스 주식회사 | Two stage pin structure of wafer stage and wafer loading method |
US9218944B2 (en) * | 2006-10-30 | 2015-12-22 | Applied Materials, Inc. | Mask etch plasma reactor having an array of optical sensors viewing the workpiece backside and a tunable element controlled in response to the optical sensors |
US7750818B2 (en) * | 2006-11-29 | 2010-07-06 | Adp Engineering Co., Ltd. | System and method for introducing a substrate into a process chamber |
JP4824588B2 (en) * | 2007-01-22 | 2011-11-30 | 株式会社アルバック | Substrate alignment device |
JP2008282858A (en) * | 2007-05-08 | 2008-11-20 | Ulvac Japan Ltd | Pin for supporting substrate |
US7754518B2 (en) * | 2008-02-15 | 2010-07-13 | Applied Materials, Inc. | Millisecond annealing (DSA) edge protection |
US20090314211A1 (en) * | 2008-06-24 | 2009-12-24 | Applied Materials, Inc. | Big foot lift pin |
US8218284B2 (en) * | 2008-07-24 | 2012-07-10 | Hermes-Microvision, Inc. | Apparatus for increasing electric conductivity to a semiconductor wafer substrate when exposure to electron beam |
US8652260B2 (en) * | 2008-08-08 | 2014-02-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus for holding semiconductor wafers |
US7964038B2 (en) * | 2008-10-02 | 2011-06-21 | Applied Materials, Inc. | Apparatus for improved azimuthal thermal uniformity of a substrate |
US7952851B2 (en) * | 2008-10-31 | 2011-05-31 | Axcelis Technologies, Inc. | Wafer grounding method for electrostatic clamps |
US9011602B2 (en) * | 2009-01-29 | 2015-04-21 | Lam Research Corporation | Pin lifting system |
KR20100100269A (en) * | 2009-03-06 | 2010-09-15 | 주식회사 코미코 | Lift pin and apparatus for processing a wafer including the same |
CN102460650B (en) * | 2009-06-24 | 2014-10-01 | 佳能安内华股份有限公司 | Vacuum heating/cooling apparatus and method of producing magnetoresistive element |
WO2011009007A2 (en) * | 2009-07-15 | 2011-01-20 | Applied Materials, Inc. | Improved lift pin guides |
KR101536257B1 (en) * | 2009-07-22 | 2015-07-13 | 한국에이에스엠지니텍 주식회사 | Lateral-flow deposition apparatus and method of depositing film by using the apparatus |
WO2011017226A2 (en) * | 2009-08-07 | 2011-02-10 | Applied Materials, Inc. | Compound lift pin tip with temperature compensated attachment feature |
DE102010056021B3 (en) * | 2010-12-23 | 2012-04-19 | Centrotherm Sitec Gmbh | Nozzle assembly useful in a chemical vapor deposition reactor, comprises a nozzle body having an inlet, an outlet and a flow space between the inlet and outlet, and a control unit having an adjusting member and a fixing part |
US9371584B2 (en) * | 2011-03-09 | 2016-06-21 | Applied Materials, Inc. | Processing chamber and method for centering a substrate therein |
WO2013054776A1 (en) * | 2011-10-13 | 2013-04-18 | 株式会社アルバック | Vacuum treatment device |
US8998191B2 (en) * | 2011-10-27 | 2015-04-07 | GM Global Technology Operations LLC | Flexible support assembly for vehicle tooling plates |
US9564348B2 (en) * | 2013-03-15 | 2017-02-07 | Applied Materials, Inc. | Shutter blade and robot blade with CTE compensation |
US10431489B2 (en) | 2013-12-17 | 2019-10-01 | Applied Materials, Inc. | Substrate support apparatus having reduced substrate particle generation |
US9248536B2 (en) * | 2014-02-12 | 2016-02-02 | Texas Instruments Incorporated | Turntable |
KR102498784B1 (en) * | 2014-12-11 | 2023-02-09 | 어플라이드 머티어리얼스, 인코포레이티드 | Electrostatic chuck for high temperature rf applications |
US20170140975A1 (en) * | 2015-11-17 | 2017-05-18 | Semes Co., Ltd. | Spin head, apparatus and method for treating a substrate including the spin head |
KR20200135550A (en) * | 2018-04-18 | 2020-12-02 | 어플라이드 머티어리얼스, 인코포레이티드 | Two-piece shutter disc assembly with self-centering feature |
-
2014
- 2014-08-02 US US14/450,241 patent/US10892180B2/en active Active
-
2015
- 2015-05-21 TW TW104116299A patent/TWI714530B/en active
- 2015-05-28 SG SG10201810737TA patent/SG10201810737TA/en unknown
- 2015-05-28 KR KR1020167037044A patent/KR102423183B1/en active IP Right Grant
- 2015-05-28 CN CN201580026810.7A patent/CN106463323B/en active Active
- 2015-05-28 SG SG11201609401YA patent/SG11201609401YA/en unknown
- 2015-05-28 WO PCT/US2015/032905 patent/WO2015187453A1/en active Application Filing
- 2015-05-28 JP JP2016571032A patent/JP6681345B2/en active Active
- 2015-05-28 CN CN201811109709.XA patent/CN109390270B/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR102423183B1 (en) | 2022-07-19 |
CN109390270A (en) | 2019-02-26 |
KR20170013951A (en) | 2017-02-07 |
CN106463323B (en) | 2019-01-29 |
WO2015187453A1 (en) | 2015-12-10 |
US10892180B2 (en) | 2021-01-12 |
TW201601245A (en) | 2016-01-01 |
TWI714530B (en) | 2021-01-01 |
US20150348823A1 (en) | 2015-12-03 |
JP2017519365A (en) | 2017-07-13 |
JP6681345B2 (en) | 2020-04-15 |
CN106463323A (en) | 2017-02-22 |
CN109390270B (en) | 2023-04-11 |
SG10201810737TA (en) | 2019-01-30 |
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