SG11201605469PA - Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes - Google Patents
Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processesInfo
- Publication number
- SG11201605469PA SG11201605469PA SG11201605469PA SG11201605469PA SG11201605469PA SG 11201605469P A SG11201605469P A SG 11201605469PA SG 11201605469P A SG11201605469P A SG 11201605469PA SG 11201605469P A SG11201605469P A SG 11201605469PA SG 11201605469P A SG11201605469P A SG 11201605469PA
- Authority
- SG
- Singapore
- Prior art keywords
- cyclic olefin
- olefin polymer
- polymer compositions
- wafer bonding
- release layers
- Prior art date
Links
- 229920000089 Cyclic olefin copolymer Polymers 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- -1 polysiloxane Polymers 0.000 title 1
- 229920001296 polysiloxane Polymers 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
- H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/325—Layered products comprising a layer of synthetic resin comprising polyolefins comprising polycycloolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201461924442P | 2014-01-07 | 2014-01-07 | |
US201461952945P | 2014-03-14 | 2014-03-14 | |
PCT/US2015/010290 WO2015105785A1 (en) | 2014-01-07 | 2015-01-06 | Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201605469PA true SG11201605469PA (en) | 2016-08-30 |
Family
ID=53495770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201605469PA SG11201605469PA (en) | 2014-01-07 | 2015-01-06 | Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes |
Country Status (8)
Country | Link |
---|---|
US (1) | US9496164B2 (en) |
EP (1) | EP3092658A4 (en) |
JP (1) | JP6687523B2 (en) |
KR (1) | KR102351530B1 (en) |
CN (1) | CN106068551B (en) |
SG (1) | SG11201605469PA (en) |
TW (1) | TWI698344B (en) |
WO (1) | WO2015105785A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5975918B2 (en) * | 2013-03-27 | 2016-08-23 | 富士フイルム株式会社 | Laminate for temporary bonding for manufacturing semiconductor device and method for manufacturing semiconductor device |
JP6050170B2 (en) * | 2013-03-27 | 2016-12-21 | 富士フイルム株式会社 | Laminate for temporary bonding for manufacturing semiconductor device and method for manufacturing semiconductor device |
CN113380928A (en) * | 2014-10-22 | 2021-09-10 | 安相贞 | Method for manufacturing semiconductor device |
US20160133486A1 (en) | 2014-11-07 | 2016-05-12 | International Business Machines Corporation | Double Layer Release Temporary Bond and Debond Processes and Systems |
JP6691504B2 (en) * | 2016-05-12 | 2020-04-28 | 信越化学工業株式会社 | Wafer processed body, method for manufacturing the same, and method for confirming coatability of organic film on wafer |
FR3052098B1 (en) * | 2016-06-03 | 2019-08-09 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | METHOD FOR MANUFACTURING HANDLING DEVICE, HANDLING DEVICE, AND REVERSIBLE BONDING METHOD USING SUCH DEVICE |
US10784100B2 (en) * | 2016-07-21 | 2020-09-22 | Tokyo Electron Limited | Back-side friction reduction of a substrate |
US10617010B2 (en) | 2016-08-29 | 2020-04-07 | Brewer Science, Inc. | Polymer film stencil process for fan-out wafer-level packaging of semiconductor devices |
EP3727838B1 (en) * | 2017-12-22 | 2023-08-09 | Brewer Science, Inc. | Laser-releasable bonding materials for 3-d ic applications |
FR3078821B1 (en) | 2018-03-09 | 2020-04-03 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | METHOD FOR PRODUCING A SOLDERING BALL ON A FACE OF A SUBSTRATE |
WO2020066871A1 (en) | 2018-09-26 | 2020-04-02 | 富士フイルム株式会社 | Curable composition, cured film, method for forming pattern, optical filter and photosensor |
EP3914663A4 (en) * | 2019-01-22 | 2022-09-14 | Brewer Science Inc. | Laser-releasable bonding materials for 3-d ic applications |
Family Cites Families (27)
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US4332923A (en) | 1980-10-23 | 1982-06-01 | Dow Corning Corporation | Composition for coating heat sensitive substrates |
US6523803B1 (en) | 1998-09-03 | 2003-02-25 | Micron Technology, Inc. | Mold apparatus used during semiconductor device fabrication |
US6345881B1 (en) | 1999-09-29 | 2002-02-12 | Eastman Kodak Company | Coating of printhead nozzle plate |
JP2005064239A (en) * | 2003-08-12 | 2005-03-10 | Lintec Corp | Manufacturing method of semiconductor device |
US8268449B2 (en) | 2006-02-06 | 2012-09-18 | Brewer Science Inc. | Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive |
US7713835B2 (en) | 2006-10-06 | 2010-05-11 | Brewer Science Inc. | Thermally decomposable spin-on bonding compositions for temporary wafer bonding |
US20080200011A1 (en) | 2006-10-06 | 2008-08-21 | Pillalamarri Sunil K | High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach |
US7935780B2 (en) | 2007-06-25 | 2011-05-03 | Brewer Science Inc. | High-temperature spin-on temporary bonding compositions |
JP5111620B2 (en) | 2008-01-24 | 2013-01-09 | ブルーワー サイエンス アイ エヌ シー. | Method of mounting device wafer reversely on carrier substrate |
US8822560B2 (en) * | 2008-10-29 | 2014-09-02 | 3M Innovative Properties Company | Electron beam cured silicone release materials |
US8092628B2 (en) | 2008-10-31 | 2012-01-10 | Brewer Science Inc. | Cyclic olefin compositions for temporary wafer bonding |
JP2010153570A (en) * | 2008-12-25 | 2010-07-08 | Nippon Zeon Co Ltd | Solar battery module |
EP2552399A1 (en) | 2010-04-01 | 2013-02-06 | The Procter & Gamble Company | Care polymers |
US8852391B2 (en) * | 2010-06-21 | 2014-10-07 | Brewer Science Inc. | Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate |
US9263314B2 (en) * | 2010-08-06 | 2016-02-16 | Brewer Science Inc. | Multiple bonding layers for thin-wafer handling |
CN103403855B (en) * | 2011-02-28 | 2017-02-22 | 道康宁公司 | Wafer bonding system and method for bonding and debonding thereof |
JP5846060B2 (en) * | 2011-07-27 | 2016-01-20 | 信越化学工業株式会社 | Wafer processing body, wafer processing member, wafer processing temporary adhesive, and thin wafer manufacturing method |
WO2013119976A1 (en) * | 2012-02-08 | 2013-08-15 | Brewer Science Inc. | Fluorinated silane coating compositions for thin wafer bonding and handling |
JP2013172033A (en) * | 2012-02-21 | 2013-09-02 | Tokyo Ohka Kogyo Co Ltd | Separation method and laminate structure |
JP2014017462A (en) * | 2012-03-02 | 2014-01-30 | Fujifilm Corp | Semiconductor device manufacturing method |
JP5942539B2 (en) * | 2012-03-29 | 2016-06-29 | 日本ゼオン株式会社 | Optical resin composition |
JP5909460B2 (en) * | 2012-09-28 | 2016-04-26 | 富士フイルム株式会社 | A temporary adhesive for manufacturing a semiconductor device, an adhesive support using the same, and a method for manufacturing a semiconductor device. |
JP5982248B2 (en) * | 2012-09-28 | 2016-08-31 | 富士フイルム株式会社 | A temporary bonding layer for manufacturing a semiconductor device, a laminate, and a method for manufacturing a semiconductor device. |
US9269623B2 (en) * | 2012-10-25 | 2016-02-23 | Rohm And Haas Electronic Materials Llc | Ephemeral bonding |
JP6170672B2 (en) * | 2012-12-27 | 2017-07-26 | 富士フイルム株式会社 | Temporary adhesive for manufacturing semiconductor device, adhesive support using the same, and method for manufacturing semiconductor device |
US8962449B1 (en) * | 2013-07-30 | 2015-02-24 | Micron Technology, Inc. | Methods for processing semiconductor devices |
US9315696B2 (en) * | 2013-10-31 | 2016-04-19 | Dow Global Technologies Llc | Ephemeral bonding |
-
2015
- 2015-01-06 CN CN201580003864.1A patent/CN106068551B/en active Active
- 2015-01-06 JP JP2016544436A patent/JP6687523B2/en active Active
- 2015-01-06 SG SG11201605469PA patent/SG11201605469PA/en unknown
- 2015-01-06 EP EP15735186.7A patent/EP3092658A4/en active Pending
- 2015-01-06 WO PCT/US2015/010290 patent/WO2015105785A1/en active Application Filing
- 2015-01-06 US US14/590,531 patent/US9496164B2/en active Active
- 2015-01-06 KR KR1020167020199A patent/KR102351530B1/en active IP Right Grant
- 2015-01-07 TW TW104100377A patent/TWI698344B/en active
Also Published As
Publication number | Publication date |
---|---|
JP2017510058A (en) | 2017-04-06 |
CN106068551A (en) | 2016-11-02 |
KR20160107204A (en) | 2016-09-13 |
CN106068551B (en) | 2019-12-17 |
EP3092658A4 (en) | 2017-07-05 |
TW201532834A (en) | 2015-09-01 |
US9496164B2 (en) | 2016-11-15 |
JP6687523B2 (en) | 2020-04-22 |
TWI698344B (en) | 2020-07-11 |
US20150194331A1 (en) | 2015-07-09 |
KR102351530B1 (en) | 2022-01-14 |
WO2015105785A1 (en) | 2015-07-16 |
EP3092658A1 (en) | 2016-11-16 |
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