SG11201602206PA - Composite ceramic abrasive polishing solution - Google Patents
Composite ceramic abrasive polishing solutionInfo
- Publication number
- SG11201602206PA SG11201602206PA SG11201602206PA SG11201602206PA SG11201602206PA SG 11201602206P A SG11201602206P A SG 11201602206PA SG 11201602206P A SG11201602206P A SG 11201602206PA SG 11201602206P A SG11201602206P A SG 11201602206PA SG 11201602206P A SG11201602206P A SG 11201602206PA
- Authority
- SG
- Singapore
- Prior art keywords
- composite ceramic
- polishing solution
- abrasive polishing
- ceramic abrasive
- composite
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
- B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
- B24D3/18—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings for porous or cellular structure
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361882369P | 2013-09-25 | 2013-09-25 | |
| PCT/US2014/056750 WO2015047939A1 (en) | 2013-09-25 | 2014-09-22 | Composite ceramic abrasive polishing solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201602206PA true SG11201602206PA (en) | 2016-04-28 |
Family
ID=52744375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201602206PA SG11201602206PA (en) | 2013-09-25 | 2014-09-22 | Composite ceramic abrasive polishing solution |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10293458B2 (en) |
| EP (1) | EP3049215B1 (en) |
| JP (1) | JP2016537439A (en) |
| KR (1) | KR102289629B1 (en) |
| CN (1) | CN105517758B (en) |
| SG (1) | SG11201602206PA (en) |
| TW (1) | TWI669382B (en) |
| WO (1) | WO2015047939A1 (en) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6703939B2 (en) | 2013-09-25 | 2020-06-03 | スリーエム イノベイティブ プロパティズ カンパニー | Polishing system |
| US9978609B2 (en) * | 2015-04-27 | 2018-05-22 | Versum Materials Us, Llc | Low dishing copper chemical mechanical planarization |
| WO2016183126A1 (en) | 2015-05-13 | 2016-11-17 | 3M Innovative Properties Company | Polishing pads and systems for and methods of using same |
| JP6669331B2 (en) * | 2015-05-19 | 2020-03-18 | 昭和電工株式会社 | Polishing composition and polishing method using the polishing composition |
| US20210189175A1 (en) * | 2016-02-16 | 2021-06-24 | 3M Innovative Properties Company | Polishing systems and method of making and using same |
| ES2604830B1 (en) | 2016-04-28 | 2017-12-18 | Drylyte, S.L. | Process for smoothing and polishing metals by ionic transport by means of free solid bodies, and solid bodies to carry out said process. |
| US10195713B2 (en) | 2016-08-11 | 2019-02-05 | 3M Innovative Properties Company | Lapping pads and systems and methods of making and using the same |
| CA3134368A1 (en) | 2016-12-23 | 2018-06-28 | Saint-Gobain Abrasives, Inc. | Coated abrasives having a performance enhancing composition |
| JP7197366B2 (en) * | 2016-12-26 | 2022-12-27 | 株式会社フジミインコーポレーテッド | Polishing composition and polishing method |
| WO2019043819A1 (en) * | 2017-08-30 | 2019-03-07 | 日立化成株式会社 | Slurry and polishing method |
| JP7187770B2 (en) * | 2017-11-08 | 2022-12-13 | Ａｇｃ株式会社 | Polishing agent, polishing method, and polishing additive |
| CN109868447B (en) | 2017-12-01 | 2022-03-25 | 通用电气公司 | Method for reducing surface roughness |
| EP3768795A1 (en) | 2018-03-21 | 2021-01-27 | 3M Innovative Properties Company | Structured abrasives containing polishing materials for use in the home |
| CN110499102A (en) * | 2018-05-20 | 2019-11-26 | 深圳市得益达电子科技有限公司 | A kind of cerium oxide liquid suspension polishing liquid for glass polishing |
| EP3578998A1 (en) | 2018-06-08 | 2019-12-11 | 3M Innovative Properties Company | Impedance assembly |
| CN110772911B (en) * | 2018-07-30 | 2021-11-09 | 天津大学 | Microwave reaction device and reaction system for removing bioaerosol and application thereof |
| US20210060724A1 (en) * | 2019-08-30 | 2021-03-04 | Sunnen Products Co. | Lapping Tool |
| CN111558855A (en) * | 2020-06-01 | 2020-08-21 | 宏明金属科技(无锡)有限公司 | Process method for polishing high-precision mechanical matching parts |
| CN111607330A (en) * | 2020-06-03 | 2020-09-01 | 大连理工大学 | Shear thickening polishing solution |
| CN115247026A (en) * | 2021-04-26 | 2022-10-28 | 福建晶安光电有限公司 | Sapphire polishing solution and preparation method thereof |
| CN113999653B (en) * | 2021-10-28 | 2022-05-24 | 华南理工大学 | Silicon single crystal grinding agent and preparation method and application thereof |
| CN116000782B (en) * | 2022-12-27 | 2023-09-19 | 昂士特科技(深圳)有限公司 | Chemical mechanical polishing composition for metal alloy CMP |
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-
2014
- 2014-09-22 US US14/915,651 patent/US10293458B2/en active Active
- 2014-09-22 CN CN201480049117.7A patent/CN105517758B/en active Active
- 2014-09-22 KR KR1020167010337A patent/KR102289629B1/en active IP Right Grant
- 2014-09-22 SG SG11201602206PA patent/SG11201602206PA/en unknown
- 2014-09-22 EP EP14848408.2A patent/EP3049215B1/en active Active
- 2014-09-22 WO PCT/US2014/056750 patent/WO2015047939A1/en active Application Filing
- 2014-09-22 JP JP2016516917A patent/JP2016537439A/en active Pending
- 2014-09-24 TW TW103133084A patent/TWI669382B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016537439A (en) | 2016-12-01 |
| EP3049215A4 (en) | 2017-05-17 |
| CN105517758A (en) | 2016-04-20 |
| EP3049215B1 (en) | 2021-04-14 |
| US10293458B2 (en) | 2019-05-21 |
| EP3049215A1 (en) | 2016-08-03 |
| TW201525119A (en) | 2015-07-01 |
| CN105517758B (en) | 2020-03-31 |
| KR20160060690A (en) | 2016-05-30 |
| US20160221146A1 (en) | 2016-08-04 |
| TWI669382B (en) | 2019-08-21 |
| WO2015047939A1 (en) | 2015-04-02 |
| KR102289629B1 (en) | 2021-08-17 |
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