SG11201601753TA - Varnishes and prepregs and laminates made therefrom - Google Patents
Varnishes and prepregs and laminates made therefromInfo
- Publication number
- SG11201601753TA SG11201601753TA SG11201601753TA SG11201601753TA SG11201601753TA SG 11201601753T A SG11201601753T A SG 11201601753TA SG 11201601753T A SG11201601753T A SG 11201601753TA SG 11201601753T A SG11201601753T A SG 11201601753TA SG 11201601753T A SG11201601753T A SG 11201601753TA
- Authority
- SG
- Singapore
- Prior art keywords
- prepregs
- varnishes
- made therefrom
- laminates made
- laminates
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C08L71/126—Polyphenylene oxides modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
- C08F283/08—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals on to polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
- C08F283/08—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals on to polyphenylene oxides
- C08F283/085—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals on to polyphenylene oxides on to unsaturated polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
- C08G65/485—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/095—Carboxylic acids containing halogens
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
- C09D171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C09D171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C09D171/12—Polyphenylene oxides
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361889837P | 2013-10-11 | 2013-10-11 | |
PCT/US2014/060126 WO2015054626A1 (en) | 2013-10-11 | 2014-10-10 | Varnishes and prepregs and laminates made therefrom |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201601753TA true SG11201601753TA (en) | 2016-04-28 |
Family
ID=52134331
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201601753TA SG11201601753TA (en) | 2013-10-11 | 2014-10-10 | Varnishes and prepregs and laminates made therefrom |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP3055354B1 (en) |
JP (1) | JP6612743B2 (en) |
KR (1) | KR101945088B1 (en) |
CN (1) | CN105612204B (en) |
CA (1) | CA2925392C (en) |
MY (1) | MY180452A (en) |
SG (1) | SG11201601753TA (en) |
TW (1) | TWI504698B (en) |
WO (1) | WO2015054626A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI613254B (en) * | 2016-12-13 | 2018-02-01 | Nanya Plastics Corp | Thermosetting resin composition |
CN111936526B (en) * | 2018-03-29 | 2022-09-30 | Dic株式会社 | Curable composition and cured product thereof |
TWI758602B (en) * | 2019-04-12 | 2022-03-21 | 南亞塑膠工業股份有限公司 | Thermosetting resin composition and printed circuit board comprising thereof |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61217239A (en) * | 1985-03-25 | 1986-09-26 | 松下電工株式会社 | Manufacture of metallic foil-lined laminated board |
US5223568A (en) | 1987-05-14 | 1993-06-29 | Rogers Corporation | Process for forming hard shaped molded article of a cross-linked liquid polybutadiene or polyisoprene resin and a butadiene or isoprene containing solid polymer and resulting articles |
US5218030A (en) | 1989-02-08 | 1993-06-08 | Asahi Kasei Kogyo Kabushiki Kaisha | Curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom |
JPH0726013B2 (en) * | 1989-02-08 | 1995-03-22 | 旭化成工業株式会社 | Curable polyphenylene ether resin composition, and composite material and laminate using the same |
US5571609A (en) | 1994-10-13 | 1996-11-05 | Rogers Corporation | Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture thereof |
JP3289534B2 (en) * | 1995-02-28 | 2002-06-10 | 松下電工株式会社 | Polyphenylene oxide resin composition and prepreg and laminate using the same |
US6627704B2 (en) * | 1999-12-01 | 2003-09-30 | General Electric Company | Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom |
US6352782B2 (en) * | 1999-12-01 | 2002-03-05 | General Electric Company | Poly(phenylene ether)-polyvinyl thermosetting resin |
US6352783B1 (en) | 1999-12-13 | 2002-03-05 | Eastman Kodak Company | Copolyester containing 4,4'-biphenyldicarboxylic acid, 1,4-cyclohexanedimethanol and an ultraviolet light absorbing compound and articles made therefrom |
US6306963B1 (en) | 2000-05-08 | 2001-10-23 | General Electric Co. | Thermosetting resins and laminates |
US6897282B2 (en) | 2000-07-10 | 2005-05-24 | General Electric | Compositions comprising functionalized polyphenylene ether resins |
JP2002265777A (en) * | 2001-03-12 | 2002-09-18 | Matsushita Electric Works Ltd | Polyphenylene oxide resin composition, prepreg, laminated board, printed wiring board and multi-layered printed wiring board |
DE60231551D1 (en) | 2001-12-05 | 2009-04-23 | Isola Laminate Systems Corp | HEAT-RESISTANT RESIN COMPOSITION FOR HIGH-PERFORMANCE LAMINATES |
CN1962755A (en) * | 2002-09-30 | 2007-05-16 | 日立化成工业株式会社 | Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same |
JP4122320B2 (en) * | 2004-08-30 | 2008-07-23 | 京セラケミカル株式会社 | Halogen-free flame-retardant resin composition, prepreg using the same, and use thereof. |
US20080097027A1 (en) * | 2006-10-23 | 2008-04-24 | General Electric Company | Varnish composition for insulating electrical machinery |
TWI418594B (en) * | 2010-12-16 | 2013-12-11 | Asahi Kasei E Materials Corp | Hardened resin composition |
TWI513747B (en) * | 2011-06-13 | 2015-12-21 | Nanya Plastics Corp | A high frequency copper foil substrate and the composite material used |
SG11201403955SA (en) * | 2012-01-19 | 2014-08-28 | Isola Usa Corp | Synthesized resins and varnishes, prepregs and laminates made thereform |
JP5970214B2 (en) * | 2012-03-19 | 2016-08-17 | 旭化成株式会社 | Dispersion containing polyphenylene ether particles |
JP7026013B2 (en) * | 2018-07-11 | 2022-02-25 | アンリツ株式会社 | Measuring device and measurement parameter setting method |
-
2014
- 2014-10-10 CA CA2925392A patent/CA2925392C/en active Active
- 2014-10-10 MY MYPI2016701239A patent/MY180452A/en unknown
- 2014-10-10 SG SG11201601753TA patent/SG11201601753TA/en unknown
- 2014-10-10 JP JP2016521277A patent/JP6612743B2/en active Active
- 2014-10-10 CN CN201480055245.2A patent/CN105612204B/en active Active
- 2014-10-10 KR KR1020167012248A patent/KR101945088B1/en active IP Right Grant
- 2014-10-10 EP EP14815948.6A patent/EP3055354B1/en active Active
- 2014-10-10 WO PCT/US2014/060126 patent/WO2015054626A1/en active Application Filing
- 2014-10-13 TW TW103135462A patent/TWI504698B/en active
Also Published As
Publication number | Publication date |
---|---|
TW201522537A (en) | 2015-06-16 |
JP6612743B2 (en) | 2019-11-27 |
CN105612204A (en) | 2016-05-25 |
CA2925392C (en) | 2021-11-30 |
EP3055354A1 (en) | 2016-08-17 |
JP2016534166A (en) | 2016-11-04 |
CN105612204B (en) | 2019-07-16 |
KR20160068904A (en) | 2016-06-15 |
EP3055354B1 (en) | 2018-12-05 |
CA2925392A1 (en) | 2015-04-16 |
KR101945088B1 (en) | 2019-02-01 |
MY180452A (en) | 2020-11-29 |
TWI504698B (en) | 2015-10-21 |
WO2015054626A1 (en) | 2015-04-16 |
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