SG11201601186XA - Method for slicing ingot and wire saw - Google Patents
Method for slicing ingot and wire sawInfo
- Publication number
- SG11201601186XA SG11201601186XA SG11201601186XA SG11201601186XA SG11201601186XA SG 11201601186X A SG11201601186X A SG 11201601186XA SG 11201601186X A SG11201601186X A SG 11201601186XA SG 11201601186X A SG11201601186X A SG 11201601186XA SG 11201601186X A SG11201601186X A SG 11201601186XA
- Authority
- SG
- Singapore
- Prior art keywords
- wire saw
- slicing ingot
- slicing
- ingot
- saw
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013177039A JP6015598B2 (en) | 2013-08-28 | 2013-08-28 | Ingot cutting method and wire saw |
PCT/JP2014/003889 WO2015029323A1 (en) | 2013-08-28 | 2014-07-24 | Ingot cutting method and wire saw |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201601186XA true SG11201601186XA (en) | 2016-03-30 |
Family
ID=52585923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201601186XA SG11201601186XA (en) | 2013-08-28 | 2014-07-24 | Method for slicing ingot and wire saw |
Country Status (8)
Country | Link |
---|---|
US (1) | US9776340B2 (en) |
JP (1) | JP6015598B2 (en) |
KR (1) | KR102103330B1 (en) |
CN (1) | CN105492164B (en) |
DE (1) | DE112014003483T5 (en) |
SG (1) | SG11201601186XA (en) |
TW (1) | TWI595992B (en) |
WO (1) | WO2015029323A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1332162B1 (en) | 2000-11-10 | 2013-05-01 | Bridgestone Corporation | Functionalized high cis-1,4-polybutadiene prepared using novel functionalizing agents |
US8314189B2 (en) | 2007-10-12 | 2012-11-20 | Bridgestone Corporation | Polymers functionalized with heterocyclic nitrile compounds |
US8785566B2 (en) | 2009-01-23 | 2014-07-22 | Bridgestone Corporation | Polymers functionalized with polycyano compounds |
JP6493243B2 (en) * | 2016-02-15 | 2019-04-03 | 株式会社Sumco | Wafer manufacturing method |
CN106956375B (en) * | 2017-04-12 | 2019-12-13 | 隆基乐叶光伏科技有限公司 | cutting method of silicon wafer with polygonal structure size and rod sticking tool |
CN110900851A (en) * | 2019-12-07 | 2020-03-24 | 怀化学院 | Spindle system of slitter |
CN114043368B (en) * | 2021-11-01 | 2024-02-06 | 宁波市易特磁业有限公司 | Magnetic material cutting device and processing method |
JP2023095080A (en) * | 2021-12-24 | 2023-07-06 | 株式会社Sumco | Method for slicing silicon ingot |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY120514A (en) * | 1996-03-26 | 2005-11-30 | Shinetsu Handotai Kk | Wire saw and method of slicing a cylindrical workpiece |
JP3106416B2 (en) | 1996-09-20 | 2000-11-06 | 株式会社東京精密 | Wire running control method for wire saw |
DE19645013B4 (en) * | 1996-10-31 | 2004-07-22 | Odevis Ag | Control of wire saws |
JP2000042896A (en) * | 1998-07-24 | 2000-02-15 | Tokyo Seimitsu Co Ltd | Cutting method for wire saw |
JP2000141201A (en) * | 1998-11-10 | 2000-05-23 | Tokyo Seimitsu Co Ltd | Cutting method of wire saw |
JP2007276048A (en) * | 2006-04-06 | 2007-10-25 | Sumco Techxiv株式会社 | Workpiece cutting method using wire |
DE102006058823B4 (en) * | 2006-12-13 | 2017-06-08 | Siltronic Ag | A method of separating a plurality of slices from a workpiece |
JP2008188721A (en) * | 2007-02-06 | 2008-08-21 | Hitachi Cable Ltd | Substrate manufacturing method and wire saw device |
JP4816511B2 (en) | 2007-03-06 | 2011-11-16 | 信越半導体株式会社 | Cutting method and wire saw device |
JP5332914B2 (en) | 2009-05-29 | 2013-11-06 | 信越半導体株式会社 | Cutting method of silicon ingot |
TW201213080A (en) * | 2010-09-17 | 2012-04-01 | Yasunaga Kk | Wire saw device and method for manufacturing wafer using the same |
JP5639858B2 (en) * | 2010-11-19 | 2014-12-10 | Sumco Techxiv株式会社 | Ingot cutting method |
CN102172933A (en) | 2011-01-16 | 2011-09-07 | 刘金忠 | Process for producing straw artificial board |
CN102172993B (en) | 2011-01-25 | 2014-12-03 | 张志伟 | Method for cutting silicon bar by using separate line net |
KR101064266B1 (en) * | 2011-04-05 | 2011-09-14 | 한국생산기술연구원 | Sapphire ingot cutting method using wire saw |
JP5494558B2 (en) * | 2011-04-20 | 2014-05-14 | 信越半導体株式会社 | Method for resuming operation of wire saw and wire saw |
JP2012250328A (en) * | 2011-06-03 | 2012-12-20 | Sharp Corp | Wire saw device, workpiece cutting method, and manufacturing method for wafer |
CN202507408U (en) | 2012-04-05 | 2012-10-31 | 江西金葵能源科技有限公司 | Intelligent device for automatically adjusting speed of cutting silicon pieces with diamond wire |
DE102012209974B4 (en) * | 2012-06-14 | 2018-02-15 | Siltronic Ag | A method of simultaneously separating a plurality of slices from a cylindrical workpiece |
-
2013
- 2013-08-28 JP JP2013177039A patent/JP6015598B2/en active Active
-
2014
- 2014-07-24 WO PCT/JP2014/003889 patent/WO2015029323A1/en active Application Filing
- 2014-07-24 SG SG11201601186XA patent/SG11201601186XA/en unknown
- 2014-07-24 US US14/911,075 patent/US9776340B2/en active Active
- 2014-07-24 KR KR1020167005089A patent/KR102103330B1/en active IP Right Grant
- 2014-07-24 CN CN201480045783.3A patent/CN105492164B/en active Active
- 2014-07-24 DE DE112014003483.5T patent/DE112014003483T5/en active Pending
- 2014-07-31 TW TW103126238A patent/TWI595992B/en active
Also Published As
Publication number | Publication date |
---|---|
US20160176069A1 (en) | 2016-06-23 |
TW201520016A (en) | 2015-06-01 |
JP6015598B2 (en) | 2016-10-26 |
KR20160048787A (en) | 2016-05-04 |
CN105492164A (en) | 2016-04-13 |
CN105492164B (en) | 2017-08-22 |
KR102103330B1 (en) | 2020-04-22 |
DE112014003483T5 (en) | 2016-06-16 |
TWI595992B (en) | 2017-08-21 |
JP2015044268A (en) | 2015-03-12 |
WO2015029323A1 (en) | 2015-03-05 |
US9776340B2 (en) | 2017-10-03 |
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