SG11201600447YA - Variable frequency microwave (vfm) processes and applications in semiconductor thin film fabrications - Google Patents
Variable frequency microwave (vfm) processes and applications in semiconductor thin film fabricationsInfo
- Publication number
- SG11201600447YA SG11201600447YA SG11201600447YA SG11201600447YA SG11201600447YA SG 11201600447Y A SG11201600447Y A SG 11201600447YA SG 11201600447Y A SG11201600447Y A SG 11201600447YA SG 11201600447Y A SG11201600447Y A SG 11201600447YA SG 11201600447Y A SG11201600447Y A SG 11201600447YA
- Authority
- SG
- Singapore
- Prior art keywords
- vfm
- applications
- processes
- thin film
- variable frequency
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02345—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/511—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using microwave discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02266—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by physical ablation of a target, e.g. sputtering, reactive sputtering, physical vapour deposition or pulsed laser deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02337—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour
- H01L21/0234—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour treatment by exposure to a plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31058—After-treatment of organic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361868108P | 2013-08-21 | 2013-08-21 | |
US201361868110P | 2013-08-21 | 2013-08-21 | |
PCT/US2014/045212 WO2015026445A1 (en) | 2013-08-21 | 2014-07-02 | Variable frequency microwave (vfm) processes and applications in semiconductor thin film fabrications |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201600447YA true SG11201600447YA (en) | 2016-03-30 |
Family
ID=52480749
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201804322UA SG10201804322UA (en) | 2013-08-21 | 2014-07-02 | Variable frequency microwave (vfm) processes and applications in semiconductor thin film fabrications |
SG11201600447YA SG11201600447YA (en) | 2013-08-21 | 2014-07-02 | Variable frequency microwave (vfm) processes and applications in semiconductor thin film fabrications |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201804322UA SG10201804322UA (en) | 2013-08-21 | 2014-07-02 | Variable frequency microwave (vfm) processes and applications in semiconductor thin film fabrications |
Country Status (6)
Country | Link |
---|---|
US (3) | US9548200B2 (en) |
KR (1) | KR101825673B1 (en) |
CN (2) | CN105453227B (en) |
SG (2) | SG10201804322UA (en) |
TW (3) | TWI603415B (en) |
WO (1) | WO2015026445A1 (en) |
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CN104603914B (en) * | 2012-09-07 | 2017-07-14 | 应用材料公司 | The integrated processing of porous dielectric, polymer-coated substrate and epoxides in multi-chamber vacuum system |
CN105453227B (en) | 2013-08-21 | 2018-10-19 | 应用材料公司 | Variable frequency microwave in semiconductive thin film manufacture(VFM)Technique and application |
US20160086960A1 (en) * | 2014-09-22 | 2016-03-24 | Texas Instruments Incorporated | Low-Temperature Passivation of Ferroelectric Integrated Circuits for Enhanced Polarization Performance |
US20170365490A1 (en) * | 2016-06-19 | 2017-12-21 | Applied Materials, Inc. | Methods for polymer coefficient of thermal expansion (cte) tuning by microwave curing |
WO2018052471A1 (en) * | 2016-09-14 | 2018-03-22 | Applied Materials, Inc. | A degassing chamber for arsenic related processes |
JP6767257B2 (en) * | 2016-12-22 | 2020-10-14 | 東京エレクトロン株式会社 | Substrate processing equipment and substrate processing method |
US10224224B2 (en) | 2017-03-10 | 2019-03-05 | Micromaterials, LLC | High pressure wafer processing systems and related methods |
US10622214B2 (en) | 2017-05-25 | 2020-04-14 | Applied Materials, Inc. | Tungsten defluorination by high pressure treatment |
US10847360B2 (en) | 2017-05-25 | 2020-11-24 | Applied Materials, Inc. | High pressure treatment of silicon nitride film |
CN110678973B (en) | 2017-06-02 | 2023-09-19 | 应用材料公司 | Dry stripping of boron carbide hard masks |
US10276411B2 (en) | 2017-08-18 | 2019-04-30 | Applied Materials, Inc. | High pressure and high temperature anneal chamber |
WO2019036157A1 (en) | 2017-08-18 | 2019-02-21 | Applied Materials, Inc. | High pressure and high temperature anneal chamber |
WO2019055415A1 (en) | 2017-09-12 | 2019-03-21 | Applied Materials, Inc. | Apparatus and methods for manufacturing semiconductor structures using protective barrier layer |
JP6926939B2 (en) * | 2017-10-23 | 2021-08-25 | 東京エレクトロン株式会社 | Manufacturing method of semiconductor devices |
WO2019089115A1 (en) * | 2017-11-02 | 2019-05-09 | Applied Materials, Inc. | Tool architecture using variable frequency microwave for residual moisture removal of electrodes |
US10643867B2 (en) | 2017-11-03 | 2020-05-05 | Applied Materials, Inc. | Annealing system and method |
KR102585074B1 (en) | 2017-11-11 | 2023-10-04 | 마이크로머티어리얼즈 엘엘씨 | Gas delivery system for high pressure processing chamber |
JP7330181B2 (en) | 2017-11-16 | 2023-08-21 | アプライド マテリアルズ インコーポレイテッド | High-pressure steam annealing treatment equipment |
JP2021503714A (en) | 2017-11-17 | 2021-02-12 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Capacitor system for high pressure processing system |
WO2019147400A1 (en) | 2018-01-24 | 2019-08-01 | Applied Materials, Inc. | Seam healing using high pressure anneal |
SG11202008256WA (en) | 2018-03-09 | 2020-09-29 | Applied Materials Inc | High pressure annealing process for metal containing materials |
US10714331B2 (en) | 2018-04-04 | 2020-07-14 | Applied Materials, Inc. | Method to fabricate thermally stable low K-FinFET spacer |
US10950429B2 (en) | 2018-05-08 | 2021-03-16 | Applied Materials, Inc. | Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom |
US10991617B2 (en) | 2018-05-15 | 2021-04-27 | Applied Materials, Inc. | Methods and apparatus for cleaving of semiconductor substrates |
US10566188B2 (en) | 2018-05-17 | 2020-02-18 | Applied Materials, Inc. | Method to improve film stability |
US10704141B2 (en) | 2018-06-01 | 2020-07-07 | Applied Materials, Inc. | In-situ CVD and ALD coating of chamber to control metal contamination |
US10748783B2 (en) | 2018-07-25 | 2020-08-18 | Applied Materials, Inc. | Gas delivery module |
US10675581B2 (en) | 2018-08-06 | 2020-06-09 | Applied Materials, Inc. | Gas abatement apparatus |
JP7179172B6 (en) | 2018-10-30 | 2022-12-16 | アプライド マテリアルズ インコーポレイテッド | Method for etching structures for semiconductor applications |
KR20210077779A (en) | 2018-11-16 | 2021-06-25 | 어플라이드 머티어리얼스, 인코포레이티드 | Film Deposition Using Enhanced Diffusion Process |
WO2020117462A1 (en) | 2018-12-07 | 2020-06-11 | Applied Materials, Inc. | Semiconductor processing system |
CN111383946A (en) * | 2018-12-29 | 2020-07-07 | 中国科学院微电子研究所 | Nano-pattern rapid curing device |
US11469100B2 (en) * | 2019-05-30 | 2022-10-11 | Applied Materials, Inc. | Methods of post treating dielectric films with microwave radiation |
KR20220034148A (en) * | 2019-07-07 | 2022-03-17 | 어플라이드 머티어리얼스, 인코포레이티드 | Methods and apparatus for microwave processing of polymer materials |
US11626285B2 (en) * | 2019-09-10 | 2023-04-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of manufacturing a semiconductor device |
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CN110718486B (en) * | 2019-10-17 | 2022-10-04 | 沈阳硅基科技有限公司 | Film transfer method |
US11901222B2 (en) | 2020-02-17 | 2024-02-13 | Applied Materials, Inc. | Multi-step process for flowable gap-fill film |
CN113894022A (en) * | 2021-09-29 | 2022-01-07 | 赛赫智能设备(上海)股份有限公司 | Application of variable frequency microwave in drying and curing of gluing material coating of electronic product |
TWI805440B (en) * | 2022-07-11 | 2023-06-11 | 台技工業設備股份有限公司 | Heating system for compressed parts capable of controlling process atmosphere and pressure |
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CN105453227B (en) * | 2013-08-21 | 2018-10-19 | 应用材料公司 | Variable frequency microwave in semiconductive thin film manufacture(VFM)Technique and application |
-
2014
- 2014-07-02 CN CN201480044915.0A patent/CN105453227B/en active Active
- 2014-07-02 US US14/322,484 patent/US9548200B2/en active Active
- 2014-07-02 SG SG10201804322UA patent/SG10201804322UA/en unknown
- 2014-07-02 KR KR1020167007297A patent/KR101825673B1/en active IP Right Grant
- 2014-07-02 SG SG11201600447YA patent/SG11201600447YA/en unknown
- 2014-07-02 CN CN201811101950.8A patent/CN109390214B/en active Active
- 2014-07-02 WO PCT/US2014/045212 patent/WO2015026445A1/en active Application Filing
- 2014-08-08 TW TW103127294A patent/TWI603415B/en active
- 2014-08-08 TW TW107139331A patent/TWI729321B/en active
- 2014-08-08 TW TW106131159A patent/TWI650827B/en active
-
2017
- 2017-01-05 US US15/399,614 patent/US9960035B2/en active Active
-
2018
- 2018-04-20 US US15/959,008 patent/US10629430B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TWI729321B (en) | 2021-06-01 |
CN105453227A (en) | 2016-03-30 |
KR101825673B1 (en) | 2018-02-05 |
TWI650827B (en) | 2019-02-11 |
TW201921560A (en) | 2019-06-01 |
US9960035B2 (en) | 2018-05-01 |
US10629430B2 (en) | 2020-04-21 |
TW201515138A (en) | 2015-04-16 |
US20180240666A1 (en) | 2018-08-23 |
SG10201804322UA (en) | 2018-07-30 |
TW201804554A (en) | 2018-02-01 |
TWI603415B (en) | 2017-10-21 |
CN109390214B (en) | 2023-03-07 |
CN109390214A (en) | 2019-02-26 |
WO2015026445A1 (en) | 2015-02-26 |
CN105453227B (en) | 2018-10-19 |
US20170117146A1 (en) | 2017-04-27 |
US9548200B2 (en) | 2017-01-17 |
US20150056819A1 (en) | 2015-02-26 |
KR20160044573A (en) | 2016-04-25 |
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