SG11201600256XA - Purging device and purging method - Google Patents

Purging device and purging method

Info

Publication number
SG11201600256XA
SG11201600256XA SG11201600256XA SG11201600256XA SG11201600256XA SG 11201600256X A SG11201600256X A SG 11201600256XA SG 11201600256X A SG11201600256X A SG 11201600256XA SG 11201600256X A SG11201600256X A SG 11201600256XA SG 11201600256X A SG11201600256X A SG 11201600256XA
Authority
SG
Singapore
Prior art keywords
purging
purging device
purging method
Prior art date
Application number
SG11201600256XA
Inventor
Masanao Murata
Mitsuya Tokumoto
Takashi Yamaji
Naruto Adachi
Original Assignee
Murata Machinery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Machinery Ltd filed Critical Murata Machinery Ltd
Publication of SG11201600256XA publication Critical patent/SG11201600256XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/0004—Gaseous mixtures, e.g. polluted air
    • G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
    • G01N33/0027—General constructional details of gas analysers, e.g. portable test equipment concerning the detector
    • G01N33/0036—General constructional details of gas analysers, e.g. portable test equipment concerning the detector specially adapted to detect a particular component
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Food Science & Technology (AREA)
  • Medicinal Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
SG11201600256XA 2013-09-26 2014-07-17 Purging device and purging method SG11201600256XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013199589 2013-09-26
PCT/JP2014/069018 WO2015045582A1 (en) 2013-09-26 2014-07-17 Purging device and purging method

Publications (1)

Publication Number Publication Date
SG11201600256XA true SG11201600256XA (en) 2016-05-30

Family

ID=52742739

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201600256XA SG11201600256XA (en) 2013-09-26 2014-07-17 Purging device and purging method

Country Status (8)

Country Link
US (1) US9779973B2 (en)
EP (1) EP3051581B1 (en)
JP (1) JP6032372B2 (en)
KR (1) KR101807822B1 (en)
CN (1) CN105453247B (en)
SG (1) SG11201600256XA (en)
TW (1) TWI619192B (en)
WO (1) WO2015045582A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6551530B2 (en) * 2015-08-25 2019-07-31 村田機械株式会社 Purge apparatus, purge stocker, and purge method
US10515834B2 (en) 2015-10-12 2019-12-24 Lam Research Corporation Multi-station tool with wafer transfer microclimate systems
KR101944492B1 (en) * 2016-07-26 2019-02-01 에이피시스템 주식회사 Laser Apparatus, Laser Processing Equipment having the same, and Preventing Dust Method of thereof
CN109983568B (en) * 2017-02-20 2023-02-28 村田机械株式会社 Blowing stocker
KR101866788B1 (en) 2018-01-22 2018-06-18 보은에스앤씨 주식회사 Welding tip processing method for semiconductor pipe welding
KR101878363B1 (en) 2018-01-22 2018-07-16 보은에스앤씨 주식회사 Cap for easy welding
KR102126820B1 (en) 2018-12-19 2020-06-25 보은에스앤씨 주식회사 Band for welding
CN110425655A (en) * 2019-06-30 2019-11-08 安徽宇艳智能机械科技有限公司 A kind of Intelligentized air conditioning device based on STM32
US20220310412A1 (en) * 2021-03-23 2022-09-29 Rorze Technology Incorporated Gas circulation structure of equipment front end module (efem)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3893635B2 (en) * 1995-11-30 2007-03-14 アシスト シンコー株式会社 Gas supply and exhaust system for portable sealed containers
JPH1030798A (en) * 1996-07-17 1998-02-03 Mitsubishi Corp Gas leakage monitor in gas supply equipment for semiconductor production
EP1143491A4 (en) 1998-11-19 2003-11-26 Nikon Corp Optical device, exposure system, and laser beam source, and gas feed method, exposure method, and device manufacturing method
DE19921072A1 (en) * 1999-05-08 2000-11-09 Acr Automation In Cleanroom Device for handling substrates inside and outside a high-purity work room
JP2001326162A (en) * 2000-05-17 2001-11-22 Canon Inc Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
KR100741186B1 (en) * 2000-08-23 2007-07-19 동경 엘렉트론 주식회사 A processing system for an object to be processed
US6635116B1 (en) * 2000-08-29 2003-10-21 Lsi Logic Corporation Residual oxygen reduction system
JP2005005575A (en) * 2003-06-13 2005-01-06 Mitsubishi Electric Corp Closed package house for storing electric apparatus
JP2009127981A (en) 2007-11-27 2009-06-11 Semiconductor Energy Lab Co Ltd Clean room, film forming method, and manufacturing method of semiconductor device
JP2009249053A (en) * 2008-04-01 2009-10-29 Murata Mach Ltd Automated warehouse
JP5236518B2 (en) * 2009-02-03 2013-07-17 株式会社ダン・タクマ Storage system and storage method
JP5887719B2 (en) 2011-05-31 2016-03-16 シンフォニアテクノロジー株式会社 Purge device, load port, bottom purge nozzle body, bottom purge unit
JP5598729B2 (en) * 2011-12-26 2014-10-01 株式会社ダイフク Goods storage facility
JP5716968B2 (en) * 2012-01-04 2015-05-13 株式会社ダイフク Goods storage facility
JP5527624B2 (en) * 2012-01-05 2014-06-18 株式会社ダイフク Inert gas injector for storage shelves
JP6106501B2 (en) * 2013-04-12 2017-04-05 東京エレクトロン株式会社 How to manage the atmosphere in the storage container
JP5776947B2 (en) * 2013-06-12 2015-09-09 株式会社ダイフク Inert gas injector for storage shelves
JP5892113B2 (en) * 2013-06-26 2016-03-23 株式会社ダイフク Goods storage facility
JP5979089B2 (en) * 2013-06-26 2016-08-24 株式会社ダイフク Storage facilities
TWI629744B (en) * 2013-11-11 2018-07-11 昕芙旎雅股份有限公司 Surrounding gas replacement device, substrate transfer device, substrate transfer system, and EFEM

Also Published As

Publication number Publication date
EP3051581B1 (en) 2018-05-02
EP3051581A4 (en) 2017-05-03
US9779973B2 (en) 2017-10-03
CN105453247A (en) 2016-03-30
TW201525376A (en) 2015-07-01
TWI619192B (en) 2018-03-21
JP6032372B2 (en) 2016-11-30
JPWO2015045582A1 (en) 2017-03-09
US20160225648A1 (en) 2016-08-04
KR101807822B1 (en) 2017-12-11
CN105453247B (en) 2017-11-24
EP3051581A1 (en) 2016-08-03
WO2015045582A1 (en) 2015-04-02
KR20160058878A (en) 2016-05-25

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