SG11201508166RA - Resin molding apparatus and resin molding method - Google Patents
Resin molding apparatus and resin molding methodInfo
- Publication number
- SG11201508166RA SG11201508166RA SG11201508166RA SG11201508166RA SG11201508166RA SG 11201508166R A SG11201508166R A SG 11201508166RA SG 11201508166R A SG11201508166R A SG 11201508166RA SG 11201508166R A SG11201508166R A SG 11201508166RA SG 11201508166R A SG11201508166R A SG 11201508166RA
- Authority
- SG
- Singapore
- Prior art keywords
- resin molding
- molding method
- molding apparatus
- resin
- molding
- Prior art date
Links
- 238000000465 moulding Methods 0.000 title 2
- 239000011347 resin Substances 0.000 title 2
- 229920005989 resin Polymers 0.000 title 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013113222A JP2014231185A (ja) | 2013-05-29 | 2013-05-29 | 樹脂モールド装置および樹脂モールド方法 |
JP2013115783A JP2014233882A (ja) | 2013-05-31 | 2013-05-31 | 樹脂モールド装置及び樹脂モールド方法 |
JP2013139424A JP6180206B2 (ja) | 2013-07-03 | 2013-07-03 | 樹脂封止方法および圧縮成形装置 |
PCT/JP2014/061014 WO2014192456A1 (ja) | 2013-05-29 | 2014-04-18 | 樹脂モールド装置および樹脂モールド方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201508166RA true SG11201508166RA (en) | 2015-12-30 |
Family
ID=51988495
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201508166RA SG11201508166RA (en) | 2013-05-29 | 2014-04-18 | Resin molding apparatus and resin molding method |
Country Status (5)
Country | Link |
---|---|
KR (1) | KR102203781B1 (zh) |
CN (1) | CN105283294B (zh) |
SG (1) | SG11201508166RA (zh) |
TW (1) | TWI606526B (zh) |
WO (1) | WO2014192456A1 (zh) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6066889B2 (ja) * | 2013-11-25 | 2017-01-25 | Towa株式会社 | 圧縮成形装置および圧縮成形方法 |
WO2017010319A1 (ja) * | 2015-07-15 | 2017-01-19 | アピックヤマダ株式会社 | モールド金型及び樹脂モールド装置 |
JP6598642B2 (ja) * | 2015-11-09 | 2019-10-30 | Towa株式会社 | 樹脂封止装置及び樹脂封止方法 |
JP6654861B2 (ja) * | 2015-11-09 | 2020-02-26 | Towa株式会社 | 樹脂封止装置及び樹脂封止方法 |
JP6506680B2 (ja) * | 2015-11-09 | 2019-04-24 | Towa株式会社 | 樹脂封止装置及び樹脂封止方法 |
JP6491120B2 (ja) * | 2016-02-13 | 2019-03-27 | Towa株式会社 | 樹脂封止装置、樹脂封止方法及び樹脂成形品の製造方法 |
JP6640003B2 (ja) * | 2016-04-05 | 2020-02-05 | Towa株式会社 | 樹脂封止装置及び樹脂封止方法 |
JP6723185B2 (ja) * | 2017-03-29 | 2020-07-15 | Towa株式会社 | 成形型、樹脂成形装置、樹脂成形方法、及び樹脂成形品の製造方法 |
JP6342566B1 (ja) * | 2017-11-16 | 2018-06-13 | アルファーデザイン株式会社 | 部品保持装置及び部品接合システム |
JP6923423B2 (ja) * | 2017-11-21 | 2021-08-18 | Towa株式会社 | 搬送装置、樹脂成形装置及び樹脂成形品の製造方法 |
JP6876637B2 (ja) * | 2018-01-22 | 2021-05-26 | Towa株式会社 | 成形型、樹脂成形装置及び樹脂成形品の製造方法 |
JP7102238B2 (ja) * | 2018-06-08 | 2022-07-19 | Towa株式会社 | 樹脂成形装置および樹脂成形品の製造方法 |
JP7084247B2 (ja) * | 2018-08-02 | 2022-06-14 | Towa株式会社 | 樹脂成形装置、成形型、及び樹脂成形品の製造方法 |
NL2021845B1 (en) * | 2018-10-22 | 2020-05-13 | Besi Netherlands Bv | Mould half and mould method for encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such |
JP7203414B2 (ja) * | 2018-12-27 | 2023-01-13 | アピックヤマダ株式会社 | 樹脂供給取出装置、ワーク搬送装置及び樹脂モールド装置 |
JP7121763B2 (ja) * | 2020-02-14 | 2022-08-18 | アピックヤマダ株式会社 | 樹脂モールド装置及び樹脂モールド方法 |
CN113394326A (zh) * | 2021-06-29 | 2021-09-14 | 顺德职业技术学院 | 一种防水led进水的封装胶的成模装置 |
JP2023176518A (ja) * | 2022-05-31 | 2023-12-13 | アピックヤマダ株式会社 | 樹脂封止装置 |
TWI822159B (zh) * | 2022-06-30 | 2023-11-11 | 萬潤科技股份有限公司 | 壓合裝置及壓合設備 |
CN115332095B (zh) * | 2022-10-12 | 2022-12-27 | 安徽大华半导体科技有限公司 | 一种qfn大基板的封装模具及方法 |
CN117153725A (zh) * | 2023-08-31 | 2023-12-01 | 芯笙半导体科技(上海)有限公司 | 一种晶圆级封装装置 |
CN117238811B (zh) * | 2023-10-30 | 2024-05-14 | 芯笙半导体科技(上海)有限公司 | 一种芯片封装设备 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10249901A (ja) * | 1997-03-18 | 1998-09-22 | Toyo Mach & Metal Co Ltd | 成形機の型締め制御方法 |
JP3282988B2 (ja) * | 1997-05-01 | 2002-05-20 | アピックヤマダ株式会社 | 樹脂モールド方法及び樹脂モールド装置 |
JP4262468B2 (ja) | 2002-10-30 | 2009-05-13 | アピックヤマダ株式会社 | 樹脂モールド方法、樹脂モールド装置およびこれに用いる支持治具 |
JP4181984B2 (ja) * | 2003-12-25 | 2008-11-19 | 住友重機械工業株式会社 | 圧縮成形装置 |
JP2006027098A (ja) * | 2004-07-16 | 2006-02-02 | Apic Yamada Corp | 樹脂モールド方法および樹脂モールド装置 |
JP2008132719A (ja) * | 2006-11-29 | 2008-06-12 | Sumitomo Heavy Ind Ltd | 圧縮成形型の樹脂封止装置及びその圧縮方法 |
JP2008254266A (ja) * | 2007-04-03 | 2008-10-23 | Towa Corp | 電子部品の圧縮成形方法及び装置 |
JP5165268B2 (ja) * | 2007-04-01 | 2013-03-21 | キョーラク株式会社 | 中空成形体の製造方法及び中空成形体 |
KR100931295B1 (ko) * | 2008-01-24 | 2009-12-11 | 세크론 주식회사 | 전자 부품 몰딩 장치 및 전자 부품 몰딩 방법 |
JP5419070B2 (ja) * | 2009-03-13 | 2014-02-19 | アピックヤマダ株式会社 | 樹脂封止装置 |
DE102010034923A1 (de) * | 2010-08-20 | 2012-02-23 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Schichtverbunds aus einer Lumineszenzkonversionsschicht und einer Streuschicht |
-
2014
- 2014-04-18 CN CN201480029820.1A patent/CN105283294B/zh active Active
- 2014-04-18 WO PCT/JP2014/061014 patent/WO2014192456A1/ja active Application Filing
- 2014-04-18 SG SG11201508166RA patent/SG11201508166RA/en unknown
- 2014-04-18 KR KR1020157036843A patent/KR102203781B1/ko active IP Right Grant
- 2014-04-25 TW TW103114913A patent/TWI606526B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN105283294B (zh) | 2017-08-25 |
KR20160013202A (ko) | 2016-02-03 |
TWI606526B (zh) | 2017-11-21 |
CN105283294A (zh) | 2016-01-27 |
KR102203781B1 (ko) | 2021-01-15 |
WO2014192456A1 (ja) | 2014-12-04 |
TW201448074A (zh) | 2014-12-16 |
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