SG11201506668YA - Ag ALLOY SPUTTERING TARGET FOR FORMING ELECTROCONDUCTIVE FILM, AND METHOD OF PRODUCING SAME - Google Patents
Ag ALLOY SPUTTERING TARGET FOR FORMING ELECTROCONDUCTIVE FILM, AND METHOD OF PRODUCING SAMEInfo
- Publication number
- SG11201506668YA SG11201506668YA SG11201506668YA SG11201506668YA SG11201506668YA SG 11201506668Y A SG11201506668Y A SG 11201506668YA SG 11201506668Y A SG11201506668Y A SG 11201506668YA SG 11201506668Y A SG11201506668Y A SG 11201506668YA SG 11201506668Y A SG11201506668Y A SG 11201506668YA
- Authority
- SG
- Singapore
- Prior art keywords
- sputtering target
- producing same
- electroconductive film
- alloy sputtering
- forming electroconductive
- Prior art date
Links
- 229910001316 Ag alloy Inorganic materials 0.000 title 1
- 239000012789 electroconductive film Substances 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000005477 sputtering target Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013048388A JP5612147B2 (en) | 2013-03-11 | 2013-03-11 | Silver alloy sputtering target for forming conductive film and method for producing the same |
| PCT/JP2014/055967 WO2014142028A1 (en) | 2013-03-11 | 2014-03-07 | Silver alloy sputtering target for forming electroconductive film, and method for manufacturing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201506668YA true SG11201506668YA (en) | 2015-09-29 |
Family
ID=51536688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201506668YA SG11201506668YA (en) | 2013-03-11 | 2014-03-07 | Ag ALLOY SPUTTERING TARGET FOR FORMING ELECTROCONDUCTIVE FILM, AND METHOD OF PRODUCING SAME |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP5612147B2 (en) |
| KR (1) | KR101523894B1 (en) |
| CN (1) | CN104995329B (en) |
| SG (1) | SG11201506668YA (en) |
| TW (1) | TWI576442B (en) |
| WO (1) | WO2014142028A1 (en) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5720816B2 (en) * | 2011-06-24 | 2015-05-20 | 三菱マテリアル株式会社 | Conductive film |
| JP6375829B2 (en) * | 2014-09-25 | 2018-08-22 | 三菱マテリアル株式会社 | Ag alloy sputtering target |
| KR20160062411A (en) * | 2014-11-25 | 2016-06-02 | 희성금속 주식회사 | METHOD FOR PREPARING OF Ag-OXIDE BASED ELECTRICAL CONTACT MATERIAL FOR ELECTRIC SWITCH |
| TWI631205B (en) * | 2015-11-06 | 2018-08-01 | 東友精細化工有限公司 | Etching solution composition for silver layer and an display substrate using the same |
| EP3168325B1 (en) * | 2015-11-10 | 2022-01-05 | Materion Advanced Materials Germany GmbH | Silver alloy based sputter target |
| KR102433385B1 (en) * | 2015-11-10 | 2022-08-17 | 동우 화인켐 주식회사 | Etching solution composition for silver layer and display substrate using the same |
| KR101679562B1 (en) * | 2016-05-12 | 2016-11-25 | 희성금속 주식회사 | silver alloy composition forming conductive membrane and manufacturing method of it |
| KR101688920B1 (en) * | 2016-11-01 | 2016-12-22 | 희성금속 주식회사 | Silver alloy composition forming conductive membrane and manufacturing method of it |
| KR101710196B1 (en) * | 2016-11-04 | 2017-02-24 | 희성금속 주식회사 | Silver alloy composition forming conductive membrane and manufacturing method of it |
| KR101759152B1 (en) * | 2016-12-21 | 2017-07-18 | 희성금속 주식회사 | Silver alloy composition forming conductive membrane and manufacturing method of it |
| CN106893989B (en) * | 2016-12-29 | 2019-10-01 | 昆山全亚冠环保科技有限公司 | A kind of silver titanium alloy target crack resistence rolling mill practice |
| TWI663274B (en) * | 2017-03-30 | 2019-06-21 | 日商Ｊｘ金屬股份有限公司 | Sputtering target and manufacturing method thereof |
| JP2019143242A (en) | 2018-02-20 | 2019-08-29 | 三菱マテリアル株式会社 | Ag ALLOY SPUTTERING TARGET AND MANUFACTURING METHOD OF Ag ALLOY SPUTTERING TARGET |
| JP6966966B2 (en) * | 2018-03-23 | 2021-11-17 | Ｊｘ金属株式会社 | Sputtering target material and its manufacturing method |
| CN110819846B (en) * | 2019-11-19 | 2021-05-25 | 湘潭大学 | Silver-magnesium alloy strip with high magnesium content for photomultiplier and preparation method thereof |
| CN112975102B (en) * | 2021-03-04 | 2023-06-23 | 宁波江丰电子材料股份有限公司 | Diffusion welding method for cobalt target and copper backboard |
| CN113088749A (en) * | 2021-03-11 | 2021-07-09 | 先导薄膜材料（广东）有限公司 | Silver alloy and preparation method thereof |
| CN114015989A (en) * | 2021-10-11 | 2022-02-08 | 芜湖映日科技股份有限公司 | Silver-scandium alloy sputtering target material and preparation method thereof |
| CN114395749B (en) * | 2021-11-13 | 2023-06-02 | 丰联科光电(洛阳)股份有限公司 | Preparation method of large-size and multi-element Ag-based alloy sputtering target material |
| KR102486945B1 (en) * | 2022-02-21 | 2023-01-10 | ㈜한국진공야금 | Manufacturing method of high-purity silver sputtering target and silver sputtering target manufactured thereby |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3856386B2 (en) * | 2001-03-16 | 2006-12-13 | 石福金属興業株式会社 | Sputtering target material |
| JP2004002929A (en) * | 2001-08-03 | 2004-01-08 | Furuya Kinzoku:Kk | Silver alloy, sputtering target, reflector for reflection lcd, reflection wiring electrode, thin film, manufacturing method therefor, optical recording medium, electro magnetic wave shield, metal material for electronic part, wiring material, electronic part, electronic appliance, processing method of metal film, electron optical part, laminate, and glass of building material |
| KR100568392B1 (en) * | 2002-06-24 | 2006-04-05 | 가부시키가이샤 코베루코 카겐 | Silver alloy sputtering target and process for producing the same |
| JP4384453B2 (en) * | 2003-07-16 | 2009-12-16 | 株式会社神戸製鋼所 | Ag-based sputtering target and manufacturing method thereof |
| JP4379602B2 (en) * | 2003-08-20 | 2009-12-09 | 三菱マテリアル株式会社 | Optical recording medium having translucent reflective film or reflective film as constituent layer, and Ag alloy sputtering target used for forming said reflective film |
| US7413618B2 (en) * | 2003-12-10 | 2008-08-19 | Tanaka Kikinzoku Kogyo K.K. | Silver alloy for reflective film |
| JP4176136B2 (en) * | 2006-09-21 | 2008-11-05 | 株式会社神戸製鋼所 | Ag alloy thin film |
| KR20120068967A (en) * | 2007-09-13 | 2012-06-27 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | Method for producing sintered body, sintered body, sputtering target composed of the sintered body, and sputtering target-backing plate assembly |
| JP5046890B2 (en) * | 2007-11-29 | 2012-10-10 | 株式会社コベルコ科研 | Ag-based sputtering target |
| JP4793502B2 (en) * | 2009-10-06 | 2011-10-12 | 三菱マテリアル株式会社 | Silver alloy target for forming reflective electrode film of organic EL element and method for producing the same |
| JP5533545B2 (en) * | 2010-01-12 | 2014-06-25 | 三菱マテリアル株式会社 | Silver alloy target for forming reflective electrode film of organic EL element and method for producing the same |
| JP5830907B2 (en) * | 2011-04-06 | 2015-12-09 | 三菱マテリアル株式会社 | Silver alloy sputtering target for forming conductive film and method for producing the same |
| JP5830908B2 (en) * | 2011-04-06 | 2015-12-09 | 三菱マテリアル株式会社 | Silver alloy sputtering target for forming conductive film and method for producing the same |
| KR20140015432A (en) * | 2011-04-06 | 2014-02-06 | 미쓰비시 마테리알 가부시키가이샤 | Silver alloy sputtering target for forming electroconductive film, and method for manufacture same |
| JP5669015B2 (en) * | 2011-04-06 | 2015-02-12 | 三菱マテリアル株式会社 | Silver alloy sputtering target for forming conductive film and method for producing the same |
| JP5669014B2 (en) * | 2011-04-06 | 2015-02-12 | 三菱マテリアル株式会社 | Silver alloy sputtering target for forming conductive film and method for producing the same |
| JP5488849B2 (en) * | 2011-06-24 | 2014-05-14 | 三菱マテリアル株式会社 | Conductive film, method for producing the same, and sputtering target used therefor |
-
2013
- 2013-03-11 JP JP2013048388A patent/JP5612147B2/en active Active
-
2014
- 2014-03-07 KR KR1020147031481A patent/KR101523894B1/en active IP Right Grant
- 2014-03-07 SG SG11201506668YA patent/SG11201506668YA/en unknown
- 2014-03-07 WO PCT/JP2014/055967 patent/WO2014142028A1/en active Application Filing
- 2014-03-07 CN CN201480004353.7A patent/CN104995329B/en active Active
- 2014-03-11 TW TW103108422A patent/TWI576442B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| KR101523894B1 (en) | 2015-05-28 |
| CN104995329A (en) | 2015-10-21 |
| CN104995329B (en) | 2017-09-29 |
| TWI576442B (en) | 2017-04-01 |
| TW201502289A (en) | 2015-01-16 |
| JP5612147B2 (en) | 2014-10-22 |
| JP2014173158A (en) | 2014-09-22 |
| KR20140134727A (en) | 2014-11-24 |
| WO2014142028A1 (en) | 2014-09-18 |
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