SG11201505594XA - Method of producing carrier for use in double-side polishing apparatus and method of double-side polishing wafers - Google Patents
Method of producing carrier for use in double-side polishing apparatus and method of double-side polishing wafersInfo
- Publication number
- SG11201505594XA SG11201505594XA SG11201505594XA SG11201505594XA SG11201505594XA SG 11201505594X A SG11201505594X A SG 11201505594XA SG 11201505594X A SG11201505594X A SG 11201505594XA SG 11201505594X A SG11201505594X A SG 11201505594XA SG 11201505594X A SG11201505594X A SG 11201505594XA
- Authority
- SG
- Singapore
- Prior art keywords
- double
- side polishing
- wafers
- producing carrier
- polishing apparatus
- Prior art date
Links
- 238000000034 method Methods 0.000 title 2
- 238000005498 polishing Methods 0.000 title 2
- 235000012431 wafers Nutrition 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/241—Methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013025515 | 2013-02-13 | ||
JP2013250319A JP5847789B2 (en) | 2013-02-13 | 2013-12-03 | Method for manufacturing carrier for double-side polishing apparatus and double-side polishing method for wafer |
PCT/JP2014/000134 WO2014125759A1 (en) | 2013-02-13 | 2014-01-15 | Method for manufacturing carrier for double-sided polishing device and double-sided wafer polishing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201505594XA true SG11201505594XA (en) | 2015-09-29 |
Family
ID=51353776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201505594XA SG11201505594XA (en) | 2013-02-13 | 2014-01-15 | Method of producing carrier for use in double-side polishing apparatus and method of double-side polishing wafers |
Country Status (8)
Country | Link |
---|---|
US (1) | US9764443B2 (en) |
JP (1) | JP5847789B2 (en) |
KR (1) | KR102063846B1 (en) |
CN (1) | CN104968473B (en) |
DE (1) | DE112014000461T5 (en) |
SG (1) | SG11201505594XA (en) |
TW (1) | TWI577500B (en) |
WO (1) | WO2014125759A1 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6424809B2 (en) | 2015-12-11 | 2018-11-21 | 信越半導体株式会社 | Double sided polishing method of wafer |
JP6443370B2 (en) | 2016-03-18 | 2018-12-26 | 信越半導体株式会社 | Method for manufacturing carrier for double-side polishing apparatus and double-side polishing method for wafer |
CN106078493A (en) * | 2016-06-23 | 2016-11-09 | 上海汉虹精密机械有限公司 | The method of ceramic disk grinding wheel twin grinding processing sapphire wafer |
JP6579056B2 (en) * | 2016-07-29 | 2019-09-25 | 株式会社Sumco | Wafer double-side polishing method |
JP6593318B2 (en) * | 2016-12-20 | 2019-10-23 | 株式会社Sumco | Carrier plate thickness adjustment method |
JP6665827B2 (en) * | 2017-04-20 | 2020-03-13 | 信越半導体株式会社 | Wafer double-side polishing method |
CN109129028B (en) * | 2017-06-15 | 2021-11-12 | 北京天科合达半导体股份有限公司 | High-efficiency processing method of silicon carbide wafer |
JP6743785B2 (en) * | 2017-08-30 | 2020-08-19 | 株式会社Sumco | Carrier manufacturing method and wafer polishing method |
CN108000245B (en) * | 2017-11-30 | 2019-05-10 | 东莞长盈精密技术有限公司 | Hole polishing turned-down edge means of defence |
JP6870623B2 (en) * | 2018-01-18 | 2021-05-12 | 信越半導体株式会社 | Carrier manufacturing method and wafer double-sided polishing method |
JP7276246B2 (en) * | 2020-05-19 | 2023-05-18 | 信越半導体株式会社 | Method for manufacturing carrier for double-side polishing machine and method for polishing both sides of wafer |
CN111745535B (en) * | 2020-07-07 | 2022-09-02 | 郑州宇光复合材料有限公司 | Cell-phone glass grinds uses wear-resisting protective shroud |
CN112435954B (en) * | 2020-11-25 | 2024-01-26 | 西安奕斯伟材料科技股份有限公司 | Wafer carrier processing method and wafer carrier |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3524978A1 (en) * | 1985-07-12 | 1987-01-22 | Wacker Chemitronic | METHOD FOR DOUBLE-SIDED REMOVAL MACHINING OF DISK-SHAPED WORKPIECES, IN PARTICULAR SEMICONDUCTOR DISCS |
US5899743A (en) * | 1995-03-13 | 1999-05-04 | Komatsu Electronic Metals Co., Ltd. | Method for fabricating semiconductor wafers |
JP2000288922A (en) * | 1999-03-31 | 2000-10-17 | Hoya Corp | Polishing carrier, polishing method and manufacture of information recording medium substrate |
JP2001191247A (en) * | 2000-01-07 | 2001-07-17 | Hoya Corp | Both surface grinding method of disc-like substrate, manufacturing method of substrate for information recording medium and manufacturing method of information recording medium |
US6709981B2 (en) * | 2000-08-16 | 2004-03-23 | Memc Electronic Materials, Inc. | Method and apparatus for processing a semiconductor wafer using novel final polishing method |
US7276394B2 (en) * | 2001-09-20 | 2007-10-02 | Eastman Kodak Company | Large area flat image sensor assembly |
JP4224755B2 (en) * | 2001-10-16 | 2009-02-18 | 株式会社デンソー | Seed crystal fixation method |
DE10250823B4 (en) * | 2002-10-31 | 2005-02-03 | Siltronic Ag | Carrier and method for simultaneous two-sided machining of workpieces |
US20080318493A1 (en) * | 2004-08-02 | 2008-12-25 | Showa Denko K.K. | Method of Manufacturing Polishing Carrier and Silicon Substrate for Magnetic Recording Medium, and Silicon Substrate for Magnetic Recording Medium |
WO2006090661A1 (en) | 2005-02-25 | 2006-08-31 | Shin-Etsu Handotai Co., Ltd. | Carrier for double side polishing machine and double side polishing machine employing it, and double side polishing method |
US20080166952A1 (en) | 2005-02-25 | 2008-07-10 | Shin-Etsu Handotai Co., Ltd | Carrier For Double-Side Polishing Apparatus, Double-Side Polishing Apparatus And Double-Side Polishing Method Using The Same |
CN101059033A (en) * | 2006-04-20 | 2007-10-24 | 科定企业股份有限公司 | Heavy article strip press-fit type adhesion construction method for log bark plastic floor |
JP5114113B2 (en) | 2007-07-02 | 2013-01-09 | スピードファム株式会社 | Work carrier |
JP4605233B2 (en) * | 2008-02-27 | 2011-01-05 | 信越半導体株式会社 | Carrier for double-side polishing apparatus, double-side polishing apparatus and double-side polishing method using the same |
JP5233888B2 (en) * | 2009-07-21 | 2013-07-10 | 信越半導体株式会社 | Method for manufacturing carrier for double-side polishing apparatus, carrier for double-side polishing apparatus and double-side polishing method for wafer |
JP5605260B2 (en) | 2011-02-18 | 2014-10-15 | 信越半導体株式会社 | Insert material and double-side polishing machine |
JP5748717B2 (en) * | 2012-09-06 | 2015-07-15 | 信越半導体株式会社 | Double-side polishing method |
-
2013
- 2013-12-03 JP JP2013250319A patent/JP5847789B2/en active Active
-
2014
- 2014-01-15 US US14/761,554 patent/US9764443B2/en active Active
- 2014-01-15 SG SG11201505594XA patent/SG11201505594XA/en unknown
- 2014-01-15 KR KR1020157021847A patent/KR102063846B1/en active IP Right Grant
- 2014-01-15 CN CN201480006747.6A patent/CN104968473B/en active Active
- 2014-01-15 WO PCT/JP2014/000134 patent/WO2014125759A1/en active Application Filing
- 2014-01-15 DE DE112014000461.8T patent/DE112014000461T5/en active Pending
- 2014-01-24 TW TW103102728A patent/TWI577500B/en active
Also Published As
Publication number | Publication date |
---|---|
CN104968473A (en) | 2015-10-07 |
TW201446416A (en) | 2014-12-16 |
KR20150116856A (en) | 2015-10-16 |
KR102063846B1 (en) | 2020-01-08 |
TWI577500B (en) | 2017-04-11 |
JP2014176954A (en) | 2014-09-25 |
WO2014125759A1 (en) | 2014-08-21 |
DE112014000461T5 (en) | 2015-09-24 |
CN104968473B (en) | 2017-12-01 |
US20150375363A1 (en) | 2015-12-31 |
JP5847789B2 (en) | 2016-01-27 |
US9764443B2 (en) | 2017-09-19 |
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