SG11201502957WA - Improvements in plating bath metrology - Google Patents

Improvements in plating bath metrology

Info

Publication number
SG11201502957WA
SG11201502957WA SG11201502957WA SG11201502957WA SG11201502957WA SG 11201502957W A SG11201502957W A SG 11201502957WA SG 11201502957W A SG11201502957W A SG 11201502957WA SG 11201502957W A SG11201502957W A SG 11201502957WA SG 11201502957W A SG11201502957W A SG 11201502957WA
Authority
SG
Singapore
Prior art keywords
plating bath
metrology
bath metrology
plating
bath
Prior art date
Application number
SG11201502957WA
Inventor
Muneharu Kondo
Original Assignee
Moses Lake Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Moses Lake Ind Inc filed Critical Moses Lake Ind Inc
Publication of SG11201502957WA publication Critical patent/SG11201502957WA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
SG11201502957WA 2012-10-23 2013-10-22 Improvements in plating bath metrology SG11201502957WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261717225P 2012-10-23 2012-10-23
PCT/US2013/066059 WO2014066313A1 (en) 2012-10-23 2013-10-22 Improvements in plating bath metrology

Publications (1)

Publication Number Publication Date
SG11201502957WA true SG11201502957WA (en) 2015-06-29

Family

ID=50545168

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201502957WA SG11201502957WA (en) 2012-10-23 2013-10-22 Improvements in plating bath metrology

Country Status (4)

Country Link
US (1) US9783908B2 (en)
KR (1) KR102020572B1 (en)
SG (1) SG11201502957WA (en)
WO (1) WO2014066313A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9428841B2 (en) * 2014-05-21 2016-08-30 Globalfoundries Inc. Apparatuses, systems and methods that allow for selective removal of a specific metal from a multi-metal plating solution
TWI711724B (en) * 2018-11-30 2020-12-01 台灣積體電路製造股份有限公司 Electrochemical plating system, method for performing electrochemical plating process, and method of forming semiconductor substrate
CN116463676A (en) * 2022-01-12 2023-07-21 杭州三耐环保科技股份有限公司 Method and system for monitoring abnormality of additive in electrolytic production

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4132605A (en) 1976-12-27 1979-01-02 Rockwell International Corporation Method for evaluating the quality of electroplating baths
US4666567A (en) 1981-07-31 1987-05-19 The Boeing Company Automated alternating polarity pulse electrolytic processing of electrically conductive substances
US4917777A (en) 1986-04-24 1990-04-17 Shipley Company Inc. Method for analyzing additive concentration
JPH02175899A (en) * 1988-07-26 1990-07-09 Okuno Seiyaku Kogyo Kk Method for controlling current and voltage in electroplating
US5223118A (en) 1991-03-08 1993-06-29 Shipley Company Inc. Method for analyzing organic additives in an electroplating bath
US5192403A (en) 1991-05-16 1993-03-09 International Business Machines Corporation Cyclic voltammetric method for the measurement of concentrations of subcomponents of plating solution additive mixtures
US5298129A (en) 1992-11-13 1994-03-29 Hughes Aircraft Company Method of selectively monitoring trace constituents in plating baths
US5298130A (en) 1992-11-13 1994-03-29 Hughes Aircraft Company Method of monitoring major constituents in plating baths containing codepositing constituents
US5298131A (en) 1993-05-28 1994-03-29 Hughes Aircraft Company Method of monitoring metal ion content in plating baths
US5858196A (en) * 1996-01-31 1999-01-12 Kawasaki Steel Corporation Method of controlling component concentration of plating solution in continuous electroplating
US5972192A (en) 1997-07-23 1999-10-26 Advanced Micro Devices, Inc. Pulse electroplating copper or copper alloys
US6365033B1 (en) 1999-05-03 2002-04-02 Semitoof, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
USRE38931E1 (en) 1998-05-01 2006-01-10 Semitool, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
US6643226B1 (en) 1998-10-27 2003-11-04 Hewlett-Packard Development Company, L.P. Mail slot data cartridge exchange system for use with a data storage system
US6572753B2 (en) 2001-10-01 2003-06-03 Eci Technology, Inc. Method for analysis of three organic additives in an acid copper plating bath
US6733656B2 (en) 2002-04-03 2004-05-11 Eci Technology Inc. Voltammetric reference electrode calibration
US6808611B2 (en) * 2002-06-27 2004-10-26 Applied Materials, Inc. Methods in electroanalytical techniques to analyze organic components in plating baths
WO2004009880A1 (en) 2002-07-19 2004-01-29 Technic, Inc. Method and apparatus for real time monitoring of industrial electrolytes
AU2003261193A1 (en) 2002-07-19 2004-02-09 Aleksander Jaworski Method and apparatus for real time monitoring of electroplating bath performance and early fault detection
US6749739B2 (en) 2002-10-07 2004-06-15 Eci Technology, Inc. Detection of suppressor breakdown contaminants in a plating bath
US6709561B1 (en) 2002-11-06 2004-03-23 Eci Technology, Inc. Measurement of the concentration of a reducing agent in an electroless plating bath
JP2004325441A (en) * 2003-04-25 2004-11-18 Rohm & Haas Electronic Materials Llc Analytical method
US7291253B2 (en) 2004-05-04 2007-11-06 Eci Technology, Inc. Detection of an unstable additive breakdown product in a plating bath
US7186326B2 (en) 2004-05-27 2007-03-06 Eci Technology, Inc. Efficient analysis of organic additives in an acid copper plating bath
KR20060074593A (en) 2004-12-27 2006-07-03 동부일렉트로닉스 주식회사 Apparatus and method for monitoring density end point in semiconductor device
US7879222B2 (en) 2007-08-27 2011-02-01 Eci Technology, Inc. Detection of additive breakdown products in acid copper plating baths
US8372258B2 (en) * 2009-08-03 2013-02-12 Novellus Systems, Inc. Monitoring of electroplating additives
US8535504B2 (en) 2010-05-03 2013-09-17 Eci Technology, Inc. Analysis of an auxiliary leveler additive in an acid copper plating bath
US9404194B2 (en) * 2010-12-01 2016-08-02 Novellus Systems, Inc. Electroplating apparatus and process for wafer level packaging
SG10201605902RA (en) * 2011-12-12 2016-09-29 Novellus Systems Inc Monitoring leveler concentrations in electroplating solutions

Also Published As

Publication number Publication date
KR102020572B1 (en) 2019-09-10
WO2014066313A1 (en) 2014-05-01
KR20150076226A (en) 2015-07-06
US9783908B2 (en) 2017-10-10
US20150284871A1 (en) 2015-10-08

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