SG11201502324TA - Dicing tape - Google Patents
Dicing tapeInfo
- Publication number
- SG11201502324TA SG11201502324TA SG11201502324TA SG11201502324TA SG11201502324TA SG 11201502324T A SG11201502324T A SG 11201502324TA SG 11201502324T A SG11201502324T A SG 11201502324TA SG 11201502324T A SG11201502324T A SG 11201502324TA SG 11201502324T A SG11201502324T A SG 11201502324TA
- Authority
- SG
- Singapore
- Prior art keywords
- dicing tape
- dicing
- tape
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
- C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
- C09J131/04—Homopolymers or copolymers of vinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Landscapes
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012230779A JP5294366B1 (en) | 2012-10-18 | 2012-10-18 | Dicing tape |
PCT/JP2013/077898 WO2014061629A1 (en) | 2012-10-18 | 2013-10-15 | Dicing tape |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201502324TA true SG11201502324TA (en) | 2015-05-28 |
Family
ID=49396755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201502324TA SG11201502324TA (en) | 2012-10-18 | 2013-10-15 | Dicing tape |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP5294366B1 (en) |
KR (1) | KR101470802B1 (en) |
CN (1) | CN104756235B (en) |
MY (1) | MY178666A (en) |
SG (1) | SG11201502324TA (en) |
TW (1) | TWI506118B (en) |
WO (1) | WO2014061629A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6673734B2 (en) * | 2016-03-29 | 2020-03-25 | リンテック株式会社 | Pressure-sensitive adhesive sheet for glass dicing and method for producing the same |
JP6623098B2 (en) * | 2016-03-29 | 2019-12-18 | リンテック株式会社 | Adhesive sheet for glass dicing and method for producing the same |
JP6661438B2 (en) * | 2016-03-29 | 2020-03-11 | リンテック株式会社 | Pressure-sensitive adhesive sheet for glass dicing and method for producing the same |
JP6745136B2 (en) * | 2016-05-16 | 2020-08-26 | 株式会社アルバック | Electronic component manufacturing method and processing system |
KR101877897B1 (en) * | 2017-03-06 | 2018-07-12 | 엘비세미콘 주식회사 | Methods of fabricating bump structure |
JP7041476B2 (en) * | 2017-07-04 | 2022-03-24 | 日東電工株式会社 | Dicing tape and dicing die bond film |
JP6566324B2 (en) | 2017-09-29 | 2019-08-28 | サイデン化学株式会社 | Adhesive sheet |
JP7224231B2 (en) * | 2019-04-17 | 2023-02-17 | 日東電工株式会社 | Dicing die bond film |
JPWO2022255322A1 (en) * | 2021-06-02 | 2022-12-08 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2726350B2 (en) * | 1992-02-24 | 1998-03-11 | リンテック株式会社 | Adhesive sheet for attaching wafer |
JP2002373871A (en) * | 2001-06-15 | 2002-12-26 | Sekisui Chem Co Ltd | Method of manufacturing ic chip |
JP4913584B2 (en) * | 2006-03-27 | 2012-04-11 | 古河電気工業株式会社 | Wafer processing method and wafer processing tape used therefor |
JP4970863B2 (en) * | 2006-07-13 | 2012-07-11 | 日東電工株式会社 | Workpiece processing method |
JP4931519B2 (en) * | 2006-09-01 | 2012-05-16 | 日東電工株式会社 | Active surface-attached dicing adhesive tape or sheet and method of picking up a workpiece cut piece |
JP2010260893A (en) * | 2009-04-30 | 2010-11-18 | Nitto Denko Corp | Laminated film and method for producing semiconductor device |
JP2011089009A (en) * | 2009-10-22 | 2011-05-06 | Hitachi Maxell Ltd | Radiation-curable adhesive composition, adhesive film for dicing using the same and method for producing cut piece |
JP5406110B2 (en) * | 2010-04-20 | 2014-02-05 | 日東電工株式会社 | Adhesive sheet for semiconductor wafer processing |
CN101906278A (en) * | 2010-08-12 | 2010-12-08 | 华南理工大学 | Single-component polyvinylacetate binding agent and preparation method thereof |
JP5899622B2 (en) * | 2011-02-08 | 2016-04-06 | 日立化成株式会社 | Adhesive sheet for semiconductor, method for producing adhesive sheet for semiconductor, semiconductor wafer, semiconductor device, and method for producing semiconductor device |
JP5803123B2 (en) * | 2011-02-08 | 2015-11-04 | 日立化成株式会社 | Adhesive sheet for semiconductor, semiconductor wafer using the same, semiconductor device, and method for manufacturing semiconductor device |
-
2012
- 2012-10-18 JP JP2012230779A patent/JP5294366B1/en active Active
-
2013
- 2013-10-15 CN CN201380054399.5A patent/CN104756235B/en active Active
- 2013-10-15 KR KR1020147020328A patent/KR101470802B1/en active IP Right Grant
- 2013-10-15 MY MYPI2015000860A patent/MY178666A/en unknown
- 2013-10-15 WO PCT/JP2013/077898 patent/WO2014061629A1/en active Application Filing
- 2013-10-15 SG SG11201502324TA patent/SG11201502324TA/en unknown
- 2013-10-17 TW TW102137487A patent/TWI506118B/en active
Also Published As
Publication number | Publication date |
---|---|
MY178666A (en) | 2020-10-20 |
CN104756235B (en) | 2017-05-24 |
TW201430092A (en) | 2014-08-01 |
KR20140097591A (en) | 2014-08-06 |
WO2014061629A1 (en) | 2014-04-24 |
TWI506118B (en) | 2015-11-01 |
KR101470802B1 (en) | 2014-12-08 |
JP2014082414A (en) | 2014-05-08 |
JP5294366B1 (en) | 2013-09-18 |
CN104756235A (en) | 2015-07-01 |
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