SG11201408744UA - Workpiece ejection device and workpiece supply device provided with same - Google Patents
Workpiece ejection device and workpiece supply device provided with sameInfo
- Publication number
- SG11201408744UA SG11201408744UA SG11201408744UA SG11201408744UA SG11201408744UA SG 11201408744U A SG11201408744U A SG 11201408744UA SG 11201408744U A SG11201408744U A SG 11201408744UA SG 11201408744U A SG11201408744U A SG 11201408744UA SG 11201408744U A SG11201408744U A SG 11201408744UA
- Authority
- SG
- Singapore
- Prior art keywords
- workpiece
- same
- supply device
- device provided
- ejection device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Automatic Assembly (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012146240A JP5992229B2 (en) | 2012-06-29 | 2012-06-29 | Work extruding apparatus and work supplying apparatus having the same |
PCT/JP2013/067438 WO2014003029A1 (en) | 2012-06-29 | 2013-06-26 | Workpiece ejection device and workpiece supply device provided with same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201408744UA true SG11201408744UA (en) | 2015-02-27 |
Family
ID=49783170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201408744UA SG11201408744UA (en) | 2012-06-29 | 2013-06-26 | Workpiece ejection device and workpiece supply device provided with same |
Country Status (8)
Country | Link |
---|---|
JP (1) | JP5992229B2 (en) |
KR (1) | KR102070744B1 (en) |
CN (1) | CN104395037B (en) |
HK (1) | HK1203889A1 (en) |
MY (1) | MY171474A (en) |
SG (1) | SG11201408744UA (en) |
TW (1) | TWI566320B (en) |
WO (1) | WO2014003029A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7104081B2 (en) * | 2020-01-30 | 2022-07-20 | 株式会社鈴木 | Work supply device |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4742400Y1 (en) | 1968-12-09 | 1972-12-21 | ||
JPS606115Y2 (en) * | 1980-03-18 | 1985-02-26 | 神鋼アルフレツシユ株式会社 | Support frame device for renovated buildings |
JPH0447159Y2 (en) * | 1985-05-14 | 1992-11-06 | ||
JPS62216243A (en) * | 1986-03-17 | 1987-09-22 | Tokyo Seimitsu Co Ltd | Extruder for wafer |
JPH066115Y2 (en) * | 1987-03-16 | 1994-02-16 | 東京エレクトロン株式会社 | Wafer supply device |
JP3238786B2 (en) * | 1993-03-23 | 2001-12-17 | ローム株式会社 | Lead frame or printed circuit board feeding device |
JP2000298099A (en) * | 1999-04-15 | 2000-10-24 | Citizen Watch Co Ltd | Component inspection method, component control method and component sorting method |
JP3943293B2 (en) * | 1999-08-17 | 2007-07-11 | 武蔵エンジニアリング株式会社 | Work feeder with overload detection function |
JP4742400B2 (en) * | 1999-10-01 | 2011-08-10 | パナソニック株式会社 | Pusher and loader |
CN1248563C (en) * | 1999-12-16 | 2006-03-29 | 西门子公司 | Assembly device comprising several transport lines for substrates to be assembled |
DE10117023A1 (en) * | 2001-04-05 | 2002-10-10 | Bsh Bosch Siemens Hausgeraete | Cooking appliance |
US20030002964A1 (en) * | 2001-06-27 | 2003-01-02 | Hee Wee Boon | Handler system incorporating a semi-automatic tray replacement apparatus and method of use |
JP4278584B2 (en) * | 2004-08-03 | 2009-06-17 | 日新工機株式会社 | Pool floor lifting device |
EP2287082B1 (en) * | 2009-08-17 | 2012-04-18 | Tetra Laval Holdings & Finance S.A. | Multilayer sheet packaging material for producing sealed packages of pourable food products |
-
2012
- 2012-06-29 JP JP2012146240A patent/JP5992229B2/en active Active
-
2013
- 2013-06-26 SG SG11201408744UA patent/SG11201408744UA/en unknown
- 2013-06-26 KR KR1020157002348A patent/KR102070744B1/en active IP Right Grant
- 2013-06-26 CN CN201380034695.9A patent/CN104395037B/en active Active
- 2013-06-26 WO PCT/JP2013/067438 patent/WO2014003029A1/en active Application Filing
- 2013-06-26 MY MYPI2014704044A patent/MY171474A/en unknown
- 2013-06-28 TW TW102123222A patent/TWI566320B/en active
-
2015
- 2015-05-08 HK HK15104374.1A patent/HK1203889A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP5992229B2 (en) | 2016-09-14 |
CN104395037B (en) | 2017-02-22 |
KR102070744B1 (en) | 2020-01-29 |
MY171474A (en) | 2019-10-15 |
HK1203889A1 (en) | 2015-11-06 |
JP2014008567A (en) | 2014-01-20 |
TW201409600A (en) | 2014-03-01 |
TWI566320B (en) | 2017-01-11 |
WO2014003029A1 (en) | 2014-01-03 |
CN104395037A (en) | 2015-03-04 |
KR20150021130A (en) | 2015-02-27 |
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