SG11201407234QA - Compact ampoule thermal management system - Google Patents

Compact ampoule thermal management system

Info

Publication number
SG11201407234QA
SG11201407234QA SG11201407234QA SG11201407234QA SG11201407234QA SG 11201407234Q A SG11201407234Q A SG 11201407234QA SG 11201407234Q A SG11201407234Q A SG 11201407234QA SG 11201407234Q A SG11201407234Q A SG 11201407234QA SG 11201407234Q A SG11201407234Q A SG 11201407234QA
Authority
SG
Singapore
Prior art keywords
california
lllll
international
thermal management
llll
Prior art date
Application number
SG11201407234QA
Inventor
David K Carlson
Errol Antonio C Sanchez
Kenric Choi
Marcel E Josephson
Dennis Demars
Emre Cuvalci
Mehmet Tugrul Samir
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201407234QA publication Critical patent/SG11201407234QA/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
    • C23C16/4482—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material by bubbling of carrier gas through liquid source material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Control Of Temperature (AREA)
  • Packages (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

(12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 12 December 2013 (12.12.2013) WIPOIPCT (10) International Publication Number WO 2013/184760 A1 (51) International Patent Classification: H01L 21/02 (2006.01) (21) International Application Number: PCT/US2013/044256 (22) International Filing Date: 5 June 2013 (05.06.2013) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 61/655,767 5 June 2012 (05.06.2012) US 13/902,304 24 May 2013 (24.05.2013) US 13/902,310 24 May 2013 (24.05.2013) US (71) Applicant: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue, Santa Clara, California 95054 (US). (72) Inventors: CARLSON, David K.; 4054 Claitor Way, San Jose, California 95132 (US). SANCHEZ, Errol Antonio C.; 324 Jill Drive, Tracy, California 95377 (US). CHOI, Kenric; 1115 South Daniel Way, San Jose, California 95128 (US). JOSEPHSON, Marcel E.; 7090 Martwood Way, San Jose, California 95120 (US). DEMARS, Den­ nis; 3180 Humboldt Avenue, Santa Clara, California 95051 (US). CUVALCI, Emre; 3 River Oaks Circle, Apt. 823, San Jose, California 95134 (US). SAMIR, Mehmet Tugrul; 1019 Ashbury Way, Mountain View, California 94043 (US). (74) Agent: TABOADA, Alan; Moser Taboada, 1030 Broad Street, Suite 203, Shrewsbury, New Jersey 07702 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available)'. AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available)'. ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, [Continued on next page] (54) Title: COMPACT AMPOULE THERMAL MANAGEMENT SYSTEM (57) Abstract: Apparatus for thermal management of precursor a for use in substrate processing are provided herein. In some embodiments, an apparatus for thermal management of precursor a for use in substrate processing may include body a having an opening sized to receive a storage container having a liquid or solid precursor disposed therein, the body fabricated from thermally conductive material; one or more thermoelectric devices coupled to the body proximate the opening; and heat sink coupled a to the one or more thermoelectric devices. FIG. 1 WO 2013/184760 Al I lllll llllllll II llllll lllll III lllll III III III lllll lllll lllll llll lllll lllll llll lllllll llll llll TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, Pu EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, _ LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, — GW, KM, ML, MR, NE, SN, TD, TG). with international search report (Art. 21(3)) before the expiration of the time limit for amending the claims and to be republished in the event of receipt of amendments (Rule 48.2(h))
SG11201407234QA 2012-06-05 2013-06-05 Compact ampoule thermal management system SG11201407234QA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201261655767P 2012-06-05 2012-06-05
US13/902,310 US9279604B2 (en) 2012-06-05 2013-05-24 Compact ampoule thermal management system
US13/902,304 US9347696B2 (en) 2012-06-05 2013-05-24 Compact ampoule thermal management system
PCT/US2013/044256 WO2013184760A1 (en) 2012-06-05 2013-06-05 Compact ampoule thermal management system

Publications (1)

Publication Number Publication Date
SG11201407234QA true SG11201407234QA (en) 2014-12-30

Family

ID=49668610

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201407234QA SG11201407234QA (en) 2012-06-05 2013-06-05 Compact ampoule thermal management system
SG10201702767UA SG10201702767UA (en) 2012-06-05 2013-06-05 Compact ampoule thermal management system

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201702767UA SG10201702767UA (en) 2012-06-05 2013-06-05 Compact ampoule thermal management system

Country Status (6)

Country Link
US (2) US9279604B2 (en)
KR (2) KR101700494B1 (en)
CN (1) CN104335326B (en)
SG (2) SG11201407234QA (en)
TW (2) TWI579933B (en)
WO (1) WO2013184760A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI726944B (en) * 2015-12-06 2021-05-11 美商應用材料股份有限公司 Continuous liquid level measurement detector for closed metal containers
US10619243B2 (en) * 2016-07-22 2020-04-14 Triratna P. Muneshwar Method to improve precursor utilization in pulsed atomic layer processes
US10557203B2 (en) 2016-12-12 2020-02-11 Applied Materials, Inc. Temperature control system and process for gaseous precursor delivery
CN110313056B (en) * 2017-01-17 2024-02-20 莱尔德技术股份有限公司 Compressible foaming thermal interface material and preparation method and application method thereof

Family Cites Families (13)

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Publication number Priority date Publication date Assignee Title
US5954911A (en) * 1995-10-12 1999-09-21 Semitool, Inc. Semiconductor processing using vapor mixtures
JPH11225490A (en) * 1997-12-05 1999-08-17 Seiko Instruments Inc Thermoelectric conversion module and electronic apparatus
US20040261703A1 (en) 2003-06-27 2004-12-30 Jeffrey D. Chinn Apparatus and method for controlled application of reactive vapors to produce thin films and coatings
US7261118B2 (en) 2003-08-19 2007-08-28 Air Products And Chemicals, Inc. Method and vessel for the delivery of precursor materials
GB2424358B (en) * 2005-03-23 2008-07-30 David Anthony Alfille Temperature-controlled container for foodstuffs
US7939422B2 (en) * 2006-12-07 2011-05-10 Applied Materials, Inc. Methods of thin film process
KR100862760B1 (en) * 2007-04-12 2008-10-13 에스케이 텔레콤주식회사 Record based service method by using mobile communication network and its service system, mobile communication terminal therefor
KR100862720B1 (en) 2007-07-31 2008-10-10 포아텍 주식회사 Apparatus for controlling temperature in chemical container and photoresist coating apparatus using the same
US20090084112A1 (en) * 2007-10-02 2009-04-02 Demetrius Calvin Ham Thermoelectric vehicle engine air cooler
US8132793B2 (en) 2008-09-12 2012-03-13 Msp Corporation Method and apparatus for liquid precursor atomization
US20100186423A1 (en) * 2009-01-23 2010-07-29 Prince Castle Inc. Hot or cold food receptacle utilizing a peltier device with air flow temperature control
KR101072471B1 (en) 2009-05-19 2011-10-12 주식회사 마이크로이즈 Apparatus for Supplying Precursor and System for Depositing Thin Film with the Same
KR101132972B1 (en) * 2009-12-29 2012-04-09 (주)한동알앤씨 Led lamp device with heat radiating structure

Also Published As

Publication number Publication date
TWI563575B (en) 2016-12-21
KR101700494B1 (en) 2017-01-26
US20130319013A1 (en) 2013-12-05
US9279604B2 (en) 2016-03-08
TW201705312A (en) 2017-02-01
CN104335326B (en) 2017-06-30
SG10201702767UA (en) 2017-05-30
KR20160098533A (en) 2016-08-18
US20130319015A1 (en) 2013-12-05
TW201411737A (en) 2014-03-16
WO2013184760A1 (en) 2013-12-12
KR20150023495A (en) 2015-03-05
US9347696B2 (en) 2016-05-24
KR101727442B1 (en) 2017-04-14
TWI579933B (en) 2017-04-21
CN104335326A (en) 2015-02-04

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