SG11201405352PA - Apparatus and method for separating a stacked arrangement - Google Patents
Apparatus and method for separating a stacked arrangementInfo
- Publication number
- SG11201405352PA SG11201405352PA SG11201405352PA SG11201405352PA SG11201405352PA SG 11201405352P A SG11201405352P A SG 11201405352PA SG 11201405352P A SG11201405352P A SG 11201405352PA SG 11201405352P A SG11201405352P A SG 11201405352PA SG 11201405352P A SG11201405352P A SG 11201405352PA
- Authority
- SG
- Singapore
- Prior art keywords
- separating
- stacked arrangement
- stacked
- arrangement
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
- H01L21/7813—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate leaving a reusable substrate, e.g. epitaxial lift off
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1892—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates
- H01L31/1896—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates for thin-film semiconductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/16—Tension
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1111—Using solvent during delaminating [e.g., water dissolving adhesive at bonding face during delamination, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1978—Delaminating bending means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261637020P | 2012-04-23 | 2012-04-23 | |
PCT/SG2013/000150 WO2013162468A1 (en) | 2012-04-23 | 2013-04-17 | Apparatus and method for separating a stacked arrangement |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201405352PA true SG11201405352PA (en) | 2014-09-26 |
Family
ID=49483597
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201405352PA SG11201405352PA (en) | 2012-04-23 | 2013-04-17 | Apparatus and method for separating a stacked arrangement |
Country Status (6)
Country | Link |
---|---|
US (1) | US9522521B2 (en) |
EP (1) | EP2842177A4 (en) |
KR (1) | KR20150001822A (en) |
CN (1) | CN104247068B (en) |
SG (1) | SG11201405352PA (en) |
WO (1) | WO2013162468A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2523209B1 (en) * | 2010-04-23 | 2017-03-08 | EV Group GmbH | Device and method for releasing a product substrate from a holder substrate |
US20170076986A1 (en) * | 2015-07-15 | 2017-03-16 | The Regents Of The University Of Michigan | Non-destructive epitaxial lift-off of large area iii-v thin-film grown by metal organic chemical vapor deposition and substrate reuse |
CN107424944B (en) * | 2017-06-28 | 2022-09-06 | 紫石能源有限公司 | Epitaxial layer stripping device and stripping method |
RU2683808C1 (en) * | 2018-04-19 | 2019-04-02 | Федеральное государственное бюджетное учреждение науки Институт физики полупроводников им. А.В. Ржанова Сибирского отделения Российской академии наук (ИФП СО РАН) | Device for separation of composite structure from substrate on basis of semiconductor film (options) |
DE102019135499B3 (en) * | 2019-12-20 | 2021-04-01 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Release element, release unit and method for releasing a semiconductor layer from a substrate |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4826553A (en) * | 1987-06-18 | 1989-05-02 | The United States Of America As Represented By The Secretary Of The Air Force | Method for replicating an optical element |
US4846931A (en) | 1988-03-29 | 1989-07-11 | Bell Communications Research, Inc. | Method for lifting-off epitaxial films |
US6071795A (en) | 1998-01-23 | 2000-06-06 | The Regents Of The University Of California | Separation of thin films from transparent substrates by selective optical processing |
JP2000084844A (en) * | 1998-09-17 | 2000-03-28 | Asahi Glass Co Ltd | Plate body separating method and device therefor |
JP2004507880A (en) | 2000-04-17 | 2004-03-11 | ザ ペン ステイト リサーチ ファンデーション | Deposited thin films and their use in application to separation and sacrificial layers |
JP2003071860A (en) * | 2001-09-06 | 2003-03-12 | Canon Inc | Molding apparatus for optical element, molding method using the same and optical element |
TWI413152B (en) | 2005-03-01 | 2013-10-21 | Semiconductor Energy Lab | Manufacturing method of semiconductor device |
JP2009206418A (en) * | 2008-02-29 | 2009-09-10 | Elpida Memory Inc | Nonvolatile memory device and manufacturing method for the same |
KR101550480B1 (en) | 2008-05-30 | 2015-09-07 | 알타 디바이씨즈, 인크. | Epitaxial lift off stacks and methods |
WO2011024689A1 (en) * | 2009-08-31 | 2011-03-03 | 旭硝子株式会社 | Peeling device |
WO2011109560A1 (en) * | 2010-03-02 | 2011-09-09 | Alta Devices, Inc. | Epitaxial lift off systems and methods |
US9490158B2 (en) * | 2015-01-08 | 2016-11-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bond chuck, methods of bonding, and tool including bond chuck |
-
2013
- 2013-04-17 CN CN201380019900.4A patent/CN104247068B/en not_active Expired - Fee Related
- 2013-04-17 SG SG11201405352PA patent/SG11201405352PA/en unknown
- 2013-04-17 EP EP13782595.6A patent/EP2842177A4/en not_active Withdrawn
- 2013-04-17 KR KR1020147031802A patent/KR20150001822A/en not_active Application Discontinuation
- 2013-04-17 US US14/390,239 patent/US9522521B2/en not_active Expired - Fee Related
- 2013-04-17 WO PCT/SG2013/000150 patent/WO2013162468A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP2842177A4 (en) | 2015-11-04 |
US20150053352A1 (en) | 2015-02-26 |
WO2013162468A1 (en) | 2013-10-31 |
US9522521B2 (en) | 2016-12-20 |
EP2842177A1 (en) | 2015-03-04 |
CN104247068A (en) | 2014-12-24 |
KR20150001822A (en) | 2015-01-06 |
CN104247068B (en) | 2017-12-05 |
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