SG11201405348QA - Sputtering target for magnetic recording medium, and process for producing same - Google Patents

Sputtering target for magnetic recording medium, and process for producing same

Info

Publication number
SG11201405348QA
SG11201405348QA SG11201405348QA SG11201405348QA SG11201405348QA SG 11201405348Q A SG11201405348Q A SG 11201405348QA SG 11201405348Q A SG11201405348Q A SG 11201405348QA SG 11201405348Q A SG11201405348Q A SG 11201405348QA SG 11201405348Q A SG11201405348Q A SG 11201405348QA
Authority
SG
Singapore
Prior art keywords
recording medium
magnetic recording
sputtering target
producing same
producing
Prior art date
Application number
SG11201405348QA
Inventor
Shin-Ichi Ogino
Yuichiro Nakamura
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of SG11201405348QA publication Critical patent/SG11201405348QA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/07—Alloys based on nickel or cobalt based on cobalt
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/10—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of nickel or cobalt or alloys based thereon
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/851—Coating a support with a magnetic layer by sputtering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4998—Combined manufacture including applying or shaping of fluent material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Magnetic Record Carriers (AREA)
  • Thin Magnetic Films (AREA)
SG11201405348QA 2012-03-09 2013-03-01 Sputtering target for magnetic recording medium, and process for producing same SG11201405348QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012053785 2012-03-09
PCT/JP2013/055672 WO2013133163A1 (en) 2012-03-09 2013-03-01 Sputtering target for magnetic recording medium, and process for producing same

Publications (1)

Publication Number Publication Date
SG11201405348QA true SG11201405348QA (en) 2014-11-27

Family

ID=49116643

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201405348QA SG11201405348QA (en) 2012-03-09 2013-03-01 Sputtering target for magnetic recording medium, and process for producing same

Country Status (7)

Country Link
US (2) US9970099B2 (en)
JP (2) JP6083679B2 (en)
CN (1) CN104170015B (en)
MY (2) MY174585A (en)
SG (1) SG11201405348QA (en)
TW (1) TW201400632A (en)
WO (1) WO2013133163A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3015566B1 (en) * 2013-11-28 2021-09-15 JX Nippon Mining & Metals Corporation Magnetic material sputtering target and method for producing same
SG11201704465WA (en) 2015-03-04 2017-06-29 Jx Nippon Mining & Metals Corp Magnetic material sputtering target and method for producing same
TWI684658B (en) * 2016-12-06 2020-02-11 光洋應用材料科技股份有限公司 Co-cr-pt-based alloy sputtering target and method of preparing the same
JP7483999B1 (en) 2023-09-22 2024-05-15 Ｊｘ金属株式会社 Sputtering targets and sputtering target assemblies

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5282946A (en) * 1991-08-30 1994-02-01 Mitsubishi Materials Corporation Platinum-cobalt alloy sputtering target and method for manufacturing same
JPH05247638A (en) * 1992-03-03 1993-09-24 Mitsubishi Materials Corp Sputtering target and manufacture therefore
JP2857729B2 (en) 1992-07-24 1999-02-17 株式会社クボタ Target member for spatter and method for producing the same
JPH06104120A (en) 1992-08-03 1994-04-15 Hitachi Metals Ltd Sputtering target for magnetic recording medium and its production
JP2806228B2 (en) * 1993-10-25 1998-09-30 株式会社神戸製鋼所 Method for lowering magnetic permeability of hard-to-work Co alloy
JP2000282229A (en) * 1999-03-29 2000-10-10 Hitachi Metals Ltd CoPt SPUTTERING TARGET, ITS PRODUCTION, MAGNETIC RECORDING FILM AND CoPt MAGNETIC RECORDING MEDIUM
JP2001026860A (en) 1999-07-14 2001-01-30 Hitachi Metals Ltd Co-Pt-B BASE TARGET AND ITS PRODUCTION
JP2001098360A (en) 1999-09-24 2001-04-10 Hitachi Metals Ltd Co-Cr-Pt-C TARGET, ITS MANUFACTURE, AND MAGNETIC RECORDING MEDIUM
US6599377B2 (en) * 1999-10-01 2003-07-29 Heraeus, Inc. Wrought processing of brittle target alloy for sputtering applications
JP4573381B2 (en) 1999-12-24 2010-11-04 三井金属鉱業株式会社 Manufacturing method of sputtering target
US7336336B2 (en) 2003-10-14 2008-02-26 Lg. Philips Co. Ltd. Thin film transistor array substrate, method of fabricating the same, liquid crystal display panel having the same and fabricating method thereof
JP4026767B2 (en) * 2003-11-11 2007-12-26 日鉱金属株式会社 Co-Cr-Pt-B alloy sputtering target and method for producing the same
JP4827033B2 (en) * 2004-03-01 2011-11-30 Ｊｘ日鉱日石金属株式会社 Sputtering target with less surface defects and surface processing method thereof
WO2005093124A1 (en) * 2004-03-26 2005-10-06 Nippon Mining & Metals Co., Ltd. Co-Cr-Pt-B BASED ALLOY SPUTTERING TARGET
US20050277002A1 (en) 2004-06-15 2005-12-15 Heraeus, Inc. Enhanced sputter target alloy compositions
US20050274221A1 (en) 2004-06-15 2005-12-15 Heraeus, Inc. Enhanced sputter target alloy compositions
US20070017803A1 (en) 2005-07-22 2007-01-25 Heraeus, Inc. Enhanced sputter target manufacturing method
US9034153B2 (en) 2006-01-13 2015-05-19 Jx Nippon Mining & Metals Corporation Nonmagnetic material particle dispersed ferromagnetic material sputtering target
JP2008023545A (en) * 2006-07-19 2008-02-07 Mitsui Mining & Smelting Co Ltd Method for manufacturing hardly workable alloy sputtering target material
CN101981224B (en) 2008-03-28 2012-08-22 Jx日矿日石金属株式会社 Sputtering target of nonmagnetic-in-ferromagnetic dispersion type material
US9103023B2 (en) 2009-03-27 2015-08-11 Jx Nippon Mining & Metals Corporation Nonmagnetic material particle-dispersed ferromagnetic material sputtering target
US9034155B2 (en) 2009-08-06 2015-05-19 Jx Nippon Mining & Metals Corporation Inorganic-particle-dispersed sputtering target
US9269389B2 (en) 2009-12-11 2016-02-23 Jx Nippon Mining & Metals Corporation Sputtering target of magnetic material
MY149437A (en) 2010-01-21 2013-08-30 Jx Nippon Mining & Metals Corp Ferromagnetic material sputtering target
WO2012011204A1 (en) 2010-07-20 2012-01-26 Jx日鉱日石金属株式会社 Ferromagnetic material sputtering target with little particle generation
SG185768A1 (en) 2010-07-20 2013-01-30 Jx Nippon Mining & Metals Corp Sputtering target of ferromagnetic material with low generation of particles
MY160775A (en) 2010-09-03 2017-03-15 Jx Nippon Mining & Metals Corp Ferromagnetic material sputtering target
US8953732B2 (en) * 2010-12-09 2015-02-10 Westinghouse Electric Company Llc Nuclear reactor internal hydraulic control rod drive mechanism assembly
MY158512A (en) 2010-12-09 2016-10-14 Jx Nippon Mining & Metals Corp Ferromagnetic material sputtering target
US20130175167A1 (en) 2010-12-15 2013-07-11 Jx Nippon Mining & Metals Corporation Ferromagnetic sputtering target and method for manufacturing same
WO2012081669A1 (en) 2010-12-17 2012-06-21 Jx日鉱日石金属株式会社 Ferromagnetic material sputtering target
MY155977A (en) 2010-12-22 2015-12-31 Jx Nippon Mining & Metals Corp Ferromagnetic sputtering target
CN103270190B (en) 2010-12-22 2016-01-20 吉坤日矿日石金属株式会社 Sinter sputtering target
CN108642456B (en) 2011-06-30 2022-03-25 吉坤日矿日石金属株式会社 Co-Cr-Pt-B alloy sputtering target and method for producing same
WO2013027443A1 (en) 2011-08-23 2013-02-28 Jx日鉱日石金属株式会社 Ferromagnetic sputtering target with minimized particle generation

Also Published As

Publication number Publication date
US10266939B2 (en) 2019-04-23
JPWO2013133163A1 (en) 2015-07-30
JP6083679B2 (en) 2017-02-22
CN104170015B (en) 2018-08-31
TW201400632A (en) 2014-01-01
JP2015180775A (en) 2015-10-15
US20180163294A1 (en) 2018-06-14
JP6231035B2 (en) 2017-11-15
WO2013133163A1 (en) 2013-09-12
CN104170015A (en) 2014-11-26
MY192950A (en) 2022-09-19
US9970099B2 (en) 2018-05-15
US20150027882A1 (en) 2015-01-29
TWI563107B (en) 2016-12-21
MY174585A (en) 2020-04-28

Similar Documents

Publication Publication Date Title
SG11201404072YA (en) Sputtering target for forming magnetic recording film and process for producing same
EP2683053A4 (en) Charging control system, charging control method and recording medium
EP2754471A4 (en) Game system, game control method and recording medium
SG11201403319RA (en) Silver-alloy sputtering target for conductive-film formation, and method for producing same
EP2717217A4 (en) Information providing device, information providing method, information providing program, and recoding medium
SG11201405518YA (en) Magnetic recording medium for heat-assisted magnetic recording
EP2742490A4 (en) Sentimental information associated with an object within media
SG11201404067PA (en) Sputtering target for magnetic recording film
EP3015566A4 (en) Magnetic material sputtering target and method for producing same
MY156716A (en) Sputtering target for magnetic recording film and process for production thereof
SG11201502575TA (en) Perpendicular magnetic recording medium
SG11201404314WA (en) Magnetic material sputtering target and manufacturing method for same
SG11201502573SA (en) Magnetic recording medium
SG10201508695WA (en) Soft magnetic alloy for magnetic recording, sputtering target material, and magnetic recording medium
EP2683052A4 (en) Charging control system, charging control method and recording medium
EP2704014A4 (en) Server, server control method, program and recording medium
SG11201403264SA (en) Fe-Pt-Ag-C-BASED SPUTTERING TARGET HAVING C PARTICLES DISPERSED THEREIN, AND METHOD FOR PRODUCING SAME
EP2818574A4 (en) Sputtering target and process for producing same
EP2784173A4 (en) Sputtering target and method for producing same
SG11201403857TA (en) Co-Cr-Pt-BASED SPUTTERING TARGET AND METHOD FOR PRODUCING SAME
SG10201605534QA (en) Glass substrate for magnetic recording medium, and magnetic recording medium
IL223754B (en) Sputtering target and/or coil and process for producing same
EP2772564A4 (en) Indium sputtering target, and method for producing same
SG11201405543PA (en) Perpendicular magnetic recording medium
SG11201408798PA (en) Soft magnetic alloy for magnetic recording purposes, sputtering target material, and magnetic recording medium