SG11201404171YA - Multiple energization elements in stacked integrated component devices - Google Patents

Multiple energization elements in stacked integrated component devices

Info

Publication number
SG11201404171YA
SG11201404171YA SG11201404171YA SG11201404171YA SG11201404171YA SG 11201404171Y A SG11201404171Y A SG 11201404171YA SG 11201404171Y A SG11201404171Y A SG 11201404171YA SG 11201404171Y A SG11201404171Y A SG 11201404171YA SG 11201404171Y A SG11201404171Y A SG 11201404171YA
Authority
SG
Singapore
Prior art keywords
integrated component
component devices
stacked integrated
energization elements
multiple energization
Prior art date
Application number
SG11201404171YA
Inventor
Randall B Pugh
Frederick A Flitsch
Daniel B Otts
James Daniel Riall
Adam Toner
Original Assignee
Johnson & Johnson Vision Care
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson & Johnson Vision Care filed Critical Johnson & Johnson Vision Care
Publication of SG11201404171YA publication Critical patent/SG11201404171YA/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B29D11/00807—Producing lenses combined with electronics, e.g. chips
    • B29D11/00817—Producing electro-active lenses or lenses with energy receptors, e.g. batteries or antennas
    • B29D11/00826—Producing electro-active lenses or lenses with energy receptors, e.g. batteries or antennas with energy receptors for wireless energy transmission
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C11/00—Non-optical adjuncts; Attachment thereof
    • G02C11/10—Electronic devices other than hearing aids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00038—Production of contact lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G02C7/04—Contact lenses for the eyes
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G02C7/08—Auxiliary lenses; Arrangements for varying focal length
    • G02C7/081—Ophthalmic lenses with variable focal length
    • G02C7/083—Electrooptic lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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    • H—ELECTRICITY
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    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
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    • G02C2202/16—Laminated or compound lenses
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    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
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    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06506—Wire or wire-like electrical connections between devices
    • H—ELECTRICITY
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    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H01L2225/06562—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking at least one device in the stack being rotated or offset
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    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06572—Auxiliary carrier between devices, the carrier having an electrical connection structure
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
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    • H01L2924/01015—Phosphorus [P]
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    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
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    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
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    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/052—Li-accumulators
    • H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings, jackets or wrappings of a single cell or a single battery
    • H01M50/102—Primary casings, jackets or wrappings of a single cell or a single battery characterised by their shape or physical structure
    • H01M50/107—Primary casings, jackets or wrappings of a single cell or a single battery characterised by their shape or physical structure having curved cross-section, e.g. round or elliptic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
SG11201404171YA 2012-01-26 2013-01-25 Multiple energization elements in stacked integrated component devices SG11201404171YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/358,916 US9110310B2 (en) 2011-03-18 2012-01-26 Multiple energization elements in stacked integrated component devices
PCT/US2013/023097 WO2013112803A2 (en) 2012-01-26 2013-01-25 Multiple energization elements in stacked integrated component devices

Publications (1)

Publication Number Publication Date
SG11201404171YA true SG11201404171YA (en) 2014-09-26

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Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201404171YA SG11201404171YA (en) 2012-01-26 2013-01-25 Multiple energization elements in stacked integrated component devices

Country Status (13)

Country Link
US (2) US9110310B2 (en)
EP (1) EP2807672A2 (en)
JP (2) JP6158227B2 (en)
KR (1) KR20140116539A (en)
CN (1) CN104205329B (en)
AU (1) AU2013212002B2 (en)
BR (1) BR112014018454A8 (en)
CA (1) CA2862640A1 (en)
HK (1) HK1204508A1 (en)
RU (1) RU2596629C2 (en)
SG (1) SG11201404171YA (en)
TW (1) TWI593080B (en)
WO (1) WO2013112803A2 (en)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9675443B2 (en) 2009-09-10 2017-06-13 Johnson & Johnson Vision Care, Inc. Energized ophthalmic lens including stacked integrated components
US9475709B2 (en) 2010-08-25 2016-10-25 Lockheed Martin Corporation Perforated graphene deionization or desalination
US8950862B2 (en) 2011-02-28 2015-02-10 Johnson & Johnson Vision Care, Inc. Methods and apparatus for an ophthalmic lens with functional insert layers
US9889615B2 (en) 2011-03-18 2018-02-13 Johnson & Johnson Vision Care, Inc. Stacked integrated component media insert for an ophthalmic device
US9698129B2 (en) 2011-03-18 2017-07-04 Johnson & Johnson Vision Care, Inc. Stacked integrated component devices with energization
US10451897B2 (en) 2011-03-18 2019-10-22 Johnson & Johnson Vision Care, Inc. Components with multiple energization elements for biomedical devices
US9110310B2 (en) * 2011-03-18 2015-08-18 Johnson & Johnson Vision Care, Inc. Multiple energization elements in stacked integrated component devices
US9804418B2 (en) 2011-03-21 2017-10-31 Johnson & Johnson Vision Care, Inc. Methods and apparatus for functional insert with power layer
US8857983B2 (en) 2012-01-26 2014-10-14 Johnson & Johnson Vision Care, Inc. Ophthalmic lens assembly having an integrated antenna structure
US9482879B2 (en) 2012-02-28 2016-11-01 Johnson & Johnson Vision Care, Inc. Methods of manufacture and use of energized ophthalmic devices having an electrical storage mode
TWI572941B (en) * 2012-02-28 2017-03-01 壯生和壯生視覺關懷公司 Methods and apparatus to form electronic circuitry on ophthalmic devices
US10376845B2 (en) 2016-04-14 2019-08-13 Lockheed Martin Corporation Membranes with tunable selectivity
US10980919B2 (en) 2016-04-14 2021-04-20 Lockheed Martin Corporation Methods for in vivo and in vitro use of graphene and other two-dimensional materials
US10118130B2 (en) 2016-04-14 2018-11-06 Lockheed Martin Corporation Two-dimensional membrane structures having flow passages
US9744617B2 (en) 2014-01-31 2017-08-29 Lockheed Martin Corporation Methods for perforating multi-layer graphene through ion bombardment
US9610546B2 (en) 2014-03-12 2017-04-04 Lockheed Martin Corporation Separation membranes formed from perforated graphene and methods for use thereof
US10653824B2 (en) 2012-05-25 2020-05-19 Lockheed Martin Corporation Two-dimensional materials and uses thereof
US9834809B2 (en) 2014-02-28 2017-12-05 Lockheed Martin Corporation Syringe for obtaining nano-sized materials for selective assays and related methods of use
US8960899B2 (en) * 2012-09-26 2015-02-24 Google Inc. Assembling thin silicon chips on a contact lens
TW201504140A (en) 2013-03-12 2015-02-01 Lockheed Corp Method for forming perforated graphene with uniform aperture size
US10025114B2 (en) 2013-03-13 2018-07-17 Johnson & Johnson Vision Care, Inc. Hydrogel lens having raised portions for improved oxygen transmission and tear flow
US9429769B2 (en) * 2013-05-09 2016-08-30 Johnson & Johnson Vision Care, Inc. Ophthalmic device with thin film nanocrystal integrated circuits
US9572918B2 (en) 2013-06-21 2017-02-21 Lockheed Martin Corporation Graphene-based filter for isolating a substance from blood
US9987808B2 (en) * 2013-11-22 2018-06-05 Johnson & Johnson Vision Care, Inc. Methods for formation of an ophthalmic lens with an insert utilizing voxel-based lithography techniques
US9731437B2 (en) 2013-11-22 2017-08-15 Johnson & Johnson Vision Care, Inc. Method of manufacturing hydrogel ophthalmic devices with electronic elements
WO2015116946A1 (en) 2014-01-31 2015-08-06 Lockheed Martin Corporation Perforating two-dimensional materials using broad ion field
KR20160142282A (en) 2014-01-31 2016-12-12 록히드 마틴 코포레이션 Processes for forming composite structures with a two-dimensional material using a porous, non-sacrificial supporting layer
CA2942496A1 (en) 2014-03-12 2015-09-17 Lockheed Martin Corporation Separation membranes formed from perforated graphene
US9841614B2 (en) * 2014-06-13 2017-12-12 Verily Life Sciences Llc Flexible conductor for use within a contact lens
US9599842B2 (en) 2014-08-21 2017-03-21 Johnson & Johnson Vision Care, Inc. Device and methods for sealing and encapsulation for biocompatible energization elements
US10627651B2 (en) 2014-08-21 2020-04-21 Johnson & Johnson Vision Care, Inc. Methods and apparatus to form biocompatible energization primary elements for biomedical devices with electroless sealing layers
US10361404B2 (en) 2014-08-21 2019-07-23 Johnson & Johnson Vision Care, Inc. Anodes for use in biocompatible energization elements
US9793536B2 (en) 2014-08-21 2017-10-17 Johnson & Johnson Vision Care, Inc. Pellet form cathode for use in a biocompatible battery
US9383593B2 (en) 2014-08-21 2016-07-05 Johnson & Johnson Vision Care, Inc. Methods to form biocompatible energization elements for biomedical devices comprising laminates and placed separators
US10381687B2 (en) 2014-08-21 2019-08-13 Johnson & Johnson Vision Care, Inc. Methods of forming biocompatible rechargable energization elements for biomedical devices
US9941547B2 (en) 2014-08-21 2018-04-10 Johnson & Johnson Vision Care, Inc. Biomedical energization elements with polymer electrolytes and cavity structures
US20170288196A1 (en) * 2014-08-21 2017-10-05 Johnson & Johnson Vision Care, Inc. Biocompatible rechargable energization elements for biomedical devices with electroless sealing layers
US10361405B2 (en) 2014-08-21 2019-07-23 Johnson & Johnson Vision Care, Inc. Biomedical energization elements with polymer electrolytes
US9715130B2 (en) 2014-08-21 2017-07-25 Johnson & Johnson Vision Care, Inc. Methods and apparatus to form separators for biocompatible energization elements for biomedical devices
CA2900271A1 (en) * 2014-08-21 2016-02-21 Johnson & Johnson Vision Care, Inc. Components with multiple energization elements for biomedical devices
JP2017534311A (en) 2014-09-02 2017-11-24 ロッキード・マーチン・コーポレーション Hemodialysis membrane and blood filtration membrane based on two-dimensional membrane material, and method using the same
US20160073503A1 (en) * 2014-09-08 2016-03-10 Aliphcom Strap band including electrodes for wearable devices and formation thereof
WO2016057867A1 (en) * 2014-10-10 2016-04-14 Chen Xiaoxi Kevin Durable hydrophilic coating produced by multiple stage plasma polymerization
US9784994B2 (en) 2014-12-06 2017-10-10 Winthrop Childers Device interaction for correcting presbyopia
US10345619B2 (en) * 2015-03-19 2019-07-09 Johnson & Johnson Vision Care, Inc. Thinned and flexible circuit boards on three-dimensional surfaces
AU2016303048A1 (en) 2015-08-05 2018-03-01 Lockheed Martin Corporation Perforatable sheets of graphene-based material
MX2018001559A (en) 2015-08-06 2018-09-27 Lockheed Corp Nanoparticle modification and perforation of graphene.
US10345620B2 (en) 2016-02-18 2019-07-09 Johnson & Johnson Vision Care, Inc. Methods and apparatus to form biocompatible energization elements incorporating fuel cells for biomedical devices
CA3020686A1 (en) 2016-04-14 2017-10-19 Lockheed Martin Corporation Method for treating graphene sheets for large-scale transfer using free-float method
WO2017180133A1 (en) 2016-04-14 2017-10-19 Lockheed Martin Corporation Methods for in situ monitoring and control of defect formation or healing
KR20190018411A (en) 2016-04-14 2019-02-22 록히드 마틴 코포레이션 Selective interface relaxation of graphene defects
US10734668B2 (en) * 2016-09-12 2020-08-04 Johnson & Johnson Vision Care, Inc. Tubular form biomedical device batteries
US20180074345A1 (en) * 2016-09-12 2018-03-15 Johnson & Johnson Vision Care, Inc. Clam shell form biomedical device batteries
US20180076465A1 (en) * 2016-09-12 2018-03-15 Johnson & Johnson Vision Care, Inc. Tubular form biomedical device batteries with electroless sealing
RU2017131634A (en) * 2016-09-12 2019-03-12 Джонсон Энд Джонсон Вижн Кэа, Инк. BATTERIES FOR TUBULAR BIOMEDICAL DEVICES
JP6174232B1 (en) * 2016-11-25 2017-08-02 株式会社ユニバーサルビュー Pinhole contact lens and smart contact system
US10170449B2 (en) 2017-05-02 2019-01-01 International Business Machines Corporation Deformable closed-loop multi-layered microelectronic device
US10950912B2 (en) 2017-06-14 2021-03-16 Milwaukee Electric Tool Corporation Arrangements for inhibiting intrusion into battery pack electrical components
US11076946B2 (en) * 2017-11-16 2021-08-03 Verily Life Sciences Llc Flexible barrier layer including superelastic alloys
DE102018106304A1 (en) * 2018-03-19 2019-09-19 Dr. Ing. H.C. F. Porsche Aktiengesellschaft DC charging of a smart battery
US20210259609A1 (en) * 2020-02-20 2021-08-26 Teliatry, Inc. Implantable Nerve Transducer with Solid-State Battery
WO2023089574A1 (en) * 2021-11-19 2023-05-25 Kinneret Smart Waves Ltd. / Ksw Antennas A short antenna having a wide bandwidth

Family Cites Families (146)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3431327A (en) 1964-08-31 1969-03-04 George F Tsuetaki Method of making a bifocal contact lens with an embedded metal weight
US3291296A (en) 1964-10-26 1966-12-13 Lemkelde Russell Pipe nipple holder
US3375136A (en) * 1965-05-24 1968-03-26 Army Usa Laminated thin film flexible alkaline battery
US4268132A (en) 1979-09-24 1981-05-19 Neefe Charles W Oxygen generating contact lens
US4592944A (en) 1982-05-24 1986-06-03 International Business Machines Corporation Method for providing a top seal coating on a substrate containing an electrically conductive pattern and coated article
US4601545A (en) 1984-05-16 1986-07-22 Kern Seymour P Variable power lens system
US4787903A (en) 1985-07-24 1988-11-29 Grendahl Dennis T Intraocular lens
DE3727945A1 (en) 1986-08-22 1988-02-25 Ricoh Kk LIQUID CRYSTAL ELEMENT
US5219497A (en) 1987-10-30 1993-06-15 Innotech, Inc. Method for manufacturing lenses using thin coatings
US4816031A (en) 1988-01-29 1989-03-28 Pfoff David S Intraocular lens system
US5227805A (en) * 1989-10-26 1993-07-13 Motorola, Inc. Antenna loop/battery spring
US5112703A (en) 1990-07-03 1992-05-12 Beta Power, Inc. Electrochemical battery cell having a monolithic bipolar flat plate beta" al
US6322589B1 (en) 1995-10-06 2001-11-27 J. Stuart Cumming Intraocular lenses with fixated haptics
US5712721A (en) * 1993-04-07 1998-01-27 Technology Partnership, Plc Switchable lens
US5478420A (en) 1994-07-28 1995-12-26 International Business Machines Corporation Process for forming open-centered multilayer ceramic substrates
US5596567A (en) 1995-03-31 1997-01-21 Motorola, Inc. Wireless battery charging system
US5682210A (en) 1995-12-08 1997-10-28 Weirich; John Eye contact lens video display system
JPH09266636A (en) * 1996-03-28 1997-10-07 Nippon Zeon Co Ltd Battery device of driver for medical apparatus
JP3001481B2 (en) * 1997-10-27 2000-01-24 九州日本電気株式会社 Semiconductor device and manufacturing method thereof
RU2154444C2 (en) * 1997-12-05 2000-08-20 Государственное научно-техническое предприятие "Эфкон" Method for manufacture of artificial eye lens
US6217171B1 (en) 1998-05-26 2001-04-17 Novartis Ag Composite ophthamic lens
US20070285385A1 (en) 1998-11-02 2007-12-13 E Ink Corporation Broadcast system for electronic ink signs
DE19858172A1 (en) 1998-12-16 2000-06-21 Campus Micro Technologies Gmbh Artificial lens implant for measuring eye internal pressure has telemetric endosystem for continuous pressure monitoring incorporated in peripheral rim of artificial lens
US6477410B1 (en) 2000-05-31 2002-11-05 Biophoretic Therapeutic Systems, Llc Electrokinetic delivery of medicaments
US6986579B2 (en) 1999-07-02 2006-01-17 E-Vision, Llc Method of manufacturing an electro-active lens
US6619799B1 (en) 1999-07-02 2003-09-16 E-Vision, Llc Optical lens system with electro-active lens having alterably different focal lengths
US6851805B2 (en) 1999-07-02 2005-02-08 E-Vision, Llc Stabilized electro-active contact lens
US7404636B2 (en) 1999-07-02 2008-07-29 E-Vision, Llc Electro-active spectacle employing modal liquid crystal lenses
JP2001045648A (en) * 1999-08-02 2001-02-16 Yazaki Corp Circuit breaker
US6364482B1 (en) 1999-11-03 2002-04-02 Johnson & Johnson Vision Care, Inc. Contact lens useful for avoiding dry eye
JP4172566B2 (en) * 2000-09-21 2008-10-29 Ｔｄｋ株式会社 Surface electrode structure of ceramic multilayer substrate and method of manufacturing surface electrode
US6748994B2 (en) 2001-04-11 2004-06-15 Avery Dennison Corporation Label applicator, method and label therefor
US6769767B2 (en) * 2001-04-30 2004-08-03 Qr Spex, Inc. Eyewear with exchangeable temples housing a transceiver forming ad hoc networks with other devices
US6638304B2 (en) 2001-07-20 2003-10-28 Massachusetts Eye & Ear Infirmary Vision prosthesis
US6885818B2 (en) 2001-07-30 2005-04-26 Hewlett-Packard Development Company, L.P. System and method for controlling electronic devices
EP1304193A3 (en) 2001-10-10 2004-12-01 imt robot AG Method for automatically putting objects on a carrier
EP1316419A3 (en) 2001-11-30 2004-01-28 General Electric Company Weatherable multilayer articles and method for their preparation
US7763069B2 (en) 2002-01-14 2010-07-27 Abbott Medical Optics Inc. Accommodating intraocular lens with outer support structure
KR100878519B1 (en) * 2002-01-19 2009-01-13 삼성전자주식회사 Manufacturing method for optical disk
ITMI20020403A1 (en) 2002-02-28 2003-08-28 Ausimont Spa PTFE BASED WATER DISPERSIONS
EP1849589A3 (en) 2002-03-04 2009-03-25 Johnson and Johnson Vision Care, Inc. Use of microwave energy to dissassemble, release, and hydrate contact lenses
US20030164563A1 (en) 2002-03-04 2003-09-04 Olin Calvin Use of microwave energy to disassemble, release, and hydrate contact lenses
CA2482695A1 (en) 2002-04-25 2003-11-06 E-Vision, Llc Electro-active multi-focal spectacle lens
US6852254B2 (en) 2002-06-26 2005-02-08 Johnson & Johnson Vision Care, Inc. Methods for the production of tinted contact lenses
US7062708B2 (en) 2002-09-19 2006-06-13 International Business Machines Corporation Tree construction for XML to XML document transformation
US6906436B2 (en) 2003-01-02 2005-06-14 Cymbet Corporation Solid state activity-activated battery device and method
AU2003300153A1 (en) * 2003-01-02 2004-07-29 Cymbet Corporation Solid-state battery-powered devices and manufacturing methods
JP3981034B2 (en) 2003-03-25 2007-09-26 富士フイルム株式会社 Color image acquisition device and color electronic camera
US7195353B2 (en) 2003-08-15 2007-03-27 E-Vision, Llc Enhanced electro-active lens system
US7581124B1 (en) 2003-09-19 2009-08-25 Xilinx, Inc. Method and mechanism for controlling power consumption of an integrated circuit
US7289260B2 (en) * 2003-10-03 2007-10-30 Invisia Ltd. Multifocal lens
EP1760515A3 (en) 2003-10-03 2011-08-31 Invisia Ltd. Multifocal ophthalmic lens
EP1728117A1 (en) 2004-03-05 2006-12-06 Koninklijke Philips Electronics N.V. Variable focus lens
BRPI0509809A (en) * 2004-04-13 2007-09-18 Univ Arizona standardized electrodes for liquid crystal electroactive ophthalmic devices
CA2467321A1 (en) 2004-05-14 2005-11-14 Paul J. Santerre Polymeric coupling agents and pharmaceutically-active polymers made therefrom
US8766435B2 (en) 2004-06-30 2014-07-01 Stmicroelectronics, Inc. Integrated circuit package including embedded thin-film battery
EP1622009A1 (en) 2004-07-27 2006-02-01 Texas Instruments Incorporated JSM architecture and systems
EP2661121A3 (en) 2004-09-21 2014-06-04 Hitachi Ltd. Node device, packet control device, radio communication device, and transmission control method
EP1807728A4 (en) * 2004-11-02 2009-07-29 E Vision Llc Electro-active spectacles and method of fabricating same
SG157359A1 (en) 2004-11-02 2009-12-29 E Vision Llc Electro-active intraocular lenses
US8778022B2 (en) 2004-11-02 2014-07-15 E-Vision Smart Optics Inc. Electro-active intraocular lenses
CN101094626A (en) * 2004-11-02 2007-12-26 E-视觉有限公司 Electro-active intraocular lenses
JP2008518706A (en) 2004-11-04 2008-06-05 エル・アンド・ピー・１００・リミテッド Medical device
US8368096B2 (en) 2005-01-04 2013-02-05 Aac Technologies Japan R&D Center Co., Ltd. Solid state image pick-up device and method for manufacturing the same with increased structural integrity
DE102005001148B3 (en) * 2005-01-10 2006-05-18 Siemens Ag Electronic unit, has metal housing coupled to MOSFET operated with high frequency, where housing is arranged to metal plate over electrically-isolated isolation layer, and heat sink electrically connected with metal plate or housing
KR101425654B1 (en) * 2005-01-20 2014-07-31 오티콘 에이/에스 Hearing aid with rechargeable battery and rechargeable battery
US7928591B2 (en) 2005-02-11 2011-04-19 Wintec Industries, Inc. Apparatus and method for predetermined component placement to a target platform
US7364945B2 (en) * 2005-03-31 2008-04-29 Stats Chippac Ltd. Method of mounting an integrated circuit package in an encapsulant cavity
JP4790297B2 (en) * 2005-04-06 2011-10-12 ルネサスエレクトロニクス株式会社 Semiconductor device and manufacturing method thereof
US7976577B2 (en) 2005-04-14 2011-07-12 Acufocus, Inc. Corneal optic formed of degradation resistant polymer
US7548040B2 (en) 2005-07-28 2009-06-16 Zerog Wireless, Inc. Wireless battery charging of electronic devices such as wireless headsets/headphones
US7835160B2 (en) * 2005-09-28 2010-11-16 Panasonic Corporation Electronic circuit connection structure and its manufacturing method
US20070090869A1 (en) * 2005-10-26 2007-04-26 Motorola, Inc. Combined power source and printed transistor circuit apparatus and method
US20070128420A1 (en) 2005-12-07 2007-06-07 Mariam Maghribi Hybrid composite for biological tissue interface devices
NZ569756A (en) 2005-12-12 2011-07-29 Allaccem Inc Methods and systems for preparing antimicrobial films and coatings utilising polycyclic bridged ammonium salts
JPWO2007072781A1 (en) * 2005-12-20 2009-05-28 日本電気株式会社 Power storage device
US20070159562A1 (en) 2006-01-10 2007-07-12 Haddock Joshua N Device and method for manufacturing an electro-active spectacle lens involving a mechanically flexible integration insert
JP2007187454A (en) * 2006-01-11 2007-07-26 Toyota Motor Corp Insulation resistance drop detector
WO2007097784A1 (en) 2006-02-21 2007-08-30 Borgwarner Inc. Segmented core plate and friction plate
US7794643B2 (en) 2006-03-24 2010-09-14 Ricoh Company, Ltd. Apparatus and method for molding object with enhanced transferability of transfer face and object made by the same
CN100456274C (en) * 2006-03-29 2009-01-28 深圳迈瑞生物医疗电子股份有限公司 Multi-CPU system of easy expansion
JP4171922B2 (en) 2006-04-12 2008-10-29 船井電機株式会社 Mute device, liquid crystal display TV, and mute method
JP4918373B2 (en) * 2006-04-28 2012-04-18 オリンパス株式会社 Stacked mounting structure
JP4923704B2 (en) 2006-04-28 2012-04-25 ソニー株式会社 Optical element molding apparatus and molding method
US8197539B2 (en) 2006-05-05 2012-06-12 University Of Southern California Intraocular camera for retinal prostheses
BRPI0713005A2 (en) 2006-06-12 2012-04-17 Johnson & Johnson Vision Care method for reducing power consumption with electro-optical lenses
JP2008033021A (en) 2006-07-28 2008-02-14 Fuji Xerox Co Ltd Hologram recording method and hologram recording device
WO2008025061A1 (en) 2006-08-28 2008-03-06 Frankie James Lagudi Online hosted customisable merchant directory with search function
CN101548224A (en) 2006-09-01 2009-09-30 庄臣及庄臣视力保护公司 Electro-optic lenses employing resistive electrodes
US7324287B1 (en) * 2006-11-07 2008-01-29 Corning Incorporated Multi-fluid lenses and optical devices incorporating the same
TWI324380B (en) * 2006-12-06 2010-05-01 Princo Corp Hybrid structure of multi-layer substrates and manufacture method thereof
JP2008178226A (en) * 2007-01-18 2008-07-31 Fujitsu Ltd Power supply device and method of supplying power voltage to load device
AR064985A1 (en) 2007-01-22 2009-05-06 E Vision Llc FLEXIBLE ELECTROACTIVE LENS
WO2008103906A2 (en) 2007-02-23 2008-08-28 Pixeloptics, Inc. Ophthalmic dynamic aperture
US7926940B2 (en) 2007-02-23 2011-04-19 Pixeloptics, Inc. Advanced electro-active optic device
US20090091818A1 (en) 2007-10-05 2009-04-09 Haddock Joshua N Electro-active insert
US8446341B2 (en) 2007-03-07 2013-05-21 University Of Washington Contact lens with integrated light-emitting component
WO2008109867A2 (en) 2007-03-07 2008-09-12 University Of Washington Active contact lens
AU2008226634A1 (en) 2007-03-12 2008-09-18 Pixeloptics, Inc. Electrical insulating layers, UV protection, and voltage spiking for electro-active diffractive optics
TWI335652B (en) * 2007-04-04 2011-01-01 Unimicron Technology Corp Stacked packing module
TW200842996A (en) * 2007-04-17 2008-11-01 Advanced Semiconductor Eng Method for forming bumps on under bump metallurgy
US7818698B2 (en) 2007-06-29 2010-10-19 Taiwan Semiconductor Manufacturing Company, Ltd. Accurate parasitic capacitance extraction for ultra large scale integrated circuits
US8317321B2 (en) 2007-07-03 2012-11-27 Pixeloptics, Inc. Multifocal lens with a diffractive optical power region
WO2009020648A1 (en) * 2007-08-09 2009-02-12 The Regents Of The University Of California Electroactive polymer actuation of implants
DE102007048859A1 (en) 2007-10-11 2009-04-16 Robert Bosch Gmbh Intraocular lens for being implanted in eyes of e.g. human, has lens body formed as form-changeable hollow body fillable with fluid, and micro pump provided for variation of fluid volume in lens body
US8608310B2 (en) 2007-11-07 2013-12-17 University Of Washington Through Its Center For Commercialization Wireless powered contact lens with biosensor
US20090175016A1 (en) * 2008-01-04 2009-07-09 Qimonda Ag Clip for attaching panels
US7844341B2 (en) 2008-01-15 2010-11-30 Cardiac Pacemakers, Inc. Implantable medical device with antenna
TWI511869B (en) 2008-02-20 2015-12-11 Johnson & Johnson Vision Care Energized biomedical device
EP2099165A1 (en) 2008-03-03 2009-09-09 Thomson Licensing Deterministic back-off method and apparatus for peer-to-peer communications
JP2011513380A (en) 2008-03-04 2011-04-28 ナトコ ファーマ リミテッド Crystal form of phenylaminopyrimidine derivatives
US20090243125A1 (en) * 2008-03-26 2009-10-01 Pugh Randall B Methods and apparatus for ink jet provided energy receptor
US7931832B2 (en) * 2008-03-31 2011-04-26 Johnson & Johnson Vision Care, Inc. Ophthalmic lens media insert
US8523354B2 (en) * 2008-04-11 2013-09-03 Pixeloptics Inc. Electro-active diffractive lens and method for making the same
FR2934056B1 (en) 2008-07-21 2011-01-07 Essilor Int METHOD FOR TRANSFERRING A FUNCTIONAL FILM PORTION
US8014166B2 (en) * 2008-09-06 2011-09-06 Broadpak Corporation Stacking integrated circuits containing serializer and deserializer blocks using through silicon via
US20100076553A1 (en) * 2008-09-22 2010-03-25 Pugh Randall B Energized ophthalmic lens
US9296158B2 (en) * 2008-09-22 2016-03-29 Johnson & Johnson Vision Care, Inc. Binder of energized components in an ophthalmic lens
JP4764942B2 (en) 2008-09-25 2011-09-07 シャープ株式会社 Optical element, optical element wafer, optical element wafer module, optical element module, optical element module manufacturing method, electronic element wafer module, electronic element module manufacturing method, electronic element module, and electronic information device
US9427920B2 (en) 2008-09-30 2016-08-30 Johnson & Johnson Vision Care, Inc. Energized media for an ophthalmic device
US8348424B2 (en) * 2008-09-30 2013-01-08 Johnson & Johnson Vision Care, Inc. Variable focus ophthalmic device
US8092013B2 (en) 2008-10-28 2012-01-10 Johnson & Johnson Vision Care, Inc. Apparatus and method for activation of components of an energized ophthalmic lens
US9375885B2 (en) 2008-10-31 2016-06-28 Johnson & Johnson Vision Care, Inc. Processor controlled ophthalmic device
US9375886B2 (en) * 2008-10-31 2016-06-28 Johnson & Johnson Vision Care Inc. Ophthalmic device with embedded microcontroller
US20110230963A1 (en) * 2008-11-20 2011-09-22 Insight Innovations, Llc Biocompatible biodegradable intraocular implant system
US8636358B2 (en) * 2009-05-17 2014-01-28 Helmut Binder Lens with variable refraction power for the human eye
EP2254149B1 (en) 2009-05-22 2014-08-06 Unisantis Electronics Singapore Pte. Ltd. SRAM using vertical transistors with a diffusion layer for reducing leakage currents
EP2306579A1 (en) * 2009-09-28 2011-04-06 STMicroelectronics (Tours) SAS Process for the fabrication of a lithium-ion battery in thin layers
US8784511B2 (en) * 2009-09-28 2014-07-22 Stmicroelectronics (Tours) Sas Method for forming a thin-film lithium-ion battery
US8137148B2 (en) * 2009-09-30 2012-03-20 General Electric Company Method of manufacturing monolithic parallel interconnect structure
US8837097B2 (en) * 2010-06-07 2014-09-16 Eaton Corporation Protection, monitoring or indication apparatus for a direct current electrical generating apparatus or a plurality of strings
WO2011163080A1 (en) 2010-06-20 2011-12-29 Elenza, Inc. Ophthalmic devices and methods with application specific integrated circuits
US8634145B2 (en) 2010-07-29 2014-01-21 Johnson & Johnson Vision Care, Inc. Liquid meniscus lens with concave torus-segment meniscus wall
KR101322695B1 (en) 2010-08-25 2013-10-25 주식회사 엘지화학 Cable-Type Secondary Battery
JP2013541360A (en) 2010-09-07 2013-11-14 エレンザ， インコーポレイテッド Installation and sealing of a battery on a thin glass wafer to power the intraocular implant
US8767309B2 (en) 2010-09-08 2014-07-01 Johnson & Johnson Vision Care, Inc. Lens with multi-convex meniscus wall
JP2014504171A (en) 2010-11-15 2014-02-20 エレンザ， インコーポレイテッド Compatible intraocular lens
US8950862B2 (en) 2011-02-28 2015-02-10 Johnson & Johnson Vision Care, Inc. Methods and apparatus for an ophthalmic lens with functional insert layers
US9698129B2 (en) * 2011-03-18 2017-07-04 Johnson & Johnson Vision Care, Inc. Stacked integrated component devices with energization
US9889615B2 (en) 2011-03-18 2018-02-13 Johnson & Johnson Vision Care, Inc. Stacked integrated component media insert for an ophthalmic device
US9110310B2 (en) * 2011-03-18 2015-08-18 Johnson & Johnson Vision Care, Inc. Multiple energization elements in stacked integrated component devices
US10451897B2 (en) * 2011-03-18 2019-10-22 Johnson & Johnson Vision Care, Inc. Components with multiple energization elements for biomedical devices
US9804418B2 (en) * 2011-03-21 2017-10-31 Johnson & Johnson Vision Care, Inc. Methods and apparatus for functional insert with power layer
US9900351B2 (en) 2011-07-20 2018-02-20 Genband Us Llc Methods, systems, and computer readable media for providing legacy devices access to a session initiation protocol (SIP) based network
WO2013112748A1 (en) 2012-01-26 2013-08-01 Johnson & Johnson Vision Care, Inc. Energized ophthalmic lens including stacked integrated components
US8857983B2 (en) 2012-01-26 2014-10-14 Johnson & Johnson Vision Care, Inc. Ophthalmic lens assembly having an integrated antenna structure

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