SG11201403527UA - Method for treating inner surface of chlorine trifluoride supply passage in apparatus using chlorine trifluoride - Google Patents
Method for treating inner surface of chlorine trifluoride supply passage in apparatus using chlorine trifluorideInfo
- Publication number
- SG11201403527UA SG11201403527UA SG11201403527UA SG11201403527UA SG11201403527UA SG 11201403527U A SG11201403527U A SG 11201403527UA SG 11201403527U A SG11201403527U A SG 11201403527UA SG 11201403527U A SG11201403527U A SG 11201403527UA SG 11201403527U A SG11201403527U A SG 11201403527UA
- Authority
- SG
- Singapore
- Prior art keywords
- chlorine trifluoride
- supply passage
- treating inner
- chlorine
- treating
- Prior art date
Links
- JOHWNGGYGAVMGU-UHFFFAOYSA-N trifluorochlorine Chemical compound FCl(F)F JOHWNGGYGAVMGU-UHFFFAOYSA-N 0.000 title 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4404—Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45561—Gas plumbing upstream of the reaction chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2012/052862 WO2013118260A1 (en) | 2012-02-08 | 2012-02-08 | Method for treating inner surface of chlorine trifluoride supply path in device using chlorine trifluoride |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201403527UA true SG11201403527UA (en) | 2014-09-26 |
Family
ID=48947064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201403527UA SG11201403527UA (en) | 2012-02-08 | 2012-02-08 | Method for treating inner surface of chlorine trifluoride supply passage in apparatus using chlorine trifluoride |
Country Status (5)
Country | Link |
---|---|
US (1) | US9416445B2 (en) |
KR (1) | KR20140123930A (en) |
CN (1) | CN104040699B (en) |
SG (1) | SG11201403527UA (en) |
WO (1) | WO2013118260A1 (en) |
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Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5380370A (en) * | 1993-04-30 | 1995-01-10 | Tokyo Electron Limited | Method of cleaning reaction tube |
US5609721A (en) * | 1994-03-11 | 1997-03-11 | Fujitsu Limited | Semiconductor device manufacturing apparatus and its cleaning method |
US6290779B1 (en) * | 1998-06-12 | 2001-09-18 | Tokyo Electron Limited | Systems and methods for dry cleaning process chambers |
JP4368443B2 (en) * | 1999-01-29 | 2009-11-18 | 日鉱金属株式会社 | Vapor growth method |
US6929784B1 (en) * | 1999-03-04 | 2005-08-16 | Surface Technology Systems Plc | Chlorotrifuorine gas generator system |
KR20030008228A (en) | 2001-07-16 | 2003-01-25 | 삼성전자 주식회사 | Apparatus for dry etching using plasma |
US20050118085A1 (en) * | 2003-11-12 | 2005-06-02 | Satchell Donald P.Jr. | Chamber cleaning or etching gas regeneration and recycle method |
DE102005031602A1 (en) * | 2005-07-06 | 2007-01-11 | Robert Bosch Gmbh | A reactor for carrying out an etching process for a stack of masked wafers and etching processes |
JP5317321B2 (en) * | 2008-02-21 | 2013-10-16 | 岩谷産業株式会社 | Metal material, storage container using the same, gas piping, apparatus, manufacturing method thereof, and ClF3 storage method |
-
2012
- 2012-02-08 KR KR1020147017775A patent/KR20140123930A/en active Search and Examination
- 2012-02-08 US US14/374,728 patent/US9416445B2/en active Active
- 2012-02-08 CN CN201280066775.8A patent/CN104040699B/en active Active
- 2012-02-08 WO PCT/JP2012/052862 patent/WO2013118260A1/en active Application Filing
- 2012-02-08 SG SG11201403527UA patent/SG11201403527UA/en unknown
Also Published As
Publication number | Publication date |
---|---|
US9416445B2 (en) | 2016-08-16 |
US20150041430A1 (en) | 2015-02-12 |
CN104040699B (en) | 2018-06-26 |
CN104040699A (en) | 2014-09-10 |
KR20140123930A (en) | 2014-10-23 |
WO2013118260A1 (en) | 2013-08-15 |
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