SG11201401641WA - Amine/epoxy curing of benzoxazines - Google Patents
Amine/epoxy curing of benzoxazinesInfo
- Publication number
- SG11201401641WA SG11201401641WA SG11201401641WA SG11201401641WA SG11201401641WA SG 11201401641W A SG11201401641W A SG 11201401641WA SG 11201401641W A SG11201401641W A SG 11201401641WA SG 11201401641W A SG11201401641W A SG 11201401641WA SG 11201401641W A SG11201401641W A SG 11201401641WA
- Authority
- SG
- Singapore
- Prior art keywords
- benzoxazines
- amine
- epoxy curing
- curing
- epoxy
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/02—Polyamines
- C08G73/0233—Polyamines derived from (poly)oxazolines, (poly)oxazines or having pendant acyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/02—Polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161552494P | 2011-10-28 | 2011-10-28 | |
PCT/US2012/061865 WO2013063236A1 (en) | 2011-10-28 | 2012-10-25 | Amine/epoxy curing of benzoxazines |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201401641WA true SG11201401641WA (en) | 2014-05-29 |
Family
ID=47178335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201401641WA SG11201401641WA (en) | 2011-10-28 | 2012-10-25 | Amine/epoxy curing of benzoxazines |
Country Status (8)
Country | Link |
---|---|
US (1) | US9695273B2 (en) |
EP (1) | EP2771402B1 (en) |
JP (1) | JP2015502416A (en) |
KR (1) | KR101951266B1 (en) |
CN (1) | CN104024331B (en) |
IN (1) | IN2014CN03129A (en) |
SG (1) | SG11201401641WA (en) |
WO (1) | WO2013063236A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2691457B1 (en) * | 2011-03-28 | 2014-11-19 | 3M Innovative Properties Company | Curable composition, article, method of curing, and tack-free reaction product |
US10301471B2 (en) * | 2014-06-13 | 2019-05-28 | Dic Corporation | Curable resin composition, cured product thereof, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, build-up film, build-up substrate, fiber-reinforced composite material, and fiber-reinforced resin molded product |
EP3233811B1 (en) | 2014-12-18 | 2020-09-09 | 3M Innovative Properties Company | Curable benzoxazine compositions with improved thermal stability |
US20160297994A1 (en) * | 2015-04-10 | 2016-10-13 | Eastman Chemical Company | Curable benzoxazine-based phenolic resins and coating compositions thereof |
US10882955B2 (en) | 2015-06-09 | 2021-01-05 | 3M Innovative Properties Company | Ammonium salt catalyzed benzoxazine polymerization |
EP3498750A1 (en) | 2017-12-15 | 2019-06-19 | HILTI Aktiengesellschaft | Curing components for multi-component epoxy resin mass and multi-component epoxy resin mass |
WO2019186269A1 (en) * | 2018-03-30 | 2019-10-03 | Toray Industries, Inc. | Benzoxazine resin composition, prepreg, and fiber-reinforced composite material |
JP7142771B2 (en) * | 2018-09-19 | 2022-09-27 | ヒルティ アクチエンゲゼルシャフト | Hardener compositions for epoxy resin compounds, epoxy resin compounds, and multi-component epoxy resin systems |
WO2021209825A1 (en) * | 2020-04-15 | 2021-10-21 | Kaneka Corporation | Synthesis, purification, and properties of ring-opened benzoxazine thermoplastic |
WO2022069947A1 (en) * | 2020-09-29 | 2022-04-07 | Kaneka Corporation | Synthesis of self-healing benzoxazine polymers through melt polymerization |
CN115232583A (en) * | 2022-09-23 | 2022-10-25 | 武汉市三选科技有限公司 | High-storage-property underfill adhesive, preparation method thereof and chip packaging structure |
Family Cites Families (44)
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US3018262A (en) | 1957-05-01 | 1962-01-23 | Shell Oil Co | Curing polyepoxides with certain metal salts of inorganic acids |
US3298998A (en) | 1961-03-07 | 1967-01-17 | Eastman Kodak Co | Bisglycidyl ethers of bisphenols |
US3496250A (en) | 1967-02-21 | 1970-02-17 | Borg Warner | Blends of epoxy resins and acrylonitrile butadiene-styrene graft copolymers |
US3890272A (en) | 1973-05-25 | 1975-06-17 | Univ Notre Dame Du Lac | Polymerizing bis-maleimides |
US4501864A (en) | 1983-12-22 | 1985-02-26 | Monsanto Company | Polymerizable compositions comprising polyamines and poly(dihydrobenzoxazines) |
US4503211A (en) | 1984-05-31 | 1985-03-05 | Minnesota Mining And Manufacturing Co. | Epoxy resin curing agent, process and composition |
US4719253A (en) | 1986-08-01 | 1988-01-12 | The Glidden Company | Self-curable benzoxazine functional cathodic electrocoat resins and process |
US5543516A (en) | 1994-05-18 | 1996-08-06 | Edison Polymer Innovation Corporation | Process for preparation of benzoxazine compounds in solventless systems |
US20020006484A1 (en) | 1998-05-20 | 2002-01-17 | Balasubramaniam Ramalingam | Adhesive and coating formulations for flexible packaging |
JP3965786B2 (en) * | 1998-06-25 | 2007-08-29 | 日立化成工業株式会社 | Thermosetting resin composition, prepreg, and laminate for printed wiring board |
US6207586B1 (en) | 1998-10-28 | 2001-03-27 | Lucent Technologies Inc. | Oxide/nitride stacked gate dielectric and associated methods |
AU1518800A (en) * | 1998-11-03 | 2000-05-22 | Lubrizol Corporation, The | Lubricants having overbased metal salts and organic phosphites |
US6207786B1 (en) | 1998-11-10 | 2001-03-27 | Edison Polymer Innovation Corporation | Ternary systems of benzoxazine, epoxy, and phenolic resins |
US6376080B1 (en) | 1999-06-07 | 2002-04-23 | Loctite Corporation | Method for preparing polybenzoxazine |
JP2001288339A (en) * | 2000-02-03 | 2001-10-16 | Nec Corp | Method for flame retarding epoxy resin composition and flame retardant epoxy resin composition |
US6437026B1 (en) | 2001-01-05 | 2002-08-20 | Cookson Singapore Pte Ltd. | Hardener for epoxy molding compounds |
KR100809579B1 (en) | 2001-01-22 | 2008-03-04 | 훈츠만 어드밴스트 머티리얼스(스위처랜드)게엠베하 | Flame-proofing agents |
MY138485A (en) | 2001-03-12 | 2009-06-30 | Hitachi Chemical Co Ltd | Process for producing benzoxazine resin |
CA2379505A1 (en) * | 2001-04-02 | 2002-10-02 | Hidenori Tanaka | Coating composition containing benzoxazine compound |
JP2003147165A (en) * | 2001-08-29 | 2003-05-21 | Osaka City | Thermosetting resin composition |
US6743852B2 (en) | 2001-11-13 | 2004-06-01 | Henkel Corporation | Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof |
CA2474694A1 (en) * | 2002-02-06 | 2003-08-14 | Sekisui Chemical Co., Ltd. | Resin composition_and products containing the same |
US7157545B2 (en) * | 2002-08-27 | 2007-01-02 | Acushnet Company | Compositions for golf equipment |
WO2004037878A2 (en) * | 2002-10-22 | 2004-05-06 | Henkel Corporation | Co-curable compositions |
US6894133B2 (en) * | 2002-12-11 | 2005-05-17 | 3M Innovative Properties Company | Azlactone initiators for atom transfer radical polymerization |
US20060102871A1 (en) * | 2003-04-08 | 2006-05-18 | Xingwu Wang | Novel composition |
US20050216075A1 (en) * | 2003-04-08 | 2005-09-29 | Xingwu Wang | Materials and devices of enhanced electromagnetic transparency |
US7157509B2 (en) * | 2003-06-27 | 2007-01-02 | Henkel Corporation | Curable compositions |
JP4112586B2 (en) * | 2003-12-08 | 2008-07-02 | 積水化学工業株式会社 | Thermosetting resin composition, resin sheet and resin sheet for insulating substrate |
US20070191555A1 (en) * | 2004-03-30 | 2007-08-16 | Hatsuo Ishida | Thermosetting resin composition and its article |
US20060134901A1 (en) * | 2004-12-22 | 2006-06-22 | National Starch And Chemical Investment Holding Corporation | Hot-Melt Underfill Composition and Methos of Application |
US7759435B2 (en) * | 2006-09-26 | 2010-07-20 | Loctite (R&D) Limited | Adducts and curable compositions using same |
US20100007018A1 (en) * | 2006-12-08 | 2010-01-14 | Derek Wyatt | Process for coating a bumped semiconductor wafer |
JP4976957B2 (en) * | 2007-08-20 | 2012-07-18 | 積水化学工業株式会社 | Thermosetting resin composition and method for producing the same |
US7847034B2 (en) * | 2008-03-20 | 2010-12-07 | Loctite (R&D) Limited | Adducts and curable compositions using same |
JP2009227884A (en) * | 2008-03-25 | 2009-10-08 | Showa Highpolymer Co Ltd | Thermosetting resin composition, and cured product and laminated sheet using the same |
CN102439088A (en) * | 2009-02-12 | 2012-05-02 | 吉坤日矿日石能源株式会社 | Benzoxazine resin composition |
US7842401B2 (en) * | 2009-03-24 | 2010-11-30 | Iteq Corporation | Halogen-free varnish and prepreg thereof |
JP5627196B2 (en) * | 2009-04-28 | 2014-11-19 | 国立大学法人横浜国立大学 | Epoxy resin composition and cured product thereof |
US8383706B2 (en) | 2009-06-05 | 2013-02-26 | 3M Innovative Properties Company | Benzoxazine-thiol adducts |
CN103154089B (en) | 2010-08-04 | 2015-11-25 | 3M创新有限公司 | Prepare the method for benzoxazine-polymer, thiol film |
EP2691457B1 (en) | 2011-03-28 | 2014-11-19 | 3M Innovative Properties Company | Curable composition, article, method of curing, and tack-free reaction product |
EP2691466B1 (en) | 2011-03-28 | 2017-12-27 | 3M Innovative Properties Company | Curable composition, article, method of curing, and reaction product |
JP2014528025A (en) | 2011-09-28 | 2014-10-23 | スリーエム イノベイティブ プロパティズ カンパニー | Amine / thiol cure of benzoxazine |
-
2012
- 2012-10-25 JP JP2014538996A patent/JP2015502416A/en active Pending
- 2012-10-25 KR KR1020147013932A patent/KR101951266B1/en active IP Right Grant
- 2012-10-25 SG SG11201401641WA patent/SG11201401641WA/en unknown
- 2012-10-25 WO PCT/US2012/061865 patent/WO2013063236A1/en active Application Filing
- 2012-10-25 EP EP12784828.1A patent/EP2771402B1/en not_active Not-in-force
- 2012-10-25 US US14/345,258 patent/US9695273B2/en active Active
- 2012-10-25 IN IN3129CHN2014 patent/IN2014CN03129A/en unknown
- 2012-10-25 CN CN201280051619.4A patent/CN104024331B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN104024331A (en) | 2014-09-03 |
KR101951266B1 (en) | 2019-02-22 |
US20150045528A1 (en) | 2015-02-12 |
US9695273B2 (en) | 2017-07-04 |
KR20140084268A (en) | 2014-07-04 |
IN2014CN03129A (en) | 2015-07-03 |
JP2015502416A (en) | 2015-01-22 |
WO2013063236A1 (en) | 2013-05-02 |
EP2771402A1 (en) | 2014-09-03 |
CN104024331B (en) | 2016-10-19 |
EP2771402B1 (en) | 2018-06-27 |
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