SG109436A1 - Leaded mcm package and method therefor - Google Patents
Leaded mcm package and method thereforInfo
- Publication number
- SG109436A1 SG109436A1 SG200007216A SG200007216A SG109436A1 SG 109436 A1 SG109436 A1 SG 109436A1 SG 200007216 A SG200007216 A SG 200007216A SG 200007216 A SG200007216 A SG 200007216A SG 109436 A1 SG109436 A1 SG 109436A1
- Authority
- SG
- Singapore
- Prior art keywords
- leaded
- method therefor
- mcm package
- mcm
- package
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200007216A SG109436A1 (en) | 2000-12-07 | 2000-12-07 | Leaded mcm package and method therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200007216A SG109436A1 (en) | 2000-12-07 | 2000-12-07 | Leaded mcm package and method therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
SG109436A1 true SG109436A1 (en) | 2005-03-30 |
Family
ID=34588228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200007216A SG109436A1 (en) | 2000-12-07 | 2000-12-07 | Leaded mcm package and method therefor |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG109436A1 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4984065A (en) * | 1989-01-11 | 1991-01-08 | Kabushiki Kaisha Toshiba | Hybrid resin-sealed semiconductor device |
US5049977A (en) * | 1989-07-18 | 1991-09-17 | Kabushiki Kaisha Toshiba | Plastic molded type semiconductor device |
US5349233A (en) * | 1992-04-20 | 1994-09-20 | Kabushiki Kaisha Toshiba | Lead frame and semiconductor module using the same having first and second islands and three distinct pluralities of leads and semiconductor module using the lead frame |
-
2000
- 2000-12-07 SG SG200007216A patent/SG109436A1/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4984065A (en) * | 1989-01-11 | 1991-01-08 | Kabushiki Kaisha Toshiba | Hybrid resin-sealed semiconductor device |
US5049977A (en) * | 1989-07-18 | 1991-09-17 | Kabushiki Kaisha Toshiba | Plastic molded type semiconductor device |
US5349233A (en) * | 1992-04-20 | 1994-09-20 | Kabushiki Kaisha Toshiba | Lead frame and semiconductor module using the same having first and second islands and three distinct pluralities of leads and semiconductor module using the lead frame |
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