SG103594G - Forming press for semiconductor package leads - Google Patents

Forming press for semiconductor package leads

Info

Publication number: SG103594G
Authority: SG; Singapore
Prior art keywords: semiconductor package; forming press; package leads; leads; press
Prior art date: 1990-01-25

Application number

SG103594A

Inventor

Akira Matsumoto

Original Assignee

Ykc Kk

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1990-01-25

Filing date

1994-07-26

Publication date

1994-10-28

1990-01-25 Priority claimed from JP2013519A external-priority patent/JPH0787232B2/en

1994-07-26 Application filed by Ykc Kk filed Critical Ykc Kk

1994-07-26 Priority to SG103594A priority Critical patent/SG103594G/en

1994-10-28 Publication of SG103594G publication Critical patent/SG103594G/en

Links

SG103594A 1990-01-25 1994-07-26 Forming press for semiconductor package leads SG103594G (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
SG103594A SG103594G (en)	1990-01-25	1994-07-26	Forming press for semiconductor package leads

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2013519A JPH0787232B2 (en)	1990-01-25	1990-01-25	Press machine
SG103594A SG103594G (en)	1990-01-25	1994-07-26	Forming press for semiconductor package leads

Publications (1)

Publication Number	Publication Date
SG103594G true SG103594G (en)	1994-10-28

Family

ID=26349333

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SG103594A SG103594G (en)	1990-01-25	1994-07-26	Forming press for semiconductor package leads

Country Status (1)

Country	Link
SG (1)	SG103594G (en)

1994
- 1994-07-26 SG SG103594A patent/SG103594G/en unknown

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