SG10202105066VA - Film thickness measurement apparatus, polishing apparatus, and film thickness measurement method - Google Patents
Film thickness measurement apparatus, polishing apparatus, and film thickness measurement methodInfo
- Publication number
- SG10202105066VA SG10202105066VA SG10202105066VA SG10202105066VA SG10202105066VA SG 10202105066V A SG10202105066V A SG 10202105066VA SG 10202105066V A SG10202105066V A SG 10202105066VA SG 10202105066V A SG10202105066V A SG 10202105066VA SG 10202105066V A SG10202105066V A SG 10202105066VA
- Authority
- SG
- Singapore
- Prior art keywords
- film thickness
- thickness measurement
- measurement method
- polishing apparatus
- polishing
- Prior art date
Links
- 238000005259 measurement Methods 0.000 title 1
- 238000000691 measurement method Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
- B24B49/045—Specially adapted gauging instruments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020085008A JP7503418B2 (ja) | 2020-05-14 | 2020-05-14 | 膜厚測定装置、研磨装置及び膜厚測定方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202105066VA true SG10202105066VA (en) | 2021-12-30 |
Family
ID=75914435
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202105066VA SG10202105066VA (en) | 2020-05-14 | 2021-05-14 | Film thickness measurement apparatus, polishing apparatus, and film thickness measurement method |
Country Status (7)
Country | Link |
---|---|
US (1) | US20210354262A1 (ja) |
EP (1) | EP3909717A1 (ja) |
JP (1) | JP7503418B2 (ja) |
KR (1) | KR20210141369A (ja) |
CN (1) | CN113664713A (ja) |
SG (1) | SG10202105066VA (ja) |
TW (1) | TW202208111A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102580520B1 (ko) * | 2023-05-10 | 2023-09-21 | 주식회사 라이쏠 | 고무패킹 폭 검사 장치 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3104288A1 (de) | 1981-02-07 | 1982-08-19 | SCHÜCO Heinz Schürmann GmbH & Co, 4800 Bielefeld | "fenster oder tuer mit in den eckbereichen der kammer zwischen blend- und fluegelrahmen angeordneten beschlagteilen" |
JPH10229060A (ja) | 1997-02-13 | 1998-08-25 | Nikon Corp | 研磨量測定装置 |
JP3001051B2 (ja) * | 1997-08-22 | 2000-01-17 | 日本電気株式会社 | 半導体ウェハ研磨終点検出装置 |
JP4427767B2 (ja) | 1999-07-02 | 2010-03-10 | 株式会社ニコン | 測定方法 |
JP3854056B2 (ja) | 1999-12-13 | 2006-12-06 | 株式会社荏原製作所 | 基板膜厚測定方法、基板膜厚測定装置、基板処理方法及び基板処理装置 |
JP2002124496A (ja) | 2000-10-18 | 2002-04-26 | Hitachi Ltd | 研磨加工の終点検出計測方法及びその装置、並びにそれを用いた半導体デバイスの製造方法及びその製造装置 |
JP5167010B2 (ja) | 2008-07-23 | 2013-03-21 | 株式会社荏原製作所 | 研磨終点検知方法および研磨装置 |
EP2331294A1 (de) | 2008-10-01 | 2011-06-15 | Peter Wolters GmbH | Verfahren zum messen der dicke eines scheibenförmigen werkstücks |
JP2013032981A (ja) * | 2011-08-02 | 2013-02-14 | Otsuka Denshi Co Ltd | 膜厚測定装置 |
JP6005467B2 (ja) | 2011-10-26 | 2016-10-12 | 株式会社荏原製作所 | 研磨方法および研磨装置 |
JP2014103344A (ja) | 2012-11-22 | 2014-06-05 | Ebara Corp | 研磨方法 |
JP6105371B2 (ja) | 2013-04-25 | 2017-03-29 | 株式会社荏原製作所 | 研磨方法および研磨装置 |
KR101758437B1 (ko) * | 2014-11-19 | 2017-07-17 | 삼성에스디아이 주식회사 | 유기막 cmp 슬러리 조성물 및 이를 이용한 연마방법 |
WO2019186808A1 (ja) | 2018-03-28 | 2019-10-03 | 堺ディスプレイプロダクト株式会社 | 有機el表示装置及びその製造方法 |
JP7151401B2 (ja) | 2018-11-15 | 2022-10-12 | 浜名湖電装株式会社 | 電磁弁 |
-
2020
- 2020-05-14 JP JP2020085008A patent/JP7503418B2/ja active Active
-
2021
- 2021-05-10 KR KR1020210059888A patent/KR20210141369A/ko active Search and Examination
- 2021-05-12 EP EP21173616.0A patent/EP3909717A1/en active Pending
- 2021-05-13 CN CN202110520681.4A patent/CN113664713A/zh active Pending
- 2021-05-13 TW TW110117220A patent/TW202208111A/zh unknown
- 2021-05-13 US US17/319,559 patent/US20210354262A1/en not_active Abandoned
- 2021-05-14 SG SG10202105066VA patent/SG10202105066VA/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN113664713A (zh) | 2021-11-19 |
JP7503418B2 (ja) | 2024-06-20 |
EP3909717A1 (en) | 2021-11-17 |
TW202208111A (zh) | 2022-03-01 |
KR20210141369A (ko) | 2021-11-23 |
JP2021180263A (ja) | 2021-11-18 |
US20210354262A1 (en) | 2021-11-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3881624A4 (en) | METHOD AND DEVICE FOR CHANNEL MEASUREMENT AND REPORTING ON A CORESET BASIS | |
EP4117333A4 (en) | MEASUREMENT METHOD AND DEVICE | |
EP3965310A4 (en) | METHOD AND DEVICE FOR DUCT MEASUREMENT | |
EP3387482A4 (en) | SYSTEM, APPARATUS AND METHOD FOR SURFACE PROFILE MONITORING AND THICKNESS MEASUREMENT IN THIN FILMS | |
EP3937541A4 (en) | MEASUREMENT METHOD, DEVICE AND EQUIPMENT | |
TWI799612B (zh) | 研磨裝置及校正方法 | |
EP4096280A4 (en) | MEASUREMENT PROCESS AND APPARATUS | |
GB202014261D0 (en) | Measurement method and apparatus | |
EP3745775A4 (en) | MEASURING METHOD AND DEVICE | |
EP4050930A4 (en) | METHOD AND APPARATUS FOR CONFIGURING MEASUREMENTS | |
EP3910992A4 (en) | METHOD AND APPARATUS FOR MEASURING CELLS | |
IL292195A (en) | Measuring method and measuring device | |
EP4067843A4 (en) | FILM THICKNESS MEASURING APPARATUS AND FILM THICKNESS MEASURING METHOD | |
KR102185623B9 (ko) | 박막증착장치 및 박막증착방법 | |
SG10202105066VA (en) | Film thickness measurement apparatus, polishing apparatus, and film thickness measurement method | |
SG10202012173WA (en) | Polishing unit, substrate processing apparatus, and polishing method | |
EP3972326A4 (en) | MEASUREMENT PROCESS AND APPARATUS | |
EP4007365A4 (en) | METHOD AND DEVICE FOR CELL MEASUREMENT | |
EP3916377A4 (en) | METHOD FOR MEASURING ANTIGEN AND MEASURING APPARATUS | |
EP3935257C0 (en) | CUTTING MEASURING METHODS AND RELATED DEVICE | |
EP3776927A4 (en) | APPARATUS AND METHOD FOR PROVIDING MEASUREMENT INFORMATION | |
EP3852478A4 (en) | CHANNEL QUALITY MEASUREMENT METHOD AND DEVICE | |
EP4258727A4 (en) | MEASURING METHODS AND DEVICE | |
EP4280658A4 (en) | MEASURING METHODS AND DEVICE | |
EP4319010A4 (en) | MEASURING METHOD AND DEVICE |