SG10202105066VA - Film thickness measurement apparatus, polishing apparatus, and film thickness measurement method - Google Patents

Film thickness measurement apparatus, polishing apparatus, and film thickness measurement method

Info

Publication number
SG10202105066VA
SG10202105066VA SG10202105066VA SG10202105066VA SG10202105066VA SG 10202105066V A SG10202105066V A SG 10202105066VA SG 10202105066V A SG10202105066V A SG 10202105066VA SG 10202105066V A SG10202105066V A SG 10202105066VA SG 10202105066V A SG10202105066V A SG 10202105066VA
Authority
SG
Singapore
Prior art keywords
film thickness
thickness measurement
measurement method
polishing apparatus
polishing
Prior art date
Application number
SG10202105066VA
Other languages
English (en)
Inventor
Satori Hirotaka
Ishii Yu
Kimba Toshifumi
Kinoshita Masaki
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10202105066VA publication Critical patent/SG10202105066VA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B24B49/045—Specially adapted gauging instruments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
SG10202105066VA 2020-05-14 2021-05-14 Film thickness measurement apparatus, polishing apparatus, and film thickness measurement method SG10202105066VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020085008A JP7503418B2 (ja) 2020-05-14 2020-05-14 膜厚測定装置、研磨装置及び膜厚測定方法

Publications (1)

Publication Number Publication Date
SG10202105066VA true SG10202105066VA (en) 2021-12-30

Family

ID=75914435

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202105066VA SG10202105066VA (en) 2020-05-14 2021-05-14 Film thickness measurement apparatus, polishing apparatus, and film thickness measurement method

Country Status (7)

Country Link
US (1) US20210354262A1 (ja)
EP (1) EP3909717A1 (ja)
JP (1) JP7503418B2 (ja)
KR (1) KR20210141369A (ja)
CN (1) CN113664713A (ja)
SG (1) SG10202105066VA (ja)
TW (1) TW202208111A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102580520B1 (ko) * 2023-05-10 2023-09-21 주식회사 라이쏠 고무패킹 폭 검사 장치

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3104288A1 (de) 1981-02-07 1982-08-19 SCHÜCO Heinz Schürmann GmbH & Co, 4800 Bielefeld "fenster oder tuer mit in den eckbereichen der kammer zwischen blend- und fluegelrahmen angeordneten beschlagteilen"
JPH10229060A (ja) 1997-02-13 1998-08-25 Nikon Corp 研磨量測定装置
JP3001051B2 (ja) * 1997-08-22 2000-01-17 日本電気株式会社 半導体ウェハ研磨終点検出装置
JP4427767B2 (ja) 1999-07-02 2010-03-10 株式会社ニコン 測定方法
JP3854056B2 (ja) 1999-12-13 2006-12-06 株式会社荏原製作所 基板膜厚測定方法、基板膜厚測定装置、基板処理方法及び基板処理装置
JP2002124496A (ja) 2000-10-18 2002-04-26 Hitachi Ltd 研磨加工の終点検出計測方法及びその装置、並びにそれを用いた半導体デバイスの製造方法及びその製造装置
JP5167010B2 (ja) 2008-07-23 2013-03-21 株式会社荏原製作所 研磨終点検知方法および研磨装置
EP2331294A1 (de) 2008-10-01 2011-06-15 Peter Wolters GmbH Verfahren zum messen der dicke eines scheibenförmigen werkstücks
JP2013032981A (ja) * 2011-08-02 2013-02-14 Otsuka Denshi Co Ltd 膜厚測定装置
JP6005467B2 (ja) 2011-10-26 2016-10-12 株式会社荏原製作所 研磨方法および研磨装置
JP2014103344A (ja) 2012-11-22 2014-06-05 Ebara Corp 研磨方法
JP6105371B2 (ja) 2013-04-25 2017-03-29 株式会社荏原製作所 研磨方法および研磨装置
KR101758437B1 (ko) * 2014-11-19 2017-07-17 삼성에스디아이 주식회사 유기막 ｃｍｐ 슬러리 조성물 및 이를 이용한 연마방법
WO2019186808A1 (ja) 2018-03-28 2019-10-03 堺ディスプレイプロダクト株式会社 有機ｅｌ表示装置及びその製造方法
JP7151401B2 (ja) 2018-11-15 2022-10-12 浜名湖電装株式会社 電磁弁

Also Published As

Publication number Publication date
CN113664713A (zh) 2021-11-19
JP7503418B2 (ja) 2024-06-20
EP3909717A1 (en) 2021-11-17
TW202208111A (zh) 2022-03-01
KR20210141369A (ko) 2021-11-23
JP2021180263A (ja) 2021-11-18
US20210354262A1 (en) 2021-11-18

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