SG10201908033QA - Tape, tape attaching method, and tape expanding method - Google Patents

Tape, tape attaching method, and tape expanding method

Info

Publication number
SG10201908033QA
SG10201908033QA SG10201908033QA SG10201908033QA SG10201908033QA SG 10201908033Q A SG10201908033Q A SG 10201908033QA SG 10201908033Q A SG10201908033Q A SG 10201908033QA SG 10201908033Q A SG10201908033Q A SG 10201908033QA SG 10201908033Q A SG10201908033Q A SG 10201908033QA
Authority
SG
Singapore
Prior art keywords
tape
expanding
attaching
attaching method
expanding method
Prior art date
Application number
SG10201908033QA
Inventor
Saito Yoshinobu
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201908033QA publication Critical patent/SG10201908033QA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/04—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring tension in flexible members, e.g. ropes, cables, wires, threads, belts or bands
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
SG10201908033QA 2018-09-03 2019-08-30 Tape, tape attaching method, and tape expanding method SG10201908033QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018164512A JP7189705B2 (en) 2018-09-03 2018-09-03 Tape sticking method and tape expansion method

Publications (1)

Publication Number Publication Date
SG10201908033QA true SG10201908033QA (en) 2020-04-29

Family

ID=69526977

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201908033QA SG10201908033QA (en) 2018-09-03 2019-08-30 Tape, tape attaching method, and tape expanding method

Country Status (7)

Country Link
US (1) US11222806B2 (en)
JP (1) JP7189705B2 (en)
KR (1) KR102655558B1 (en)
CN (1) CN110875233A (en)
DE (1) DE102019213328A1 (en)
SG (1) SG10201908033QA (en)
TW (1) TWI804674B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3705862B1 (en) * 2019-03-05 2023-07-05 Infineon Technologies AG Method and device for monitoring a dicing tape tension
JP2022120735A (en) * 2021-02-05 2022-08-18 株式会社東京精密 Apparatus and method for detecting abnormal tension of dicing tape

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63108090A (en) * 1986-10-24 1988-05-12 Hitachi Ltd Tacky adhesive tape
JP4585164B2 (en) * 2002-07-18 2010-11-24 日東電工株式会社 UV curable adhesive sheet
WO2005000571A1 (en) * 2003-06-23 2005-01-06 The Procter & Gamble Company Process for producing highly registered printed images and embossment patterns on stretchable substrates
JP2005079151A (en) * 2003-08-28 2005-03-24 Seiko Epson Corp Dicing tape, pickup device, and process for manufacturing semiconductor device
US20100285398A1 (en) * 2007-05-18 2010-11-11 3M Innovative Properties Company Tamper indicating article
JP2011513995A (en) * 2008-03-07 2011-04-28 スリーエム イノベイティブ プロパティズ カンパニー Dicing tape and die attach adhesive with patterned backing
JP5329833B2 (en) * 2008-04-08 2013-10-30 リンテック株式会社 Adhesive sheet for semiconductor wafer processing, adjustment method for semiconductor wafer processing apparatus using the same, and evaluation method for adhesive sheet
JP5507088B2 (en) * 2009-01-28 2014-05-28 リンテック株式会社 Protective film forming sheet for chip and semiconductor chip with protective film
JP5791866B2 (en) 2009-03-06 2015-10-07 株式会社ディスコ Work dividing device
JP5918025B2 (en) * 2012-05-22 2016-05-18 株式会社ディスコ Protective member and protective tape attaching method
US10709619B2 (en) * 2013-06-13 2020-07-14 3M Innovative Properties Company Fastening tape and mechanical fastener including microporous film
JP6682389B2 (en) 2016-07-05 2020-04-15 株式会社ディスコ Expansion device and expansion method

Also Published As

Publication number Publication date
CN110875233A (en) 2020-03-10
US20200075387A1 (en) 2020-03-05
JP7189705B2 (en) 2022-12-14
US11222806B2 (en) 2022-01-11
TW202010809A (en) 2020-03-16
KR102655558B1 (en) 2024-04-05
JP2020038872A (en) 2020-03-12
TWI804674B (en) 2023-06-11
DE102019213328A1 (en) 2020-03-05
KR20200026710A (en) 2020-03-11

Similar Documents

Publication Publication Date Title
EP3659138A4 (en) Selection system and method
EP3653541A4 (en) Order completion system and method
GB201712985D0 (en) Estimator and method
EP3572441A4 (en) Homopolypropylene and preparation method therefor
EP3572404A4 (en) Butylphthalide-telmisartan heterocomplex, preparation method and application thereof
SG11202007554TA (en) Dioxazoline compound, preparation method therefor, and uses thereof
EP3573387A4 (en) Downlink synchronization method and device
EP3596424A4 (en) Ptychography based system and method
EP3719796A4 (en) Voice synthesis method, voice synthesis device, and program
EP3632911A4 (en) Method for preparing isoxazinone compound and application thereof
SG10201908033QA (en) Tape, tape attaching method, and tape expanding method
IL282817A (en) Novel compound, preparation method and application thereof
EP3581561A4 (en) Biaryl compound, preparation method and use therefor
EP3550466C0 (en) Puf-film and method for producing the same
EP3603939A4 (en) Joining system and joining method
IL272858A (en) Earplug assembly and method for forming the same
SG10201905296YA (en) Tape expanding apparatus
PL3750893T3 (en) Dioxazoline compound, preparation method therefor, and uses thereof
SG11202008531RA (en) Oxazino-quinazoline and Oxazino-quinoline Type Compound, Preparation Method and Uses Thereof
EP3677289A4 (en) Angiogenic agent and method for producing same
EP3564215A4 (en) Polyhydroxyphthalazinone compound, preparation method therefor and use thereof
EP3660452A4 (en) Positioning system and positioning method
EP3576139A4 (en) Component-manufacturing film, component-manufacturing tool, and component-manufacturing method
EP3589463A4 (en) Die block, steel-rule die assembly comprising the same, and method thereof
EP3659258A4 (en) Phase-locked loop and method for the same