SG10201907457QA - Method for determining polishing pad height and polishing system - Google Patents

Method for determining polishing pad height and polishing system

Info

Publication number
SG10201907457QA
SG10201907457QA SG10201907457QA SG10201907457QA SG10201907457QA SG 10201907457Q A SG10201907457Q A SG 10201907457QA SG 10201907457Q A SG10201907457Q A SG 10201907457QA SG 10201907457Q A SG10201907457Q A SG 10201907457QA SG 10201907457Q A SG10201907457Q A SG 10201907457QA
Authority
SG
Singapore
Prior art keywords
polishing
determining
pad height
polishing pad
polishing system
Prior art date
Application number
SG10201907457QA
Inventor
Kunimasa Matsushita
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201907457QA publication Critical patent/SG10201907457QA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/005—Positioning devices for conditioning tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG10201907457QA 2018-08-23 2019-08-14 Method for determining polishing pad height and polishing system SG10201907457QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018156497A JP7265848B2 (en) 2018-08-23 2018-08-23 Method for determining polishing pad height, and polishing system

Publications (1)

Publication Number Publication Date
SG10201907457QA true SG10201907457QA (en) 2020-03-30

Family

ID=69583316

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201907457QA SG10201907457QA (en) 2018-08-23 2019-08-14 Method for determining polishing pad height and polishing system

Country Status (3)

Country Link
US (1) US20200061774A1 (en)
JP (1) JP7265848B2 (en)
SG (1) SG10201907457QA (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200130136A1 (en) * 2018-10-29 2020-04-30 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
JP2022032201A (en) * 2020-08-11 2022-02-25 株式会社荏原製作所 Substrate processor and dressing control method for polishing member
JP7421460B2 (en) 2020-09-29 2024-01-24 株式会社荏原製作所 Polishing equipment and how to determine when to replace polishing pads

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5390807B2 (en) 2008-08-21 2014-01-15 株式会社荏原製作所 Polishing method and apparatus
JP5511600B2 (en) 2010-09-09 2014-06-04 株式会社荏原製作所 Polishing equipment
JP6121795B2 (en) 2013-05-15 2017-04-26 株式会社荏原製作所 Dressing apparatus, polishing apparatus equipped with the dressing apparatus, and polishing method
JP6313611B2 (en) 2014-02-28 2018-04-18 株式会社荏原製作所 Polishing equipment

Also Published As

Publication number Publication date
JP7265848B2 (en) 2023-04-27
JP2020028955A (en) 2020-02-27
US20200061774A1 (en) 2020-02-27

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