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The invention relates to a non-chemical method and a system for recovering silicon carbide (SiC) particles and glycol, and in particular, to a non-chemical method and a system for recovering SiC particles and glycol that have been used in suspension in a cutting medium for the cutting or sawing of silicon wafers for solar cells and electronic objects often called slurry. FIG. 1
SG10201906802QA2015-01-272015-01-27Non-chemical method and system for recovering silicon carbide particles and glycol from a slurry
SG10201906802QA
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