SG10201807226RA - Laser beam profiler unit and laser processing apparatus - Google Patents

Laser beam profiler unit and laser processing apparatus

Info

Publication number
SG10201807226RA
SG10201807226RA SG10201807226RA SG10201807226RA SG10201807226RA SG 10201807226R A SG10201807226R A SG 10201807226RA SG 10201807226R A SG10201807226R A SG 10201807226RA SG 10201807226R A SG10201807226R A SG 10201807226RA SG 10201807226R A SG10201807226R A SG 10201807226RA
Authority
SG
Singapore
Prior art keywords
laser beam
laser
processing apparatus
profiler unit
transmission prism
Prior art date
Application number
SG10201807226RA
Inventor
Kuki Junichi
Koerwer Joel
Maeda Keinosuke
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201807226RA publication Critical patent/SG10201807226RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/04—Optical or mechanical part supplementary adjustable parts
    • G01J1/0407—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
    • G01J1/0477—Prisms, wedges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/4257—Photometry, e.g. photographic exposure meter using electric radiation detectors applied to monitoring the characteristics of a beam, e.g. laser beam, headlamp beam
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/02—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the intensity of light
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/281—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for attenuating light intensity, e.g. comprising rotatable polarising elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Lasers (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

LASER BEAM PROFILER UNIT AND LASER PROCESSING APPARATUS A laser beam profiler unit for measuring an intensity distribution of a laser beam oscillated from a laser oscillator includes a magnifying optical system for magnifying a spot diameter of the laser beam oscillated from the laser oscillator and focused by a condensing lens, a first transmission prism for attenuating the laser beam, a second transmission prism for further attenuating a laser beam reflected by the first transmission prism, an image capturing element for detecting the laser beam reflected by the second transmission prism, and an analyzer for analyzing an intensity distribution of a spot of the laser beam from data of the laser beam detected by the image capturing element. (Figure 5)
SG10201807226RA 2017-08-25 2018-08-24 Laser beam profiler unit and laser processing apparatus SG10201807226RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017162558A JP6955932B2 (en) 2017-08-25 2017-08-25 Laser beam profiler unit and laser processing equipment

Publications (1)

Publication Number Publication Date
SG10201807226RA true SG10201807226RA (en) 2019-03-28

Family

ID=65321925

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201807226RA SG10201807226RA (en) 2017-08-25 2018-08-24 Laser beam profiler unit and laser processing apparatus

Country Status (7)

Country Link
US (1) US10532433B2 (en)
JP (1) JP6955932B2 (en)
KR (1) KR102480251B1 (en)
CN (1) CN109454324B (en)
DE (1) DE102018214335A1 (en)
SG (1) SG10201807226RA (en)
TW (1) TWI771474B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220024662A (en) * 2019-06-22 2022-03-03 오피어-스피리콘, 엘엘씨 Nano-texture attenuators and laser beam characterization systems and methods of use for use with laser beam profiling
CN115485093A (en) * 2020-04-30 2022-12-16 株式会社尼康 Machining system
CN112769026A (en) * 2020-12-18 2021-05-07 洛阳鼎铭光电科技有限公司 Laser reflection lens group and method

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8319798D0 (en) * 1983-07-22 1983-08-24 Crosfield Electronics Ltd Controlling light beam spectrum
US5258821A (en) * 1990-04-20 1993-11-02 Photon, Inc. Laser beam profiler having a multimode laser diode interferometer
JPH0474934A (en) * 1990-07-17 1992-03-10 Canon Inc Measuring apparatus of characteristics of beam
JPH04333846A (en) * 1991-05-09 1992-11-20 Hitachi Electron Eng Co Ltd Foreign matter detection optical system for reticle mask
JP3594706B2 (en) * 1995-08-22 2004-12-02 浜松ホトニクス株式会社 Light source position adjustment device
IT1290575B1 (en) * 1997-03-07 1998-12-10 Cise Spa DEVICE FOR THE CHARACTERIZATION OF LASER BEAMS
US5951891A (en) * 1997-03-24 1999-09-14 International Business Machines Corporation Optical apparatus for monitoring profiles of textured spots during a disk texturing process
JP2001068829A (en) * 1999-06-21 2001-03-16 Fine Device:Kk Cutting method and equipment of short-circuited part of printed wiring board
US6624424B2 (en) * 2000-02-09 2003-09-23 Lambda Physik Ag VUV laser beam characterization system
KR100829876B1 (en) * 2000-10-26 2008-05-16 엑스에스아이엘 테크놀러지 리미티드 Control of laser machining
JP2002188957A (en) * 2000-12-21 2002-07-05 Ando Electric Co Ltd Light power sensor
JP2002188975A (en) * 2000-12-21 2002-07-05 Matsushita Electric Works Ltd Pressure sensor module
US7846152B2 (en) * 2004-03-24 2010-12-07 Amo Manufacturing Usa, Llc. Calibrating laser beam position and shape using an image capture device
US7244906B2 (en) * 2005-08-30 2007-07-17 Electro Scientific Industries, Inc. Energy monitoring or control of individual vias formed during laser micromachining
TW200805347A (en) * 2005-11-29 2008-01-16 Konica Minolta Opto Inc Objective lens for optical pickup apparatus, objective lens unit for optical pickup apparatus and optical pickup apparatus using the same
JP2007240254A (en) * 2006-03-07 2007-09-20 Mitsubishi Heavy Ind Ltd Laser device, intensity profile measuring method of laser irradiation device, and laser irradiation device
JP4514767B2 (en) * 2007-03-28 2010-07-28 日立ビアメカニクス株式会社 Laser energy measuring device and laser processing device
JP4402708B2 (en) * 2007-08-03 2010-01-20 浜松ホトニクス株式会社 Laser processing method, laser processing apparatus and manufacturing method thereof
CN101318264B (en) * 2008-07-07 2011-01-12 苏州德龙激光有限公司 Ultraviolet laser machining apparatus for cutting wafer
US8198564B2 (en) * 2008-09-09 2012-06-12 Electro Scientific Industries, Inc. Adaptive optic beamshaping in laser processing systems
JP2010249727A (en) 2009-04-17 2010-11-04 Disco Abrasive Syst Ltd Method of measuring strength of laser light and cellular phone with camera
JP2011243642A (en) * 2010-05-14 2011-12-01 Sanyo Electric Co Ltd Semiconductor laser device and optical device
SG177786A1 (en) * 2010-07-13 2012-02-28 Semiconductor Tech & Instr Inc System and method for capturing illumination reflected in multiple directions
FR2974176B1 (en) * 2011-04-14 2014-01-17 Centre Nat Rech Scient SPATIAL LASER BEAM ANALYZER WITH AUTOMATIC ADJUSTMENT
CN103155106B (en) * 2011-06-15 2016-09-07 株式会社日本制钢所 Laser machining device and laser processing method
JP5902490B2 (en) * 2012-01-25 2016-04-13 株式会社ディスコ Laser beam spot shape detection method and spot shape detection device
JP5902540B2 (en) * 2012-04-02 2016-04-13 株式会社ディスコ Laser processing method and laser processing apparatus
KR20140142856A (en) * 2013-06-05 2014-12-15 삼성디스플레이 주식회사 Laser apparatus and method of crystallizing
JP6045708B2 (en) * 2013-09-09 2016-12-14 三菱電機株式会社 Laser scanner
US20160344162A1 (en) * 2014-01-30 2016-11-24 Mitsubishi Electric Corporation Beam combining device and output recovery method for beam combining device
JP6328521B2 (en) * 2014-08-18 2018-05-23 株式会社ディスコ Laser beam spot shape detection method
CN104697649B (en) * 2015-03-02 2022-07-12 中国科学院物理研究所 Single-shot laser pulse detection device
WO2016147752A1 (en) * 2015-03-13 2016-09-22 日産自動車株式会社 Optical attenuator
JP6576061B2 (en) * 2015-03-13 2019-09-18 日産自動車株式会社 Laser beam intensity distribution measuring apparatus and laser beam intensity distribution measuring method
GB2541412B (en) * 2015-08-18 2018-08-01 M Solv Ltd Method and Apparatus for Forming a Conductive Track
TWI647431B (en) * 2015-11-09 2019-01-11 耐諾股份有限公司 Optical metrology apparatus and method
CN105387933B (en) * 2015-12-24 2019-02-26 中国电子科技集团公司第四十一研究所 A kind of broadband Brewster window regulating device and method
CN106938370B (en) * 2015-12-30 2019-12-24 上海微电子装备（集团）股份有限公司 Laser processing system and method

Also Published As

Publication number Publication date
US20190061063A1 (en) 2019-02-28
DE102018214335A1 (en) 2019-02-28
KR102480251B1 (en) 2022-12-21
TWI771474B (en) 2022-07-21
KR20190022337A (en) 2019-03-06
JP6955932B2 (en) 2021-10-27
CN109454324B (en) 2021-11-30
TW201913049A (en) 2019-04-01
CN109454324A (en) 2019-03-12
US10532433B2 (en) 2020-01-14
JP2019039830A (en) 2019-03-14

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