SG10201800618SA - Laser processing apparatus - Google Patents
Laser processing apparatusInfo
- Publication number
- SG10201800618SA SG10201800618SA SG10201800618SA SG10201800618SA SG10201800618SA SG 10201800618S A SG10201800618S A SG 10201800618SA SG 10201800618S A SG10201800618S A SG 10201800618SA SG 10201800618S A SG10201800618S A SG 10201800618SA SG 10201800618S A SG10201800618S A SG 10201800618SA
- Authority
- SG
- Singapore
- Prior art keywords
- laser processing
- chuck table
- processing apparatus
- line sensor
- unit
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/206—Laser sealing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3178—Coating or filling in grooves made in the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017013501A JP2018121031A (ja) | 2017-01-27 | 2017-01-27 | レーザー加工装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201800618SA true SG10201800618SA (en) | 2018-08-30 |
Family
ID=62843051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201800618SA SG10201800618SA (en) | 2017-01-27 | 2018-01-24 | Laser processing apparatus |
Country Status (7)
Country | Link |
---|---|
US (1) | US10807198B2 (zh) |
JP (1) | JP2018121031A (zh) |
KR (1) | KR20180088584A (zh) |
CN (1) | CN108406105A (zh) |
DE (1) | DE102018201156A1 (zh) |
SG (1) | SG10201800618SA (zh) |
TW (1) | TW201828341A (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG11202008663VA (en) * | 2018-03-30 | 2020-10-29 | Tokyo Electron Ltd | Laser processing device and laser processing method |
JP7368098B2 (ja) * | 2019-04-17 | 2023-10-24 | 株式会社ディスコ | ウエーハの加工方法 |
JP7325897B2 (ja) * | 2019-04-18 | 2023-08-15 | 株式会社ディスコ | 加工装置及び被加工物の加工方法 |
JP7343293B2 (ja) * | 2019-04-18 | 2023-09-12 | 株式会社ディスコ | 分割加工装置 |
JP7286464B2 (ja) * | 2019-08-02 | 2023-06-05 | 株式会社ディスコ | レーザー加工装置 |
JP7382762B2 (ja) * | 2019-08-27 | 2023-11-17 | 株式会社ディスコ | レーザー加工装置の加工結果の良否判定方法 |
JP7370265B2 (ja) | 2020-01-30 | 2023-10-27 | 株式会社ディスコ | 加工方法及び加工装置 |
CN111640695B (zh) * | 2020-06-05 | 2023-04-11 | 深圳市长方集团股份有限公司 | 一种在晶圆上封装uvc led芯片的装置及工艺 |
JP2022090272A (ja) * | 2020-12-07 | 2022-06-17 | 株式会社ディスコ | ウエーハ生成装置 |
CN112992692B (zh) * | 2021-05-19 | 2021-07-20 | 佛山市联动科技股份有限公司 | 一种全自动切割引线的方法及*** |
CN115458468B (zh) * | 2022-11-11 | 2023-03-24 | 扬州韩思半导体科技有限公司 | 一种半导体晶圆激光切割装置及方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002100709A (ja) | 2000-09-21 | 2002-04-05 | Hitachi Ltd | 半導体装置及びその製造方法 |
JP2005064231A (ja) * | 2003-08-12 | 2005-03-10 | Disco Abrasive Syst Ltd | 板状物の分割方法 |
JP4684687B2 (ja) * | 2005-03-11 | 2011-05-18 | 株式会社ディスコ | ウエーハのレーザー加工方法および加工装置 |
JP2008050219A (ja) * | 2006-08-25 | 2008-03-06 | Shibaura Mechatronics Corp | スクライブ溝形成装置、割断装置およびスクライブ溝形成方法 |
JP2008200694A (ja) * | 2007-02-19 | 2008-09-04 | Disco Abrasive Syst Ltd | ウエーハの加工方法およびレーザー加工装置 |
JP5140316B2 (ja) * | 2007-05-18 | 2013-02-06 | 株式会社ディスコ | 検査装置 |
JP4358889B1 (ja) * | 2008-06-27 | 2009-11-04 | 日本エレクトロセンサリデバイス株式会社 | ウエーハ欠陥検査装置 |
JP6108806B2 (ja) * | 2012-12-10 | 2017-04-05 | 株式会社ディスコ | 加工装置 |
JP6393583B2 (ja) * | 2014-10-30 | 2018-09-19 | 株式会社ディスコ | 保護膜検出装置及び保護膜検出方法 |
JP2016120535A (ja) * | 2014-12-24 | 2016-07-07 | 株式会社ディスコ | 加工装置 |
JP6553940B2 (ja) * | 2015-05-15 | 2019-07-31 | 株式会社ディスコ | レーザー加工装置 |
-
2017
- 2017-01-27 JP JP2017013501A patent/JP2018121031A/ja active Pending
-
2018
- 2018-01-22 KR KR1020180007542A patent/KR20180088584A/ko not_active Application Discontinuation
- 2018-01-23 CN CN201810064024.1A patent/CN108406105A/zh active Pending
- 2018-01-24 SG SG10201800618SA patent/SG10201800618SA/en unknown
- 2018-01-24 TW TW107102576A patent/TW201828341A/zh unknown
- 2018-01-25 DE DE102018201156.7A patent/DE102018201156A1/de not_active Withdrawn
- 2018-01-26 US US15/880,846 patent/US10807198B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN108406105A (zh) | 2018-08-17 |
JP2018121031A (ja) | 2018-08-02 |
US10807198B2 (en) | 2020-10-20 |
TW201828341A (zh) | 2018-08-01 |
KR20180088584A (ko) | 2018-08-06 |
DE102018201156A1 (de) | 2018-08-02 |
US20180214986A1 (en) | 2018-08-02 |
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