SG10201609120WA - Sheet for sealing hollow electronic device and method for producing hollow electronic device package - Google Patents
Sheet for sealing hollow electronic device and method for producing hollow electronic device packageInfo
- Publication number
- SG10201609120WA SG10201609120WA SG10201609120WA SG10201609120WA SG10201609120WA SG 10201609120W A SG10201609120W A SG 10201609120WA SG 10201609120W A SG10201609120W A SG 10201609120WA SG 10201609120W A SG10201609120W A SG 10201609120WA SG 10201609120W A SG10201609120W A SG 10201609120WA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic device
- hollow electronic
- sheet
- sealing
- device package
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000007789 sealing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015216549A JP6282626B2 (en) | 2015-11-04 | 2015-11-04 | Hollow type electronic device sealing sheet and method for manufacturing hollow type electronic device package |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201609120WA true SG10201609120WA (en) | 2017-06-29 |
Family
ID=58771788
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201609120WA SG10201609120WA (en) | 2015-11-04 | 2016-11-01 | Sheet for sealing hollow electronic device and method for producing hollow electronic device package |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6282626B2 (en) |
CN (1) | CN107039360B (en) |
SG (1) | SG10201609120WA (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3690932A4 (en) * | 2017-09-29 | 2021-02-17 | Nagase ChemteX Corporation | Method for producing mounting structure, and sheet used in same |
US11799442B2 (en) | 2017-09-29 | 2023-10-24 | Nagase Chemtex Corporation | Manufacturing method of mounting structure, and laminate sheet therefor |
CN111279472B (en) * | 2017-10-31 | 2023-06-30 | 长濑化成株式会社 | Method for manufacturing mounting structure and sheet used therein |
KR20200081336A (en) * | 2017-11-17 | 2020-07-07 | 린텍 가부시키가이샤 | Resin sheet |
KR102525372B1 (en) * | 2017-12-14 | 2023-04-26 | 나가세케무텍쿠스가부시키가이샤 | Manufacturing method of mounting structure and sheet used therein |
JP7038575B2 (en) * | 2018-03-08 | 2022-03-18 | 日東電工株式会社 | Sealing sheet |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4273777B2 (en) * | 2003-01-29 | 2009-06-03 | 宇部興産株式会社 | Insulating film composition, insulating film, and method of forming insulating film |
JP4474113B2 (en) * | 2003-04-07 | 2010-06-02 | 日立化成工業株式会社 | Solid epoxy resin molding material for sealing and semiconductor device |
JP4730652B2 (en) * | 2004-06-02 | 2011-07-20 | ナガセケムテックス株式会社 | Manufacturing method of electronic parts |
JP4772305B2 (en) * | 2004-09-03 | 2011-09-14 | 京セラケミカル株式会社 | Sheet-shaped resin composition for compression molding, resin-encapsulated semiconductor device, and method for manufacturing the same |
WO2009038020A1 (en) * | 2007-09-19 | 2009-03-26 | Toray Industries, Inc. | Adhesive composition for electronic components and adhesive sheet for electronic components using the same |
JP5426511B2 (en) * | 2009-11-30 | 2014-02-26 | パナソニック株式会社 | Epoxy resin composition sheet for sealing and hollow device sealed using the same |
US9085685B2 (en) * | 2011-11-28 | 2015-07-21 | Nitto Denko Corporation | Under-fill material and method for producing semiconductor device |
JP2013145839A (en) * | 2012-01-16 | 2013-07-25 | Nitto Denko Corp | Hollow sealing resin sheet, manufacturing method of hollow sealing resin sheet, manufacturing method of hollow type electronic component apparatus, and hollow type electronic component apparatus |
JP2013191592A (en) * | 2012-03-12 | 2013-09-26 | Idemitsu Unitech Co Ltd | Method for sealing electric and electronic component |
JP5961055B2 (en) * | 2012-07-05 | 2016-08-02 | 日東電工株式会社 | Sealing resin sheet, electronic component package manufacturing method, and electronic component package |
JP2015128148A (en) * | 2013-11-28 | 2015-07-09 | 日東電工株式会社 | Hollow sealing resin sheet and manufacturing method of hollow package |
JP2015106573A (en) * | 2013-11-28 | 2015-06-08 | 日東電工株式会社 | Resin sheet for hollow sealing, and manufacturing method of hollow package |
-
2015
- 2015-11-04 JP JP2015216549A patent/JP6282626B2/en active Active
-
2016
- 2016-11-01 SG SG10201609120WA patent/SG10201609120WA/en unknown
- 2016-11-04 CN CN201610974096.0A patent/CN107039360B/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP6282626B2 (en) | 2018-02-21 |
CN107039360A (en) | 2017-08-11 |
JP2017092103A (en) | 2017-05-25 |
CN107039360B (en) | 2021-07-06 |
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