SG10201605147WA - Semiconductor device and method of forming thin profile wlcsp withvertical interconnect over package footprint - Google Patents

Semiconductor device and method of forming thin profile wlcsp withvertical interconnect over package footprint

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Publication number
SG10201605147WA
SG10201605147WA SG10201605147WA SG10201605147WA SG10201605147WA SG 10201605147W A SG10201605147W A SG 10201605147WA SG 10201605147W A SG10201605147W A SG 10201605147WA SG 10201605147W A SG10201605147W A SG 10201605147WA SG 10201605147W A SG10201605147W A SG 10201605147WA
Authority
SG
Singapore
Prior art keywords
withvertical
wlcsp
semiconductor device
forming thin
thin profile
Prior art date
Application number
SG10201605147WA
Inventor
Heejo Chi
Namju Cho
Hangil Shin
Original Assignee
Stats Chippac Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stats Chippac Pte Ltd filed Critical Stats Chippac Pte Ltd
Publication of SG10201605147WA publication Critical patent/SG10201605147WA/en

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    • H01L2924/19101—Disposition of discrete passive components
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    • H01L2924/19104—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device on the semiconductor or solid-state device, i.e. passive-on-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Electromagnetism (AREA)
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  • Health & Medical Sciences (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
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US9558965B2 (en) 2017-01-31
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