SG10201602690RA - Resin-sprinkling method, resin-molding method, resin-sprinkling apparatus, resin-molding apparatus, and production apparatus for resin-molded article - Google Patents

Resin-sprinkling method, resin-molding method, resin-sprinkling apparatus, resin-molding apparatus, and production apparatus for resin-molded article

Info

Publication number
SG10201602690RA
SG10201602690RA SG10201602690RA SG10201602690RA SG10201602690RA SG 10201602690R A SG10201602690R A SG 10201602690RA SG 10201602690R A SG10201602690R A SG 10201602690RA SG 10201602690R A SG10201602690R A SG 10201602690RA SG 10201602690R A SG10201602690R A SG 10201602690RA
Authority
SG
Singapore
Prior art keywords
resin
sprinkling
molding
molded article
production
Prior art date
Application number
SG10201602690RA
Inventor
Takada Naoki
Yamashita Nobuya
Mizuma Keita
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of SG10201602690RA publication Critical patent/SG10201602690RA/en

Links

SG10201602690RA 2013-12-24 2014-12-17 Resin-sprinkling method, resin-molding method, resin-sprinkling apparatus, resin-molding apparatus, and production apparatus for resin-molded article SG10201602690RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013266088A JP6284764B2 (en) 2013-12-24 2013-12-24 Resin-spreading method, resin-sealing method for resin-sealed parts, resin-spreading apparatus, resin-sealing apparatus for resin-sealed parts, and resin-sealed molded product manufacturing apparatus

Publications (1)

Publication Number Publication Date
SG10201602690RA true SG10201602690RA (en) 2016-05-30

Family

ID=53533815

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201602690RA SG10201602690RA (en) 2013-12-24 2014-12-17 Resin-sprinkling method, resin-molding method, resin-sprinkling apparatus, resin-molding apparatus, and production apparatus for resin-molded article
SG10201408440VA SG10201408440VA (en) 2013-12-24 2014-12-17 Resin-sprinkling method, resin-molding method, resin-sprinkling apparatus, resin-molding apparatus, and production apparatus for resin-molded article

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201408440VA SG10201408440VA (en) 2013-12-24 2014-12-17 Resin-sprinkling method, resin-molding method, resin-sprinkling apparatus, resin-molding apparatus, and production apparatus for resin-molded article

Country Status (2)

Country Link
JP (1) JP6284764B2 (en)
SG (2) SG10201602690RA (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6612172B2 (en) * 2016-04-25 2019-11-27 Ｔｏｗａ株式会社 Resin molding apparatus, resin molding method, resin molded product manufacturing method, and product manufacturing method
JP6218891B1 (en) * 2016-06-24 2017-10-25 Ｔｏｗａ株式会社 Resin molding apparatus, resin molded product manufacturing method, and product manufacturing method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5576197B2 (en) * 2010-07-08 2014-08-20 Ｔｏｗａ株式会社 Electronic component compression molding method and molding apparatus
CN103930252B (en) * 2011-11-08 2016-08-17 山田尖端科技株式会社 Resin sealing apparatus

Also Published As

Publication number Publication date
JP2015122446A (en) 2015-07-02
JP6284764B2 (en) 2018-02-28
SG10201408440VA (en) 2015-07-30

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