SG10201510413XA - Contact Assembly In A Testing Apparatus For Integrated Circuits - Google Patents

Contact Assembly In A Testing Apparatus For Integrated Circuits

Info

Publication number
SG10201510413XA
SG10201510413XA SG10201510413XA SG10201510413XA SG10201510413XA SG 10201510413X A SG10201510413X A SG 10201510413XA SG 10201510413X A SG10201510413X A SG 10201510413XA SG 10201510413X A SG10201510413X A SG 10201510413XA SG 10201510413X A SG10201510413X A SG 10201510413XA
Authority
SG
Singapore
Prior art keywords
integrated circuits
testing apparatus
contact assembly
assembly
contact
Prior art date
Application number
SG10201510413XA
Inventor
Wei Kuong Foong
Kok Sing Goh
Shamal Mundiyath
Eng Kiat Lee
Original Assignee
Jf Microtechnology Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jf Microtechnology Sdn Bhd filed Critical Jf Microtechnology Sdn Bhd
Publication of SG10201510413XA publication Critical patent/SG10201510413XA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
SG10201510413XA 2014-12-17 2015-12-17 Contact Assembly In A Testing Apparatus For Integrated Circuits SG10201510413XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2014003476A MY180767A (en) 2014-12-17 2014-12-17 Contact assembly in a testing apparatus for integrated circuits

Publications (1)

Publication Number Publication Date
SG10201510413XA true SG10201510413XA (en) 2016-07-28

Family

ID=56129135

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201510413XA SG10201510413XA (en) 2014-12-17 2015-12-17 Contact Assembly In A Testing Apparatus For Integrated Circuits

Country Status (4)

Country Link
US (1) US9658253B2 (en)
MY (1) MY180767A (en)
SG (1) SG10201510413XA (en)
TW (1) TWI682178B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI668451B (en) * 2018-06-25 2019-08-11 高天星 Conduction device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5012924A (en) * 1990-03-19 1991-05-07 R. H. Murphy Company, Inc. Carriers for integrated circuits and the like
US20100020654A1 (en) * 2008-07-28 2010-01-28 Mediatek Inc. Method and apparatus for data buffer control of optical disc player
US7928751B2 (en) * 2009-02-18 2011-04-19 Winmems Technologies Holdings Co., Ltd. MEMS interconnection pins fabrication on a reusable substrate for probe card application
JP6235785B2 (en) * 2013-03-18 2017-11-22 日本電子材料株式会社 Probe card guide plate and probe card guide plate manufacturing method

Also Published As

Publication number Publication date
TW201623970A (en) 2016-07-01
TWI682178B (en) 2020-01-11
US20160178692A1 (en) 2016-06-23
US9658253B2 (en) 2017-05-23
MY180767A (en) 2020-12-08

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