SG10201503189QA - Semiconductor wafer and manufacturing method thereof - Google Patents
Semiconductor wafer and manufacturing method thereofInfo
- Publication number
- SG10201503189QA SG10201503189QA SG10201503189QA SG10201503189QA SG10201503189QA SG 10201503189Q A SG10201503189Q A SG 10201503189QA SG 10201503189Q A SG10201503189Q A SG 10201503189QA SG 10201503189Q A SG10201503189Q A SG 10201503189QA SG 10201503189Q A SG10201503189Q A SG 10201503189QA
- Authority
- SG
- Singapore
- Prior art keywords
- manufacturing
- semiconductor wafer
- wafer
- semiconductor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/30—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface
- H01L29/34—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface the imperfections being on the surface
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011098241A JP5621702B2 (en) | 2011-04-26 | 2011-04-26 | Semiconductor wafer and manufacturing method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201503189QA true SG10201503189QA (en) | 2015-06-29 |
Family
ID=47071813
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201503189QA SG10201503189QA (en) | 2011-04-26 | 2012-04-03 | Semiconductor wafer and manufacturing method thereof |
SG2013079629A SG194646A1 (en) | 2011-04-26 | 2012-04-03 | Semiconductor wafer and manufacturing method thereof |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2013079629A SG194646A1 (en) | 2011-04-26 | 2012-04-03 | Semiconductor wafer and manufacturing method thereof |
Country Status (8)
Country | Link |
---|---|
US (1) | US9076750B2 (en) |
JP (1) | JP5621702B2 (en) |
KR (1) | KR101774850B1 (en) |
CN (1) | CN103493184B (en) |
DE (1) | DE112012001458B4 (en) |
SG (2) | SG10201503189QA (en) |
TW (1) | TWI501304B (en) |
WO (1) | WO2012147279A1 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6180873B2 (en) * | 2013-08-30 | 2017-08-16 | 株式会社クラレ | Fiber composite sheet, polishing pad and manufacturing method thereof |
MX363099B (en) * | 2014-04-30 | 2019-03-08 | 1366 Tech Inc | Methods and apparati for making thin semi-conductor wafers with locally controlled regions that are relatively thicker than other regions and such wafers. |
DE102015220924B4 (en) * | 2015-10-27 | 2018-09-27 | Siltronic Ag | Susceptor for holding a semiconductor wafer with orientation notch, method for depositing a layer on a semiconductor wafer and semiconductor wafer |
JP6406238B2 (en) * | 2015-12-18 | 2018-10-17 | 株式会社Sumco | Wafer polishing method and polishing apparatus |
KR101810643B1 (en) * | 2016-02-02 | 2017-12-19 | 에스케이실트론 주식회사 | Method of controling a flatness of a epitaxial wafer |
KR102086281B1 (en) * | 2017-04-28 | 2020-03-06 | 제이엑스금속주식회사 | Polishing method of semiconductor wafer and semiconductor wafer |
DE102017210450A1 (en) * | 2017-06-21 | 2018-12-27 | Siltronic Ag | Method, control system and plant for processing a semiconductor wafer and semiconductor wafer |
DE102017210423A1 (en) * | 2017-06-21 | 2018-12-27 | Siltronic Ag | Method, control system and plant for processing a semiconductor wafer and semiconductor wafer |
JP6799509B2 (en) * | 2017-07-21 | 2020-12-16 | クラリオン株式会社 | Association system, association method |
WO2019035336A1 (en) * | 2017-08-15 | 2019-02-21 | 信越半導体株式会社 | Evaluation method and evaluation device of edge shape of silicon wafer, silicon wafer, and selection method and manufacturing method thereof |
JP6750592B2 (en) * | 2017-08-15 | 2020-09-02 | 信越半導体株式会社 | Method and apparatus for evaluating edge shape of silicon wafer, silicon wafer, and method for selecting and manufacturing the same |
JP6451825B1 (en) * | 2017-12-25 | 2019-01-16 | 株式会社Sumco | Wafer double-side polishing method |
DE102018200415A1 (en) * | 2018-01-11 | 2019-07-11 | Siltronic Ag | Semiconductor wafer with epitaxial layer |
KR102518971B1 (en) * | 2018-04-13 | 2023-04-05 | 가부시키가이샤 사무코 | Semiconductor wafer evaluation method and semiconductor wafer manufacturing method |
JP7067524B2 (en) * | 2019-04-15 | 2022-05-16 | 信越半導体株式会社 | Wafer flatness measuring machine selection method and measuring method |
KR102413432B1 (en) * | 2020-08-28 | 2022-06-27 | 에스케이실트론 주식회사 | Wafer and method for analyzing shape of the same |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3341258B2 (en) | 1992-11-27 | 2002-11-05 | 株式会社東芝 | Polishing equipment |
JPH08257893A (en) | 1995-03-29 | 1996-10-08 | Mitsubishi Materials Corp | Device and method for polishing wafer |
JP2001326197A (en) | 2000-03-10 | 2001-11-22 | Mitsubishi Materials Silicon Corp | Polishing method of semiconductor wafer and polishing apparatus thereof |
JP2002064071A (en) * | 2000-06-09 | 2002-02-28 | Sumitomo Osaka Cement Co Ltd | Polishing plate for mirror polishing silicon wafer and method thereof |
WO2001096065A1 (en) | 2000-06-13 | 2001-12-20 | Shin-Etsu Handotai Co., Ltd. | Method for polishing work |
WO2002035593A1 (en) * | 2000-10-26 | 2002-05-02 | Shin-Etsu Handotai Co.,Ltd. | Wafer manufacturing method, polishing apparatus, and wafer |
JP3612708B2 (en) | 2001-11-29 | 2005-01-19 | 信越半導体株式会社 | Grooved polishing cloth, workpiece polishing method and polishing apparatus |
JP3935757B2 (en) | 2002-03-28 | 2007-06-27 | 信越半導体株式会社 | Wafer double-side polishing apparatus and double-side polishing method |
KR20060038612A (en) * | 2004-10-30 | 2006-05-04 | 주식회사 하이닉스반도체 | Method for detection edge roll-off of wafer |
JP4881590B2 (en) * | 2005-07-27 | 2012-02-22 | ニッタ・ハース株式会社 | Polishing cloth |
JP2007067179A (en) * | 2005-08-31 | 2007-03-15 | Shin Etsu Handotai Co Ltd | Mirror-finished surface polishing method and system for semiconductor wafer |
KR100841094B1 (en) | 2005-12-20 | 2008-06-25 | 주식회사 실트론 | Silicon wafer grinding apparatus, retaining assembly, and silicon wafer flatness correcting method |
JP2007173815A (en) * | 2005-12-20 | 2007-07-05 | Siltron Inc | Silicon wafer polishing machine, retaining assembly used for same, and method of correcting flatness of silicon wafer |
DE602006000423T2 (en) * | 2006-03-31 | 2008-05-21 | S.O.I.Tec. Silicon On Insulator Technologies S.A. | Method for producing a composite material and method for selecting a wafer |
JP4904960B2 (en) * | 2006-07-18 | 2012-03-28 | 信越半導体株式会社 | Carrier for double-side polishing apparatus, double-side polishing apparatus and double-side polishing method using the same |
JP2008254124A (en) * | 2007-04-05 | 2008-10-23 | Toray Ind Inc | Grinding pad |
JP2009090397A (en) * | 2007-10-05 | 2009-04-30 | Nitta Haas Inc | Polishing pad |
DE102009009497A1 (en) * | 2009-02-18 | 2010-07-08 | Siltronic Ag | Runner disk for holding conductive disks during reciprocal polish, has recesses for supporting conductive disks and depressing openings for polishing agent supplying polish |
JP2011079076A (en) * | 2009-10-05 | 2011-04-21 | Toshiba Corp | Polishing device and polishing method |
-
2011
- 2011-04-26 JP JP2011098241A patent/JP5621702B2/en active Active
-
2012
- 2012-04-03 WO PCT/JP2012/002304 patent/WO2012147279A1/en active Application Filing
- 2012-04-03 SG SG10201503189QA patent/SG10201503189QA/en unknown
- 2012-04-03 KR KR1020137028156A patent/KR101774850B1/en active IP Right Grant
- 2012-04-03 DE DE112012001458.8T patent/DE112012001458B4/en active Active
- 2012-04-03 US US14/005,975 patent/US9076750B2/en active Active
- 2012-04-03 SG SG2013079629A patent/SG194646A1/en unknown
- 2012-04-03 CN CN201280020389.5A patent/CN103493184B/en active Active
- 2012-04-09 TW TW101112481A patent/TWI501304B/en active
Also Published As
Publication number | Publication date |
---|---|
JP2012231005A (en) | 2012-11-22 |
CN103493184A (en) | 2014-01-01 |
TW201306109A (en) | 2013-02-01 |
DE112012001458T5 (en) | 2013-12-19 |
WO2012147279A1 (en) | 2012-11-01 |
JP5621702B2 (en) | 2014-11-12 |
US20140008768A1 (en) | 2014-01-09 |
KR101774850B1 (en) | 2017-09-05 |
KR20140048869A (en) | 2014-04-24 |
TWI501304B (en) | 2015-09-21 |
DE112012001458B4 (en) | 2024-05-08 |
CN103493184B (en) | 2016-03-30 |
US9076750B2 (en) | 2015-07-07 |
SG194646A1 (en) | 2013-12-30 |
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