SG10201502035RA - Washing device and washing method - Google Patents

Washing device and washing method

Info

Publication number
SG10201502035RA
SG10201502035RA SG10201502035RA SG10201502035RA SG10201502035RA SG 10201502035R A SG10201502035R A SG 10201502035RA SG 10201502035R A SG10201502035R A SG 10201502035RA SG 10201502035R A SG10201502035R A SG 10201502035RA SG 10201502035R A SG10201502035R A SG 10201502035RA
Authority
SG
Singapore
Prior art keywords
washing
washing device
washing method
Prior art date
Application number
SG10201502035RA
Inventor
Tomoatsu Ishibashi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201502035RA publication Critical patent/SG10201502035RA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B08B1/143
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00Accessories or details of general applicability for machines or apparatus for cleaning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • B08B3/024Cleaning by means of spray elements moving over the surface to be cleaned
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02057Cleaning during device manufacture
    • H01L21/02068Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02074Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02057Cleaning during device manufacture
SG10201502035RA 2014-04-01 2015-03-17 Washing device and washing method SG10201502035RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014075712 2014-04-01
JP2015042868A JP6600470B2 (en) 2014-04-01 2015-03-04 Cleaning device and cleaning method

Publications (1)

Publication Number Publication Date
SG10201502035RA true SG10201502035RA (en) 2015-11-27

Family

ID=54552613

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201502035RA SG10201502035RA (en) 2014-04-01 2015-03-17 Washing device and washing method
SG10201901404XA SG10201901404XA (en) 2014-04-01 2015-03-17 Washing device and washing method

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201901404XA SG10201901404XA (en) 2014-04-01 2015-03-17 Washing device and washing method

Country Status (6)

Country Link
US (3) US10170344B2 (en)
JP (4) JP6600470B2 (en)
KR (3) KR102314682B1 (en)
CN (1) CN109647769B (en)
SG (2) SG10201502035RA (en)
TW (2) TWI666068B (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10770316B2 (en) 2015-11-24 2020-09-08 Tokyo Electron Limited Substrate liquid processing apparatus, substrate liquid processing method and recording medium
JP6968547B2 (en) * 2016-03-30 2021-11-17 株式会社Screenホールディングス Board processing equipment, board processing method and program recording medium
KR102338647B1 (en) 2016-05-09 2021-12-13 가부시키가이샤 에바라 세이사꾸쇼 Substrate cleaning apparatus
JP2017204495A (en) * 2016-05-09 2017-11-16 株式会社荏原製作所 Substrate cleaning device
JP6710129B2 (en) 2016-09-02 2020-06-17 株式会社荏原製作所 Substrate cleaning apparatus and substrate cleaning method
JP7052280B2 (en) * 2016-11-29 2022-04-12 東京エレクトロン株式会社 Board processing equipment, board processing method and storage medium
JP6812262B2 (en) 2017-02-09 2021-01-13 株式会社Screenホールディングス Substrate processing equipment and substrate processing method
JP6882017B2 (en) * 2017-03-06 2021-06-02 株式会社荏原製作所 Polishing method, polishing equipment, and substrate processing system
JP6877221B2 (en) * 2017-04-05 2021-05-26 株式会社荏原製作所 Substrate cleaning equipment, substrate cleaning method and control method of substrate cleaning equipment
CN109127493A (en) * 2018-07-19 2019-01-04 安徽天裕汽车零部件制造有限公司 A kind of automobile metal parts machining cleaning device
CN110125059A (en) * 2019-05-29 2019-08-16 广东电网有限责任公司 A kind of automatic wiping porcelain device of radix saposhnikoviae porcelain insulator
JP7285166B2 (en) * 2019-08-20 2023-06-01 株式会社荏原製作所 SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING APPARATUS
KR102265857B1 (en) * 2019-09-04 2021-06-17 세메스 주식회사 Methods for treating a substrate and apparatus for treating a substrate
US20230023260A1 (en) * 2019-12-11 2023-01-26 Ebara Corporation Substrate cleaning system and substrate cleaning method
US11611442B1 (en) 2019-12-18 2023-03-21 Wells Fargo Bank, N.A. Systems and applications for semi-anonymous communication tagging
CN111463152B (en) * 2020-04-17 2023-03-14 重庆芯洁科技有限公司 High-pressure washing equipment for semiconductor substrate and using method thereof
CN115605981A (en) 2020-05-15 2023-01-13 株式会社荏原制作所(Jp) Cleaning device and cleaning method
CN112264362B (en) * 2020-09-29 2022-06-28 黑龙江省医院 Cleaning device for anaesthetic mask and operation method
JP7093390B2 (en) * 2020-10-15 2022-06-29 株式会社荏原製作所 Board cleaning equipment
JP2023028395A (en) * 2021-08-19 2023-03-03 株式会社荏原製作所 Substrate cleaning device, substrate cleaning method and substrate polishing device
US20230150084A1 (en) * 2021-11-18 2023-05-18 Sandisk Technologies Llc Wafer surface chemical distribution sensing system and methods for operating the same
US20230178388A1 (en) * 2021-12-03 2023-06-08 Applied Materials, Inc. Surface cleaning with directed high pressure chemistry
JP7471671B2 (en) 2022-04-12 2024-04-22 Aiメカテック株式会社 Substrate cleaning apparatus and substrate cleaning method

Family Cites Families (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4027686A (en) 1973-01-02 1977-06-07 Texas Instruments Incorporated Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water
JPS57112818A (en) 1980-09-30 1982-07-14 Eidai Co Ltd Constitutional material of furniture
JPH047766A (en) 1990-04-26 1992-01-13 Fujitsu Ltd Fault route canceling system
JP2640999B2 (en) * 1991-01-22 1997-08-13 大日本スクリーン製造株式会社 Rotary surface treatment method and rotary surface treatment apparatus for carrying out the method
JPH08150380A (en) * 1994-11-29 1996-06-11 M Setetsuku Kk Locking mechanism of substrate scrubber
JPH09148295A (en) * 1995-11-27 1997-06-06 Dainippon Screen Mfg Co Ltd Rotary substrate processor
JP3810499B2 (en) * 1996-11-29 2006-08-16 芝浦メカトロニクス株式会社 Spin cleaning method and apparatus
US6106635A (en) * 1997-03-06 2000-08-22 Ebara Corporation Washing method and washing apparatus
JPH1147665A (en) 1997-07-29 1999-02-23 Dainippon Screen Mfg Co Ltd Replacement mechanism of treating liquid and substrate treating device having this replacement mechanism
JPH11102885A (en) * 1997-09-29 1999-04-13 Dainippon Screen Mfg Co Ltd Substrate treatment device and method
JP2000084811A (en) 1998-09-16 2000-03-28 Tokyo Seimitsu Co Ltd Wafer chamfering device
JP3395696B2 (en) 1999-03-15 2003-04-14 日本電気株式会社 Wafer processing apparatus and wafer processing method
JP3990073B2 (en) * 1999-06-17 2007-10-10 株式会社荏原製作所 Substrate cleaning apparatus and substrate cleaning method
JP2001054765A (en) * 1999-08-19 2001-02-27 Dainippon Screen Mfg Co Ltd Substrate cleaning device
JP4519234B2 (en) * 2000-01-19 2010-08-04 野村マイクロ・サイエンス株式会社 Article surface cleaning method and cleaning apparatus therefor
JP4007766B2 (en) 2000-02-29 2007-11-14 東京エレクトロン株式会社 Liquid processing apparatus and liquid processing method
JP2002043267A (en) 2000-07-21 2002-02-08 Ebara Corp Substrate cleaning apparatus, method and substrate processing apparatus
JP2002151455A (en) 2000-08-31 2002-05-24 Super Silicon Kenkyusho:Kk Cleaning apparatus for semiconductor wafer
JP3808719B2 (en) * 2001-04-17 2006-08-16 大日本スクリーン製造株式会社 Substrate processing equipment
US6684890B2 (en) 2001-07-16 2004-02-03 Verteq, Inc. Megasonic cleaner probe system with gasified fluid
JP3725809B2 (en) 2001-09-19 2005-12-14 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
JP3779582B2 (en) 2001-09-28 2006-05-31 大日本スクリーン製造株式会社 Substrate peripheral processing apparatus and substrate peripheral processing method
TW561516B (en) 2001-11-01 2003-11-11 Tokyo Electron Ltd Substrate processing apparatus and substrate processing method
JP3834542B2 (en) * 2001-11-01 2006-10-18 東京エレクトロン株式会社 Substrate cleaning apparatus and substrate cleaning method
KR100445259B1 (en) 2001-11-27 2004-08-21 삼성전자주식회사 Cleaning method and cleaning apparatus for performing the same
JP4349606B2 (en) 2002-03-25 2009-10-21 大日本スクリーン製造株式会社 Substrate cleaning method
US20030192570A1 (en) 2002-04-11 2003-10-16 Applied Materials, Inc. Method and apparatus for wafer cleaning
JP2004335671A (en) * 2003-05-07 2004-11-25 Renesas Technology Corp Washing method of single wafer processing two-fluid washing station and semiconductor device
JP2005032948A (en) 2003-07-11 2005-02-03 Sansha Electric Mfg Co Ltd Method for cleaning semiconductor wafer and cleaning device
JP2005183937A (en) 2003-11-25 2005-07-07 Nec Electronics Corp Manufacturing method of semiconductor device and cleaning device for removing resist
JP2005223149A (en) 2004-02-05 2005-08-18 Fuji Electric Holdings Co Ltd Wiping/cleaning unit, unit and method for inspecting smudge
JP4318561B2 (en) 2004-02-09 2009-08-26 Hoya株式会社 Photomask blank manufacturing method and photomask manufacturing method
US7803230B2 (en) 2004-04-06 2010-09-28 Tokyo Electron Limited Substrate cleaning apparatus, substrate cleaning method, and medium for recording program used for the method
KR100753463B1 (en) 2004-04-23 2007-08-31 동경 엘렉트론 주식회사 Substrate cleaning method, substrate cleaning equipment, and program recording medium
JP2005327807A (en) 2004-05-12 2005-11-24 Sony Corp Sheet type washing apparatus and its washing method
JP2007088398A (en) 2004-12-14 2007-04-05 Realize Advanced Technology Ltd Cleaning device, cleaning system using the cleaning device, and method of cleaning substrate to be cleaned
JP4502854B2 (en) 2005-03-22 2010-07-14 株式会社高田工業所 Substrate processing apparatus and processing method
JP2006278957A (en) 2005-03-30 2006-10-12 Dainippon Screen Mfg Co Ltd Apparatus and method for substrate processing
US9287158B2 (en) * 2005-04-19 2016-03-15 Ebara Corporation Substrate processing apparatus
JP4734063B2 (en) 2005-08-30 2011-07-27 東京エレクトロン株式会社 Substrate cleaning apparatus and substrate cleaning method.
JP2007173277A (en) 2005-12-19 2007-07-05 Fujitsu Ltd Spin cleaning device and wafer cleaning method
JP2007194367A (en) * 2006-01-18 2007-08-02 Tokyo Seimitsu Co Ltd Washing apparatus, and dicing equipment provided therewith
JP2007273608A (en) 2006-03-30 2007-10-18 Dainippon Screen Mfg Co Ltd Substrate-treating apparatus and substrate treatment method
JP2008016660A (en) 2006-07-06 2008-01-24 Dainippon Screen Mfg Co Ltd Method for treating substrate and substrate treating apparatus
KR20080012626A (en) 2006-08-04 2008-02-12 삼성전자주식회사 Liquid diffusing nozzle and liquid diffusing device having the same
CN100518948C (en) * 2006-10-13 2009-07-29 大日本网目版制造株式会社 Nozzle and substrate processing unit having the same
JP4989370B2 (en) 2006-10-13 2012-08-01 大日本スクリーン製造株式会社 Nozzle and substrate processing apparatus having the same
JP2008153322A (en) * 2006-12-15 2008-07-03 Dainippon Screen Mfg Co Ltd Two-fluid nozzle, substrate processor, and method for processing substrates
JP4983565B2 (en) * 2006-12-20 2012-07-25 東京エレクトロン株式会社 Substrate cleaning apparatus, substrate cleaning method, and storage medium
JP2008183532A (en) * 2007-01-31 2008-08-14 Dainippon Screen Mfg Co Ltd Substrate processing apparatus and substrate processing method
JP2008311481A (en) 2007-06-15 2008-12-25 Sony Corp Substrate cleaning method, substrate cleaning device, and semiconductor manufacturing method
JP5009253B2 (en) * 2008-08-07 2012-08-22 東京エレクトロン株式会社 Substrate cleaning device
KR101004435B1 (en) 2008-11-28 2010-12-28 세메스 주식회사 Substrate polishing apparatus and method of polishing substrate using the same
JP5650896B2 (en) 2009-09-03 2015-01-07 芝浦メカトロニクス株式会社 Substrate processing apparatus and substrate processing method
JP5405955B2 (en) 2009-09-18 2014-02-05 大日本スクリーン製造株式会社 Substrate processing equipment
US8458842B2 (en) 2011-05-10 2013-06-11 Nanya Technology Corp. Post-CMP wafer cleaning apparatus
JP5732376B2 (en) 2011-06-21 2015-06-10 東京エレクトロン株式会社 Two-fluid nozzle, substrate liquid processing apparatus, and substrate liquid processing method
CN202275804U (en) 2011-06-29 2012-06-13 彩虹(佛山)平板显示有限公司 Rinsing bath spray nozzle of wet etching machine for manufacturing liquid crystal and organic light emitting diode (OLED) panels
CN102319686B (en) 2011-08-26 2015-04-08 上海华虹宏力半导体制造有限公司 Wafer cleaning device and wafer cleaning method
US9385020B2 (en) 2011-12-19 2016-07-05 SCREEN Holdings Co., Ltd. Substrate holding and rotating device, substrate treatment apparatus including the device, and substrate treatment method
JP5940824B2 (en) 2012-02-07 2016-06-29 株式会社荏原製作所 Substrate cleaning method
KR101344921B1 (en) * 2012-03-28 2013-12-27 세메스 주식회사 Apparatus and Method for treating substrate
JP5886224B2 (en) 2012-05-23 2016-03-16 株式会社荏原製作所 Substrate cleaning method
JP5586734B2 (en) 2012-08-07 2014-09-10 東京エレクトロン株式会社 Substrate cleaning apparatus, substrate cleaning system, substrate cleaning method, and storage medium
JP6093569B2 (en) 2012-12-28 2017-03-08 株式会社荏原製作所 Substrate cleaning device
CN103687265B (en) 2013-11-22 2017-01-04 大连日佳电子有限公司 Method and device for removing static electricity and dust on surface of substrate

Also Published As

Publication number Publication date
KR102513280B1 (en) 2023-03-24
JP2022003705A (en) 2022-01-11
KR102450849B1 (en) 2022-10-06
US20190080933A1 (en) 2019-03-14
TWI709440B (en) 2020-11-11
JP6831360B2 (en) 2021-02-17
TWI666068B (en) 2019-07-21
US20210272820A1 (en) 2021-09-02
TW201540381A (en) 2015-11-01
CN109647769B (en) 2022-02-11
TW201945090A (en) 2019-12-01
JP6964745B2 (en) 2021-11-10
US11164758B2 (en) 2021-11-02
KR20150114428A (en) 2015-10-12
JP2015201627A (en) 2015-11-12
JP7241844B2 (en) 2023-03-17
KR20220137855A (en) 2022-10-12
JP2021016007A (en) 2021-02-12
CN109647769A (en) 2019-04-19
US10170344B2 (en) 2019-01-01
US11837477B2 (en) 2023-12-05
JP6600470B2 (en) 2019-10-30
US20150348806A1 (en) 2015-12-03
KR20210127668A (en) 2021-10-22
SG10201901404XA (en) 2019-03-28
JP2019041116A (en) 2019-03-14
KR102314682B1 (en) 2021-10-20

Similar Documents

Publication Publication Date Title
ZA201904259B (en) Device and method
SG10201502035RA (en) Washing device and washing method
ZA201702900B (en) Device and method
PT3140042T (en) Cleaning device and method
SG10201502022QA (en) Polishing device and polishing method
IL250119A0 (en) Purging device and method
GB201403692D0 (en) Mechanotherapeutic device and measurment method
PL3171785T3 (en) Shielding device and method
HK1219816A1 (en) Communication device and communication method
GB201417185D0 (en) Apparatus and methods
GB201709215D0 (en) Evaluation device and evaluation method
GB201410431D0 (en) Ejector device and method
SG11201703396YA (en) Polishing device and polishing method
ZA201702133B (en) Test device and method
IL247418B (en) Inkjet-head cleaning device and method
HK1209605A1 (en) Washing device
EP3113181C0 (en) Decoding device and decoding method
SG11201610066TA (en) Chemical washing method and chemical washing device
GB2525625B (en) Device and method
SG11201701644XA (en) Drawing device and drawing method
IL235083B (en) Liquid-atomization method and device
GB201416790D0 (en) Device and method
HK1220676A1 (en) Arrangement and method
GB201519443D0 (en) Device and method
PL3102530T3 (en) Attachment device and method