SG10201502035RA - Washing device and washing method - Google Patents
Washing device and washing methodInfo
- Publication number
- SG10201502035RA SG10201502035RA SG10201502035RA SG10201502035RA SG10201502035RA SG 10201502035R A SG10201502035R A SG 10201502035RA SG 10201502035R A SG10201502035R A SG 10201502035RA SG 10201502035R A SG10201502035R A SG 10201502035RA SG 10201502035R A SG10201502035R A SG 10201502035RA
- Authority
- SG
- Singapore
- Prior art keywords
- washing
- washing device
- washing method
- Prior art date
Links
- 238000005406 washing Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B08B1/143—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014075712 | 2014-04-01 | ||
JP2015042868A JP6600470B2 (en) | 2014-04-01 | 2015-03-04 | Cleaning device and cleaning method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201502035RA true SG10201502035RA (en) | 2015-11-27 |
Family
ID=54552613
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201502035RA SG10201502035RA (en) | 2014-04-01 | 2015-03-17 | Washing device and washing method |
SG10201901404XA SG10201901404XA (en) | 2014-04-01 | 2015-03-17 | Washing device and washing method |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201901404XA SG10201901404XA (en) | 2014-04-01 | 2015-03-17 | Washing device and washing method |
Country Status (6)
Country | Link |
---|---|
US (3) | US10170344B2 (en) |
JP (4) | JP6600470B2 (en) |
KR (3) | KR102314682B1 (en) |
CN (1) | CN109647769B (en) |
SG (2) | SG10201502035RA (en) |
TW (2) | TWI666068B (en) |
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US10770316B2 (en) | 2015-11-24 | 2020-09-08 | Tokyo Electron Limited | Substrate liquid processing apparatus, substrate liquid processing method and recording medium |
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KR102338647B1 (en) | 2016-05-09 | 2021-12-13 | 가부시키가이샤 에바라 세이사꾸쇼 | Substrate cleaning apparatus |
JP2017204495A (en) * | 2016-05-09 | 2017-11-16 | 株式会社荏原製作所 | Substrate cleaning device |
JP6710129B2 (en) | 2016-09-02 | 2020-06-17 | 株式会社荏原製作所 | Substrate cleaning apparatus and substrate cleaning method |
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JP6812262B2 (en) | 2017-02-09 | 2021-01-13 | 株式会社Screenホールディングス | Substrate processing equipment and substrate processing method |
JP6882017B2 (en) * | 2017-03-06 | 2021-06-02 | 株式会社荏原製作所 | Polishing method, polishing equipment, and substrate processing system |
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CN111463152B (en) * | 2020-04-17 | 2023-03-14 | 重庆芯洁科技有限公司 | High-pressure washing equipment for semiconductor substrate and using method thereof |
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JP7093390B2 (en) * | 2020-10-15 | 2022-06-29 | 株式会社荏原製作所 | Board cleaning equipment |
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US20230150084A1 (en) * | 2021-11-18 | 2023-05-18 | Sandisk Technologies Llc | Wafer surface chemical distribution sensing system and methods for operating the same |
US20230178388A1 (en) * | 2021-12-03 | 2023-06-08 | Applied Materials, Inc. | Surface cleaning with directed high pressure chemistry |
JP7471671B2 (en) | 2022-04-12 | 2024-04-22 | Aiメカテック株式会社 | Substrate cleaning apparatus and substrate cleaning method |
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-
2015
- 2015-03-04 JP JP2015042868A patent/JP6600470B2/en active Active
- 2015-03-17 SG SG10201502035RA patent/SG10201502035RA/en unknown
- 2015-03-17 SG SG10201901404XA patent/SG10201901404XA/en unknown
- 2015-03-31 TW TW104110403A patent/TWI666068B/en active
- 2015-03-31 KR KR1020150045204A patent/KR102314682B1/en active IP Right Grant
- 2015-03-31 TW TW108119842A patent/TWI709440B/en active
- 2015-03-31 US US14/675,567 patent/US10170344B2/en active Active
- 2015-04-01 CN CN201811309797.8A patent/CN109647769B/en active Active
-
2018
- 2018-11-01 JP JP2018206420A patent/JP6831360B2/en active Active
- 2018-11-13 US US16/189,896 patent/US11164758B2/en active Active
-
2020
- 2020-11-19 JP JP2020192856A patent/JP6964745B2/en active Active
-
2021
- 2021-05-19 US US17/325,037 patent/US11837477B2/en active Active
- 2021-10-13 KR KR1020210135505A patent/KR102450849B1/en active IP Right Grant
- 2021-10-19 JP JP2021170814A patent/JP7241844B2/en active Active
-
2022
- 2022-09-29 KR KR1020220123928A patent/KR102513280B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR102513280B1 (en) | 2023-03-24 |
JP2022003705A (en) | 2022-01-11 |
KR102450849B1 (en) | 2022-10-06 |
US20190080933A1 (en) | 2019-03-14 |
TWI709440B (en) | 2020-11-11 |
JP6831360B2 (en) | 2021-02-17 |
TWI666068B (en) | 2019-07-21 |
US20210272820A1 (en) | 2021-09-02 |
TW201540381A (en) | 2015-11-01 |
CN109647769B (en) | 2022-02-11 |
TW201945090A (en) | 2019-12-01 |
JP6964745B2 (en) | 2021-11-10 |
US11164758B2 (en) | 2021-11-02 |
KR20150114428A (en) | 2015-10-12 |
JP2015201627A (en) | 2015-11-12 |
JP7241844B2 (en) | 2023-03-17 |
KR20220137855A (en) | 2022-10-12 |
JP2021016007A (en) | 2021-02-12 |
CN109647769A (en) | 2019-04-19 |
US10170344B2 (en) | 2019-01-01 |
US11837477B2 (en) | 2023-12-05 |
JP6600470B2 (en) | 2019-10-30 |
US20150348806A1 (en) | 2015-12-03 |
KR20210127668A (en) | 2021-10-22 |
SG10201901404XA (en) | 2019-03-28 |
JP2019041116A (en) | 2019-03-14 |
KR102314682B1 (en) | 2021-10-20 |
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