SG10201501301TA - Package On Package Thermal Forcing Device - Google Patents

Package On Package Thermal Forcing Device

Info

Publication number
SG10201501301TA
SG10201501301TA SG10201501301TA SG10201501301TA SG10201501301TA SG 10201501301T A SG10201501301T A SG 10201501301TA SG 10201501301T A SG10201501301T A SG 10201501301TA SG 10201501301T A SG10201501301T A SG 10201501301TA SG 10201501301T A SG10201501301T A SG 10201501301TA
Authority
SG
Singapore
Prior art keywords
package
forcing device
thermal forcing
thermal
package thermal
Prior art date
Application number
SG10201501301TA
Inventor
A Davis Rick
Lopez Christopher
Original Assignee
Sensata Tech Massachusetts Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sensata Tech Massachusetts Inc filed Critical Sensata Tech Massachusetts Inc
Publication of SG10201501301TA publication Critical patent/SG10201501301TA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2817—Environmental-, stress-, or burn-in tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Tests Of Electronic Circuits (AREA)
SG10201501301TA 2014-02-21 2015-02-23 Package On Package Thermal Forcing Device SG10201501301TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/186,733 US9594113B2 (en) 2014-02-21 2014-02-21 Package on package thermal forcing device

Publications (1)

Publication Number Publication Date
SG10201501301TA true SG10201501301TA (en) 2015-09-29

Family

ID=53881972

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201501301TA SG10201501301TA (en) 2014-02-21 2015-02-23 Package On Package Thermal Forcing Device

Country Status (6)

Country Link
US (1) US9594113B2 (en)
JP (1) JP6343571B2 (en)
KR (1) KR102161329B1 (en)
CN (1) CN104865414B (en)
SG (1) SG10201501301TA (en)
TW (1) TW201543638A (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2273279A1 (en) 2005-04-27 2011-01-12 Aehr Test Systems, Inc. Apparatus for testing electronic devices
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
US20140361800A1 (en) * 2013-06-05 2014-12-11 Qualcomm Incorporated Method and apparatus for high volume system level testing of logic devices with pop memory
US9921265B2 (en) 2015-12-18 2018-03-20 Sensata Technologies, Inc. Thermal clutch for thermal control unit and methods related thereto
JP6744173B2 (en) * 2016-08-09 2020-08-19 株式会社エンプラス Socket for electrical parts
KR20230021177A (en) 2017-03-03 2023-02-13 에어 테스트 시스템즈 Electronics tester
TWD191423S (en) 2017-09-19 2018-07-01 日商阿德潘鐵斯特股份有限公司 Part of the pusher for the electronic component test device
US11493551B2 (en) 2020-06-22 2022-11-08 Advantest Test Solutions, Inc. Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
US11549981B2 (en) 2020-10-01 2023-01-10 Advantest Test Solutions, Inc. Thermal solution for massively parallel testing
US11808812B2 (en) 2020-11-02 2023-11-07 Advantest Test Solutions, Inc. Passive carrier-based device delivery for slot-based high-volume semiconductor test system
US11821913B2 (en) 2020-11-02 2023-11-21 Advantest Test Solutions, Inc. Shielded socket and carrier for high-volume test of semiconductor devices
US20220155364A1 (en) 2020-11-19 2022-05-19 Advantest Test Solutions, Inc. Wafer scale active thermal interposer for device testing
US11609266B2 (en) 2020-12-04 2023-03-21 Advantest Test Solutions, Inc. Active thermal interposer device
US11573262B2 (en) 2020-12-31 2023-02-07 Advantest Test Solutions, Inc. Multi-input multi-zone thermal control for device testing
US11587640B2 (en) 2021-03-08 2023-02-21 Advantest Test Solutions, Inc. Carrier based high volume system level testing of devices with pop structures
US20230083634A1 (en) * 2021-09-14 2023-03-16 Advantest Test Solutions, Inc. Parallel test cell with self actuated sockets
US11656273B1 (en) 2021-11-05 2023-05-23 Advantest Test Solutions, Inc. High current device testing apparatus and systems

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6483328B1 (en) * 1995-11-09 2002-11-19 Formfactor, Inc. Probe card for probing wafers with raised contact elements
US6636062B2 (en) * 2001-04-10 2003-10-21 Delta Design, Inc. Temperature control device for an electronic component
JP2007183164A (en) * 2006-01-06 2007-07-19 Fujitsu Ltd Semiconductor integrated circuit device and its test method
CN201218816Y (en) * 2008-06-04 2009-04-08 英业达股份有限公司 Heat source apparatus similar to chip
US7888951B2 (en) * 2009-02-10 2011-02-15 Qualitau, Inc. Integrated unit for electrical/reliability testing with improved thermal control
WO2012046338A1 (en) * 2010-10-08 2012-04-12 富士通株式会社 Semiconductor package, cooling mechanism, and a method for manufacturing semiconductor package
JP5740903B2 (en) * 2010-10-19 2015-07-01 富士通株式会社 Electronic device, semiconductor device, thermal interposer, and manufacturing method thereof
US9609693B2 (en) * 2012-04-26 2017-03-28 Nxp Usa, Inc. Heating system and method of testing a semiconductor device using a heating system
CN202904406U (en) * 2012-10-18 2013-04-24 宜硕科技(上海)有限公司 Temperature control device used for chip testing
US9341671B2 (en) * 2013-03-14 2016-05-17 Taiwan Semiconductor Manufacturing Company, Ltd. Testing holders for chip unit and die package

Also Published As

Publication number Publication date
CN104865414A (en) 2015-08-26
KR20150099468A (en) 2015-08-31
JP6343571B2 (en) 2018-06-13
JP2015158493A (en) 2015-09-03
KR102161329B1 (en) 2020-09-29
TW201543638A (en) 2015-11-16
US9594113B2 (en) 2017-03-14
US20150241478A1 (en) 2015-08-27
CN104865414B (en) 2018-08-31

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