SG10201404086XA - Substrate cleaning device, substrate cleaning apparatus, method for manufacturing cleaned substrate and substrate processing apparatus - Google Patents
Substrate cleaning device, substrate cleaning apparatus, method for manufacturing cleaned substrate and substrate processing apparatusInfo
- Publication number
- SG10201404086XA SG10201404086XA SG10201404086XA SG10201404086XA SG10201404086XA SG 10201404086X A SG10201404086X A SG 10201404086XA SG 10201404086X A SG10201404086X A SG 10201404086XA SG 10201404086X A SG10201404086X A SG 10201404086XA SG 10201404086X A SG10201404086X A SG 10201404086XA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- substrate cleaning
- processing apparatus
- cleaning device
- manufacturing
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 4
- 238000004140 cleaning Methods 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
- B08B1/52—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013150506A JP6345393B2 (en) | 2013-07-19 | 2013-07-19 | Substrate cleaning apparatus and substrate cleaning method |
| JP2013199471A JP6224974B2 (en) | 2013-09-26 | 2013-09-26 | Substrate cleaning machine, substrate cleaning apparatus, manufacturing method of cleaned substrate, and substrate processing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201404086XA true SG10201404086XA (en) | 2015-02-27 |
Family
ID=52319601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201404086XA SG10201404086XA (en) | 2013-07-19 | 2014-07-15 | Substrate cleaning device, substrate cleaning apparatus, method for manufacturing cleaned substrate and substrate processing apparatus |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US10032655B2 (en) |
| KR (1) | KR102211040B1 (en) |
| CN (2) | CN104299930B (en) |
| SG (1) | SG10201404086XA (en) |
| TW (1) | TWI628710B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10504753B2 (en) * | 2013-12-13 | 2019-12-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method |
| WO2017154673A1 (en) | 2016-03-08 | 2017-09-14 | 株式会社荏原製作所 | Substrate cleaning device, substrate cleaning method, substrate processing device, and substrate drying device |
| JP6968547B2 (en) * | 2016-03-30 | 2021-11-17 | 株式会社Ｓｃｒｅｅｎホールディングス | Board processing equipment, board processing method and program recording medium |
| JP6956578B2 (en) | 2017-09-19 | 2021-11-02 | 株式会社荏原製作所 | Break-in device and break-in system |
| CN107971261B (en) * | 2017-11-23 | 2021-03-02 | Tcl华星光电技术有限公司 | Cleaning device |
| US11929268B2 (en) * | 2018-02-05 | 2024-03-12 | Tokyo Electron Limited | Substrate processing system, substrate processing method and computer-readable recording medium |
| US11342202B2 (en) * | 2018-08-17 | 2022-05-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Automated wafer cleaning |
| US11791173B2 (en) | 2019-03-21 | 2023-10-17 | Samsung Electronics Co., Ltd. | Substrate cleaning equipment, substrate treatment system including the same, and method of fabricating semiconductor device using the substrate cleaning equipment |
| JP7308074B2 (en) * | 2019-05-14 | 2023-07-13 | 東京エレクトロン株式会社 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
| CN216542663U (en) * | 2021-09-07 | 2022-05-17 | 杭州众硅电子科技有限公司 | Wafer polishing system |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3114156B2 (en) | 1994-06-28 | 2000-12-04 | 株式会社荏原製作所 | Cleaning method and apparatus |
| US5647083A (en) | 1994-06-30 | 1997-07-15 | Dainippon Screen Mfg. Co., Ltd. | Apparatus for cleaning substrates and methods for attaching/detaching and cleaning brushes of such apparatus |
| JP2848783B2 (en) | 1994-07-04 | 1999-01-20 | 大日本スクリーン製造株式会社 | Brush cleaning equipment |
| US5693148A (en) * | 1995-11-08 | 1997-12-02 | Ontrak Systems, Incorporated | Process for brush cleaning |
| TW353784B (en) * | 1996-11-19 | 1999-03-01 | Tokyo Electron Ltd | Apparatus and method for washing substrate |
| JPH10323631A (en) | 1997-05-23 | 1998-12-08 | Ebara Corp | Device for self-cleaning cleaning member |
| KR100354456B1 (en) * | 1999-10-27 | 2002-09-30 | 주식회사 기가트론 | An wet-rinsing and drying apparatus and the method thereof |
| US6616509B1 (en) * | 2000-03-31 | 2003-09-09 | Lam Research Corporation | Method for performing two wafer preparation operations on vertically oriented semiconductor wafer in single enclosure |
| JP2002043267A (en) * | 2000-07-21 | 2002-02-08 | Ebara Corp | Substrate cleaning apparatus, method and substrate processing apparatus |
| JP4079205B2 (en) * | 2000-08-29 | 2008-04-23 | 東京エレクトロン株式会社 | Substrate cleaning apparatus and substrate cleaning method |
| JP4283068B2 (en) | 2003-08-29 | 2009-06-24 | 株式会社荏原製作所 | Method for initializing cleaning member of substrate cleaning apparatus, substrate cleaning apparatus, substrate polishing and cleaning system |
| WO2005098919A1 (en) * | 2004-04-06 | 2005-10-20 | Tokyo Electron Limited | Board cleaning apparatus, board cleaning method, and medium with recorded program to be used for the method |
| US8608858B2 (en) * | 2004-09-28 | 2013-12-17 | Ebara Corporation | Substrate cleaning apparatus and method for determining timing of replacement of cleaning member |
| JP2006319279A (en) | 2005-05-16 | 2006-11-24 | Seiko Epson Corp | Apparatus and method for cleaning substrate |
| JP2007052300A (en) * | 2005-08-19 | 2007-03-01 | Pre-Tech Co Ltd | Cleaning device for mask substrate, and cleaning method for mask substrate using the same |
| JP2007273608A (en) * | 2006-03-30 | 2007-10-18 | Dainippon Screen Mfg Co Ltd | Substrate-treating apparatus and substrate treatment method |
| JP2008060299A (en) * | 2006-08-31 | 2008-03-13 | Dainippon Screen Mfg Co Ltd | Substrate treating device and method |
| JP5385537B2 (en) | 2008-02-26 | 2014-01-08 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP2013069776A (en) | 2011-09-21 | 2013-04-18 | Tokyo Electron Ltd | Substrate cleaning device, substrate cleaning method, and recording medium in which computer program for executing substrate cleaning method is recorded |
-
2014
- 2014-07-15 SG SG10201404086XA patent/SG10201404086XA/en unknown
- 2014-07-16 TW TW103124359A patent/TWI628710B/en not_active IP Right Cessation
- 2014-07-17 US US14/334,394 patent/US10032655B2/en not_active Expired - Fee Related
- 2014-07-18 CN CN201410345524.4A patent/CN104299930B/en not_active Expired - Fee Related
- 2014-07-18 CN CN201810258200.5A patent/CN108493134B/en active Active
- 2014-07-18 KR KR1020140091278A patent/KR102211040B1/en active IP Right Grant
-
2018
- 2018-06-26 US US16/019,415 patent/US10879086B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN104299930B (en) | 2018-09-25 |
| US10879086B2 (en) | 2020-12-29 |
| CN108493134B (en) | 2022-03-29 |
| KR20150010659A (en) | 2015-01-28 |
| TWI628710B (en) | 2018-07-01 |
| KR102211040B1 (en) | 2021-02-02 |
| CN108493134A (en) | 2018-09-04 |
| TW201513205A (en) | 2015-04-01 |
| US10032655B2 (en) | 2018-07-24 |
| US20150020851A1 (en) | 2015-01-22 |
| US20180308716A1 (en) | 2018-10-25 |
| CN104299930A (en) | 2015-01-21 |
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