SG10201403133SA - Processing facility - Google Patents

Processing facility

Info

Publication number
SG10201403133SA
SG10201403133SA SG10201403133SA SG10201403133SA SG10201403133SA SG 10201403133S A SG10201403133S A SG 10201403133SA SG 10201403133S A SG10201403133S A SG 10201403133SA SG 10201403133S A SG10201403133S A SG 10201403133SA SG 10201403133S A SG10201403133S A SG 10201403133SA
Authority
SG
Singapore
Prior art keywords
contact surface
processing facility
side contact
container
hole
Prior art date
Application number
SG10201403133SA
Inventor
Otsuka Hiroshi
Kawamura Shinsuke
Yoshimoto Tadahiro
Original Assignee
Daifuku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daifuku Kk filed Critical Daifuku Kk
Publication of SG10201403133SA publication Critical patent/SG10201403133SA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

22 TITLE OF THE INVENTION: PROCESSING FACILITY Abstract A processing facility is disclosed in which a container side contact surface and a support side contact surface are in contact with each other and a 5 supply hole or a discharge hole, and a communicating hole are allowed to communicate with each other when a container is supported by a container support, and in which the container side contact surface is formed to be flat at least in a periphery of the communicating hole, and the support side contact surface is formed to have a shape that is gradually lower as a distance 10 increases from the supply hole or the discharge hole. Fig. 7
SG10201403133SA 2013-06-26 2014-06-11 Processing facility SG10201403133SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013134264A JP5888287B2 (en) 2013-06-26 2013-06-26 Processing equipment

Publications (1)

Publication Number Publication Date
SG10201403133SA true SG10201403133SA (en) 2015-01-29

Family

ID=52114442

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201403133SA SG10201403133SA (en) 2013-06-26 2014-06-11 Processing facility

Country Status (6)

Country Link
US (1) US9520311B2 (en)
JP (1) JP5888287B2 (en)
KR (1) KR102236231B1 (en)
CN (1) CN104253069B (en)
SG (1) SG10201403133SA (en)
TW (1) TWI630677B (en)

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KR101418812B1 (en) * 2012-10-31 2014-07-16 크린팩토메이션 주식회사 Apparatus for stocking and purging wafer at ceiling
US9257320B2 (en) * 2013-06-05 2016-02-09 GlobalFoundries, Inc. Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication
JP6160520B2 (en) * 2014-03-11 2017-07-12 株式会社ダイフク Maintenance equipment for ladders and storage shelves equipped with them
US9550219B2 (en) * 2014-12-29 2017-01-24 Daifuku Co., Ltd. Apparatus of inhalation type for stocking wafer at ceiling and inhaling type wafer stocking system having the same
JP6414525B2 (en) * 2015-09-02 2018-10-31 株式会社ダイフク Storage facilities
JP6455404B2 (en) * 2015-11-17 2019-01-23 株式会社ダイフク Container transfer equipment
JP6460015B2 (en) * 2016-03-07 2019-01-30 株式会社ダイフク Container transfer equipment
JP6623988B2 (en) * 2016-09-09 2019-12-25 株式会社ダイフク Container storage equipment
CN109983568B (en) * 2017-02-20 2023-02-28 村田机械株式会社 Blowing stocker
KR20200022682A (en) * 2018-08-23 2020-03-04 세메스 주식회사 Buffer unit, Apparatus and Method for treating substrate with the unit

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US5810062A (en) * 1996-07-12 1998-09-22 Asyst Technologies, Inc. Two stage valve for charging and/or vacuum relief of pods
US5879458A (en) * 1996-09-13 1999-03-09 Semifab Incorporated Molecular contamination control system
JP3167970B2 (en) * 1997-10-13 2001-05-21 ティーディーケイ株式会社 Clean box, clean transfer method and device
US6164664A (en) * 1998-03-27 2000-12-26 Asyst Technologies, Inc. Kinematic coupling compatible passive interface seal
US5988233A (en) * 1998-03-27 1999-11-23 Asyst Technologies, Inc. Evacuation-driven SMIF pod purge system
US6364152B1 (en) * 2000-04-12 2002-04-02 Dart Industries Inc. Food storage container
US6742532B2 (en) * 2002-01-09 2004-06-01 Taiwan Semiconductor Manufacturing Co., Ltd. Cleaning container and method for cleaning LP furnace thermocouple sleeves
DE60335392D1 (en) * 2002-09-11 2011-01-27 Shinetsu Polymer Co SUBSTRATE STORAGE CONTAINER
US20040237244A1 (en) * 2003-05-26 2004-12-02 Tdk Corporation Purge system for product container and interface seal used in the system
JP2004345715A (en) 2003-05-26 2004-12-09 Tdk Corp Purge system for product storing container
JP4558594B2 (en) * 2005-06-24 2010-10-06 近藤工業株式会社 Breath filter device with shutter, shutter push-up rod used in the device, and nozzle with shutter push-up rod
CN101321674B (en) * 2005-09-27 2010-10-13 诚实公司 Reticle pod
US7422107B2 (en) * 2006-01-25 2008-09-09 Entegris, Inc. Kinematic coupling with textured contact surfaces
US8057151B2 (en) * 2006-04-11 2011-11-15 Hirata Corporation Foup door positioning device for foup opener
US8146623B2 (en) * 2007-02-28 2012-04-03 Entegris, Inc. Purge system for a substrate container
US7631912B2 (en) * 2007-07-31 2009-12-15 Evergreen Packaging Inc. Lifting device for a vacuum transfer system
TWM341303U (en) * 2008-04-25 2008-09-21 Santa Phoenix Technology Inc Gas filling device for wafer storage box
JP2010041015A (en) 2008-08-05 2010-02-18 Kondo Kogyo Kk Storage shelf for semiconductor wafer housing container
JP5155848B2 (en) 2008-12-18 2013-03-06 日本ケンブリッジフィルター株式会社 N2 purge device for FOUP
KR101660241B1 (en) * 2009-01-11 2016-09-27 어플라이드 머티어리얼스, 인코포레이티드 Systems, apparatus and methods for moving substrates
JP5236518B2 (en) * 2009-02-03 2013-07-17 株式会社ダン・タクマ Storage system and storage method
JP5557291B2 (en) * 2009-03-10 2014-07-23 株式会社ブリヂストン Sealing material
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JP5440871B2 (en) * 2010-08-20 2014-03-12 株式会社ダイフク Container storage equipment
JP5887719B2 (en) * 2011-05-31 2016-03-16 シンフォニアテクノロジー株式会社 Purge device, load port, bottom purge nozzle body, bottom purge unit
JP6131534B2 (en) * 2012-06-11 2017-05-24 シンフォニアテクノロジー株式会社 Purge nozzle unit, load port, mounting table, stocker
US20140041755A1 (en) * 2012-08-09 2014-02-13 Santa Phoenix Technology Inc. Wafer pod gas charging apparatus

Also Published As

Publication number Publication date
TWI630677B (en) 2018-07-21
KR20150001625A (en) 2015-01-06
TW201511167A (en) 2015-03-16
US9520311B2 (en) 2016-12-13
KR102236231B1 (en) 2021-04-02
JP5888287B2 (en) 2016-03-16
CN104253069A (en) 2014-12-31
US20150000789A1 (en) 2015-01-01
JP2015012039A (en) 2015-01-19
CN104253069B (en) 2018-09-04

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