SG10201402681QA - Methods of inspecting a 3d object using 2d image processing - Google Patents

Methods of inspecting a 3d object using 2d image processing

Info

Publication number
SG10201402681QA
SG10201402681QA SG10201402681QA SG10201402681QA SG10201402681QA SG 10201402681Q A SG10201402681Q A SG 10201402681QA SG 10201402681Q A SG10201402681Q A SG 10201402681QA SG 10201402681Q A SG10201402681Q A SG 10201402681QA SG 10201402681Q A SG10201402681Q A SG 10201402681QA
Authority
SG
Singapore
Prior art keywords
inspecting
methods
image processing
image
processing
Prior art date
Application number
SG10201402681QA
Inventor
Kok Weng Wong
Archwamety Albert
Han Cheng Ge
Ruini Cao
Original Assignee
Generic Power Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Generic Power Pte Ltd filed Critical Generic Power Pte Ltd
Priority to SG10201402681QA priority Critical patent/SG10201402681QA/en
Priority to MYPI2016001978A priority patent/MY187569A/en
Priority to US15/115,295 priority patent/US10151580B2/en
Priority to PCT/SG2015/050087 priority patent/WO2015183196A1/en
Priority to CN201580003504.1A priority patent/CN105960569B/en
Priority to TW104116079A priority patent/TWI635252B/en
Publication of SG10201402681QA publication Critical patent/SG10201402681QA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/50—Depth or shape recovery
    • G06T7/521—Depth or shape recovery from laser ranging, e.g. using interferometry; from the projection of structured light
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H04N7/183—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast for receiving images from a single remote source
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
SG10201402681QA 2014-05-27 2014-05-27 Methods of inspecting a 3d object using 2d image processing SG10201402681QA (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
SG10201402681QA SG10201402681QA (en) 2014-05-27 2014-05-27 Methods of inspecting a 3d object using 2d image processing
MYPI2016001978A MY187569A (en) 2014-05-27 2015-04-29 Methods of inspecting a 3d object using 2d image processing
US15/115,295 US10151580B2 (en) 2014-05-27 2015-04-29 Methods of inspecting a 3D object using 2D image processing
PCT/SG2015/050087 WO2015183196A1 (en) 2014-05-27 2015-04-29 Methods of inspecting a 3d object using 2d image processing
CN201580003504.1A CN105960569B (en) 2014-05-27 2015-04-29 The method of three-dimension object is checked using two dimensional image processing
TW104116079A TWI635252B (en) 2014-05-27 2015-05-20 Methods and system for inspecting a 3d object using 2d image processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG10201402681QA SG10201402681QA (en) 2014-05-27 2014-05-27 Methods of inspecting a 3d object using 2d image processing

Publications (1)

Publication Number Publication Date
SG10201402681QA true SG10201402681QA (en) 2015-12-30

Family

ID=54699387

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201402681QA SG10201402681QA (en) 2014-05-27 2014-05-27 Methods of inspecting a 3d object using 2d image processing

Country Status (6)

Country Link
US (1) US10151580B2 (en)
CN (1) CN105960569B (en)
MY (1) MY187569A (en)
SG (1) SG10201402681QA (en)
TW (1) TWI635252B (en)
WO (1) WO2015183196A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6330162B2 (en) * 2016-11-24 2018-05-30 株式会社新川 Bonding apparatus and method for detecting height of bonding object
CN110720135A (en) * 2017-06-08 2020-01-21 鲁道夫技术有限公司 Wafer inspection system including laser triangulation sensor
CN109387160A (en) * 2018-11-26 2019-02-26 中国科学院光电技术研究所 Profiling object surface measuring device and method under a kind of nuclear radiation environment
CN111618710B (en) * 2020-05-21 2021-07-23 武汉华星光电半导体显示技术有限公司 Mask repair equipment
TWI760813B (en) 2020-08-10 2022-04-11 國立臺灣科技大學 Earthquake monitoring system and earthquake monitoring method
CN112304249B (en) * 2020-09-22 2022-03-18 江苏大学 System and method for simultaneously detecting three-dimensional surface and thickness distribution of transparent material
CN112504126B (en) * 2020-12-14 2023-02-03 国科光芯(海宁)科技股份有限公司 Three-dimensional scanning distance measuring device and method
CN113063368A (en) * 2021-04-07 2021-07-02 杭州江奥光电科技有限公司 Linear laser rotary scanning three-dimensional profile measuring method and device
CN113375566B (en) * 2021-06-09 2023-09-08 江苏中科贯微自动化科技有限公司 Accurate measurement method and system for object size
CN113483692B (en) * 2021-06-23 2023-08-29 苏州中科全象智能科技有限公司 Hole detection optical system
CN113566735B (en) * 2021-07-24 2022-08-09 大连理工大学 Laser in-situ measurement method for rocket engine nozzle cooling channel line
CN117437364B (en) * 2023-12-20 2024-04-26 深圳大学 Method and device for extracting three-dimensional structure of building based on residual defect cloud data

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3503231A1 (en) 1985-01-31 1986-08-07 Helmut A. 6720 Speyer Kappner METHOD AND DEVICE FOR THE 3-D DETECTION OF SCENES BY MEANS OF THE OPTICAL 2-D SENSOR
US6931149B2 (en) * 2002-04-19 2005-08-16 Norsk Elektro Optikk A/S Pipeline internal inspection device and method
US7253908B2 (en) * 2004-07-22 2007-08-07 The Boeing Company Non-destructive inspection using laser profiling and associated method
JP2010054399A (en) * 2008-08-29 2010-03-11 Mori Seiki Co Ltd Noncontact measuring device and on-machine measuring system
US20110255097A1 (en) * 2010-03-18 2011-10-20 Gilad Golan Method and system for evaluating a height of structures
DE102010052338A1 (en) * 2010-11-25 2012-05-31 Steinert Elektromagnetbau Gmbh Method and device for single-grain sorting of bulk materials of any kind
CN102519391B (en) * 2011-12-28 2013-11-20 东南大学 Object surface three-dimensional image reconstruction method on basis of weak saturated two-dimensional images
CN103578133B (en) * 2012-08-03 2016-05-04 浙江大华技术股份有限公司 A kind of method and apparatus that two-dimensional image information is carried out to three-dimensional reconstruction
US9605950B2 (en) * 2013-05-22 2017-03-28 Cognex Corporation System and method for efficient surface measurement using a laser displacement sensor
CN103398660B (en) * 2013-08-05 2015-12-09 河北工业大学 For obtaining the structured light vision sensor parameter calibration method of weld bead height information
US9657936B2 (en) * 2013-08-22 2017-05-23 George Allen Carr, Jr. Systems and methods for illuminating an object

Also Published As

Publication number Publication date
CN105960569A (en) 2016-09-21
MY187569A (en) 2021-09-30
US20170254639A1 (en) 2017-09-07
US10151580B2 (en) 2018-12-11
TW201544788A (en) 2015-12-01
CN105960569B (en) 2019-03-12
WO2015183196A1 (en) 2015-12-03
TWI635252B (en) 2018-09-11

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