SG10201402096TA - Resist stripping compositions and methods for manufacturing electrical devices - Google Patents

Resist stripping compositions and methods for manufacturing electrical devices

Info

Publication number
SG10201402096TA
SG10201402096TA SG10201402096TA SG10201402096TA SG10201402096TA SG 10201402096T A SG10201402096T A SG 10201402096TA SG 10201402096T A SG10201402096T A SG 10201402096TA SG 10201402096T A SG10201402096T A SG 10201402096TA SG 10201402096T A SG10201402096T A SG 10201402096TA
Authority
SG
Singapore
Prior art keywords
methods
electrical devices
resist stripping
manufacturing electrical
stripping compositions
Prior art date
Application number
SG10201402096TA
Inventor
Andreas Klipp
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of SG10201402096TA publication Critical patent/SG10201402096TA/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/425Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/26Organic compounds containing nitrogen
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/26Organic compounds containing nitrogen
    • C11D3/30Amines; Substituted amines ; Quaternized amines
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/34Organic compounds containing sulfur
    • C11D3/3445Organic compounds containing sulfur containing sulfino groups, e.g. dimethyl sulfoxide
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02057Cleaning during device manufacture
    • H01L21/0206Cleaning during device manufacture during, before or after processing of insulating layers
    • H01L21/02063Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105After-treatment
    • H01L21/311Etching the insulating layers by chemical or physical means
    • H01L21/31127Etching organic layers
    • H01L21/31133Etching organic layers by chemical means
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10Objects to be cleaned
    • C11D2111/14Hard surfaces
    • C11D2111/22Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Detergent Compositions (AREA)
  • Weting (AREA)
SG10201402096TA 2009-05-07 2010-04-20 Resist stripping compositions and methods for manufacturing electrical devices SG10201402096TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17616509P 2009-05-07 2009-05-07

Publications (1)

Publication Number Publication Date
SG10201402096TA true SG10201402096TA (en) 2014-10-30

Family

ID=42244549

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201402096TA SG10201402096TA (en) 2009-05-07 2010-04-20 Resist stripping compositions and methods for manufacturing electrical devices
SG2011076452A SG175273A1 (en) 2009-05-07 2010-04-20 Resist stripping compositions and methods for manufacturing electrical devices

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2011076452A SG175273A1 (en) 2009-05-07 2010-04-20 Resist stripping compositions and methods for manufacturing electrical devices

Country Status (11)

Country Link
US (1) US9005367B2 (en)
EP (1) EP2427803B1 (en)
JP (1) JP5663562B2 (en)
KR (1) KR101778313B1 (en)
CN (1) CN102422228B (en)
IL (1) IL215806A (en)
MY (1) MY157093A (en)
RU (1) RU2011149551A (en)
SG (2) SG10201402096TA (en)
TW (1) TWI494711B (en)
WO (1) WO2010127942A1 (en)

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WO2013138278A1 (en) * 2012-03-12 2013-09-19 Advanced Technology Materials, Inc. Copper cleaning and protection formulations
US9223221B2 (en) * 2012-03-16 2015-12-29 Basf Se Photoresist stripping and cleaning composition, method of its preparation and its use
CN103995441B (en) * 2014-06-11 2019-05-31 深圳市华星光电技术有限公司 Photoresistive striping process and optical resistance-stripping device
WO2016028454A1 (en) 2014-08-18 2016-02-25 3M Innovative Properties Company Conductive layered structure and methods of making same
JP6329889B2 (en) * 2014-12-11 2018-05-23 信越化学工業株式会社 Cleaning liquid and coating film forming apparatus piping cleaning method
US9650594B2 (en) * 2015-01-22 2017-05-16 Dynaloy, Llc Solutions and processes for removing substances from substrates
KR20160104454A (en) 2015-02-26 2016-09-05 동우 화인켐 주식회사 Resist stripper composition and method of stripping resist using the same
US10072237B2 (en) * 2015-08-05 2018-09-11 Versum Materials Us, Llc Photoresist cleaning composition used in photolithography and a method for treating substrate therewith
US9741563B2 (en) * 2016-01-27 2017-08-22 Lam Research Corporation Hybrid stair-step etch
BR112018013322B1 (en) * 2016-05-10 2022-12-06 Atotech Deutschland Gmbh NON-AQUEOUS SEPARATION COMPOSITION, ITS USE AND SEPARATION PROCESS OF AN ORGANIC COATING FROM A SUBSTRATE
KR20180087624A (en) 2017-01-25 2018-08-02 동우 화인켐 주식회사 Resist stripper composition
KR102224907B1 (en) * 2018-04-17 2021-03-09 엘티씨 (주) Liquid stripper composition for dryfilm resist
US11180697B2 (en) 2018-11-19 2021-11-23 Versum Materials Us, Llc Etching solution having silicon oxide corrosion inhibitor and method of using the same
KR20200076778A (en) 2018-12-19 2020-06-30 삼성전자주식회사 Method of fabricating semiconductor package
WO2020136562A1 (en) * 2018-12-26 2020-07-02 3M Innovative Properties Company Removal of electroluminescenct materials from substrates
KR20220058094A (en) 2020-10-30 2022-05-09 주식회사 이엔에프테크놀로지 Photoresist stripper composition
KR20220150134A (en) * 2021-05-03 2022-11-10 삼성전자주식회사 Composition for removing photoresist and methods of manufacturing semiconductor device and semiconductor package
CN115216117B (en) * 2022-09-21 2022-12-16 深圳市板明科技股份有限公司 Modified hole plugging resin for circuit board and preparation method thereof

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Also Published As

Publication number Publication date
TW201100981A (en) 2011-01-01
US9005367B2 (en) 2015-04-14
CN102422228A (en) 2012-04-18
MY157093A (en) 2016-04-29
US20120040529A1 (en) 2012-02-16
EP2427803B1 (en) 2017-12-13
EP2427803A1 (en) 2012-03-14
IL215806A (en) 2017-08-31
RU2011149551A (en) 2013-06-20
TWI494711B (en) 2015-08-01
SG175273A1 (en) 2011-11-28
JP5663562B2 (en) 2015-02-04
CN102422228B (en) 2015-01-21
WO2010127942A1 (en) 2010-11-11
IL215806A0 (en) 2012-01-31
KR20120023068A (en) 2012-03-12
KR101778313B1 (en) 2017-09-13
JP2012526374A (en) 2012-10-25

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